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GB1455854A - Methods of manufacturing printed circuit boards - Google Patents

Methods of manufacturing printed circuit boards

Info

Publication number
GB1455854A
GB1455854A GB1675873A GB1675873A GB1455854A GB 1455854 A GB1455854 A GB 1455854A GB 1675873 A GB1675873 A GB 1675873A GB 1675873 A GB1675873 A GB 1675873A GB 1455854 A GB1455854 A GB 1455854A
Authority
GB
United Kingdom
Prior art keywords
copper
photoresist
exposed
tin
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1675873A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Priority to GB1675873A priority Critical patent/GB1455854A/en
Publication of GB1455854A publication Critical patent/GB1455854A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1455854 Printed circuits MARCONI CO Ltd 8 Feb 1974 [7 April 1973] 16758/73 Heading H1R In manufacture of a printed circuit board having plated through holes and relatively thick layers of conductive pattern material the substrate is coated with a thick layer of copper, drilled, and the surface and hole walls are provided with a further thin layer of copper. Dry film photoresist is applied, exposed and developed to define the required patterns, the exposed copper is deep etched out, and the photoresist is removed; after which the areas denuded of copper are metallized and a protective tin-lead coating is deposited over the entire surface. The required pattern is redefined with photoresist and the exposed tin-lead alloy is etched out. The photoresist is then removed to leave the copper defining the required pattern protected by solderable tin-lead alloy. The protective layer may alternatively be of tinnickel alloy. Where the initial coating is thin, the holes are drilled prior to coating, and their walls are coated in the deposition operation.
GB1675873A 1973-04-07 1973-04-07 Methods of manufacturing printed circuit boards Expired GB1455854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1675873A GB1455854A (en) 1973-04-07 1973-04-07 Methods of manufacturing printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1675873A GB1455854A (en) 1973-04-07 1973-04-07 Methods of manufacturing printed circuit boards

Publications (1)

Publication Number Publication Date
GB1455854A true GB1455854A (en) 1976-11-17

Family

ID=10083111

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1675873A Expired GB1455854A (en) 1973-04-07 1973-04-07 Methods of manufacturing printed circuit boards

Country Status (1)

Country Link
GB (1) GB1455854A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0027603A1 (en) * 1979-10-22 1981-04-29 Shipley Company Inc. Process for applying a photoresist, and photoresist solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0027603A1 (en) * 1979-10-22 1981-04-29 Shipley Company Inc. Process for applying a photoresist, and photoresist solution

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee