Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/90—Masterslice integrated circuits
  • H10D84/998—Input and output buffer/driver structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
  • H01L2224/0555—Shape
  • H01L2224/05552—Shape in top view
  • H01L2224/05554—Shape in top view being square

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Semiconductor Integrated Circuits (AREA)
• Wire Bonding (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Applications Claiming Priority (1)

Publications (3)

Family

ID=25176862

Family Applications (1)

Country Status (8)

Families Citing this family (9)

Family Cites Families (7)

• 1985
  • 1985-11-20 US US06/799,825 patent/US4789889A/en not_active Expired - Lifetime
• 1986
  • 1986-10-23 CN CN86107224A patent/CN1007477B/zh not_active Expired
  • 1986-10-27 IT IT22150/86A patent/IT1197923B/it active
  • 1986-11-13 SE SE8604869A patent/SE504241C2/sv not_active IP Right Cessation
  • 1986-11-14 DE DE3639053A patent/DE3639053C2/de not_active Expired - Fee Related
  • 1986-11-18 GB GB8627557A patent/GB2183399B/en not_active Expired
  • 1986-11-19 KR KR1019860009774A patent/KR950010046B1/ko not_active Expired - Fee Related
  • 1986-11-19 JP JP61276391A patent/JPH0648715B2/ja not_active Expired - Fee Related

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