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IE801669L - Manufacture of printed circuits - Google Patents

Manufacture of printed circuits

Info

Publication number
IE801669L
IE801669L IE801669A IE166980A IE801669L IE 801669 L IE801669 L IE 801669L IE 801669 A IE801669 A IE 801669A IE 166980 A IE166980 A IE 166980A IE 801669 L IE801669 L IE 801669L
Authority
IE
Ireland
Prior art keywords
copper
conductors
pattern
printed
action
Prior art date
Application number
IE801669A
Other versions
IE49971B1 (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of IE801669L publication Critical patent/IE801669L/en
Publication of IE49971B1 publication Critical patent/IE49971B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

After boring or punching, copper- laminated substrate material is brushed, degreased, etched lightly, activated and reduced, and then printed, with an etch resist which covers the pattern desired for the printed conductors, the exposed copper lamination is etched away and then the etch resist is removed by means of a solvent to bare the conductors, at least the boreholes and soldering eyes of the pattern being then provided with a layer of copper by the action of a chemical copper bath. In one variant, the entire surface of the pattern of printed conductors is provided with amen a layer of copper by the action of the chemical copper bath. Objectives include improved through-connections and production of circuits having closely spaced and narrow conductors with optimal electrical characteristics. [GB2057774A]
IE1669/80A 1979-08-09 1980-08-08 Manufacture of printed circuits IE49971B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792932536 DE2932536A1 (en) 1979-08-09 1979-08-09 METHOD FOR PRODUCING PRINTED CIRCUITS

Publications (2)

Publication Number Publication Date
IE801669L true IE801669L (en) 1981-02-09
IE49971B1 IE49971B1 (en) 1986-01-22

Family

ID=6078196

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1669/80A IE49971B1 (en) 1979-08-09 1980-08-08 Manufacture of printed circuits

Country Status (10)

Country Link
JP (1) JPS5629395A (en)
CA (1) CA1152226A (en)
CH (1) CH647372A5 (en)
DE (1) DE2932536A1 (en)
FR (1) FR2463569B1 (en)
GB (1) GB2057774B (en)
IE (1) IE49971B1 (en)
IT (1) IT1131716B (en)
NL (1) NL8003939A (en)
SE (1) SE454476B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3275452D1 (en) * 1982-04-05 1987-03-19 Kanto Kasei Co Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
FI88241C (en) * 1990-10-30 1993-04-13 Nokia Mobile Phones Ltd FOERFARANDE FOER FRAMSTAELLNING AV KRETSKORT
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards
US5620612A (en) * 1995-08-22 1997-04-15 Macdermid, Incorporated Method for the manufacture of printed circuit boards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1378154A (en) * 1962-09-24 1964-11-13 North American Aviation Inc Electrical interconnections for printed circuit boards
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
DE1690224B1 (en) * 1967-08-29 1971-03-25 Standard Elek K Lorenz Ag BATHROOM FOR ELECTRONIC COPPER PLATING OF PLASTIC PANELS
FR2128355A1 (en) * 1971-03-01 1972-10-20 Fernseh Gmbh
JPS5489276A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of producing printed board

Also Published As

Publication number Publication date
CH647372A5 (en) 1985-01-15
GB2057774A (en) 1981-04-01
IT8023530A0 (en) 1980-07-18
NL8003939A (en) 1981-02-11
CA1152226A (en) 1983-08-16
IT1131716B (en) 1986-06-25
SE8005443L (en) 1981-02-10
GB2057774B (en) 1983-09-07
JPS5629395A (en) 1981-03-24
FR2463569B1 (en) 1985-09-20
IE49971B1 (en) 1986-01-22
FR2463569A1 (en) 1981-02-20
DE2932536A1 (en) 1981-02-26
SE454476B (en) 1988-05-02

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