[go: up one dir, main page]

HK1148561A1 - Mould for galvanoplasty and method of fabricating the same - Google Patents

Mould for galvanoplasty and method of fabricating the same

Info

Publication number
HK1148561A1
HK1148561A1 HK11102558A HK11102558A HK1148561A1 HK 1148561 A1 HK1148561 A1 HK 1148561A1 HK 11102558 A HK11102558 A HK 11102558A HK 11102558 A HK11102558 A HK 11102558A HK 1148561 A1 HK1148561 A1 HK 1148561A1
Authority
HK
Hong Kong
Prior art keywords
layer
upper layer
intermediate layer
etching
mold
Prior art date
Application number
HK11102558A
Other languages
English (en)
Inventor
Pierre Cusin
Clare Golfier
Thiebaud Jean-Philippe
Original Assignee
Nivarox Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nivarox Sa filed Critical Nivarox Sa
Publication of HK1148561A1 publication Critical patent/HK1148561A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/009—Manufacturing the stamps or the moulds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/035—Microgears

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • ing And Chemical Polishing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
HK11102558A 2009-03-13 2011-03-14 Mould for galvanoplasty and method of fabricating the same HK1148561A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20090155125 EP2230207A1 (fr) 2009-03-13 2009-03-13 Moule pour galvanoplastie et son procédé de fabrication

Publications (1)

Publication Number Publication Date
HK1148561A1 true HK1148561A1 (en) 2011-09-09

Family

ID=41047360

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11102558A HK1148561A1 (en) 2009-03-13 2011-03-14 Mould for galvanoplasty and method of fabricating the same

Country Status (8)

Country Link
US (2) US8512539B2 (xx)
EP (2) EP2230207A1 (xx)
JP (1) JP5443220B2 (xx)
KR (1) KR20100103434A (xx)
CN (1) CN101831672B (xx)
HK (1) HK1148561A1 (xx)
RU (1) RU2526108C2 (xx)
TW (1) TWI598206B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230206B1 (fr) * 2009-03-13 2013-07-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
EP2263971A1 (fr) * 2009-06-09 2010-12-22 Nivarox-FAR S.A. Pièce de micromécanique composite et son procédé de fabrication
JP5773624B2 (ja) 2010-01-08 2015-09-02 キヤノン株式会社 微細構造体の製造方法
EP2655700A1 (en) * 2010-12-23 2013-10-30 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode and a method for providing such ecpr master electrode
CN102167282A (zh) * 2011-04-07 2011-08-31 天津海鸥表业集团有限公司 一种硅与金属复合材料的微结构加工方法
KR101351221B1 (ko) * 2011-09-21 2014-01-14 한국전력공사 테이프 캐스팅을 이용한 지지체식 코팅막의 제조방법
KR20140092914A (ko) * 2011-11-15 2014-07-24 가부시키가이샤 리프 다단 전사 금형의 제조 방법, 다단 전사 금형, 및 그것에 의한 부품
EP2767869A1 (fr) * 2013-02-13 2014-08-20 Nivarox-FAR S.A. Procédé de fabrication d'une pièce de micromécanique monobloc comportant au moins deux niveaux distincts
CH708827A2 (fr) * 2013-11-08 2015-05-15 Nivarox Sa Pièce de micromécanique creuse, à plusieurs niveaux fonctionnels et monobloc en un matériau à base d'un allotrope synthétique du carbone.
CN105402363B (zh) * 2014-09-09 2019-07-23 精工电子有限公司 机械部件、机芯、钟表以及机械部件的制造方法
EP3109199B1 (fr) * 2015-06-25 2022-05-11 Nivarox-FAR S.A. Piece a base de silicium avec au moins un chanfrein et son procede de fabrication
CN105729683B (zh) * 2016-03-18 2017-12-01 宁波双林模具有限公司 一种注塑模具型腔精密仿真皮纹型面的制作方法
EP3467151B1 (fr) * 2017-10-06 2020-06-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
JP7317637B2 (ja) * 2019-08-30 2023-07-31 シチズンファインデバイス株式会社 電鋳金型製造方法
EP3839624B1 (fr) * 2019-12-18 2023-09-13 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142001A1 (de) * 1991-12-19 1993-06-24 Microparts Gmbh Verfahren zum herstellen gestufter formeinsaetze, gestufte formeinsaetze und damit abgeformte mikrostrukturkoerper
DE4001399C1 (en) * 1990-01-19 1991-07-25 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De Metallic microstructures - formed on substrates, by putting poly:methyl methacrylate] between moulding tool and silicon substrate
US5529681A (en) * 1993-03-30 1996-06-25 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh Stepped mould inserts, high-precision stepped microstructure bodies, and methods of producing the same
US5944974A (en) * 1995-07-01 1999-08-31 Fahrenberg; Jens Process for manufacturing mold inserts
US6214245B1 (en) * 1999-03-02 2001-04-10 Eastman Kodak Company Forming-ink jet nozzle plate layer on a base
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP3990307B2 (ja) * 2003-03-24 2007-10-10 株式会社クラレ 樹脂成形品の製造方法、金属構造体の製造方法、チップ
CN100548692C (zh) * 2003-10-10 2009-10-14 富士胶卷迪马蒂克斯股份有限公司 具有薄膜的打印头
RU2254403C1 (ru) * 2004-02-02 2005-06-20 Российская Федерация, от имени которой выступает Министерство Российской Федерации по атомной энергии Гальванопластический способ изготовления сложнорельефных деталей со щелевой структурой
JP4469194B2 (ja) 2004-03-12 2010-05-26 セイコーインスツル株式会社 電鋳用型、電鋳方法、及びその電鋳用型の製造方法
JP4550569B2 (ja) * 2004-12-20 2010-09-22 セイコーインスツル株式会社 電鋳型とその製造方法
JP4840756B2 (ja) * 2005-01-14 2011-12-21 セイコーインスツル株式会社 電鋳型とその製造方法及び電鋳部品の製造方法
JP4834426B2 (ja) * 2006-03-06 2011-12-14 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US7448277B2 (en) * 2006-08-31 2008-11-11 Evigia Systems, Inc. Capacitive pressure sensor and method therefor
JP5144127B2 (ja) * 2007-05-23 2013-02-13 キヤノン株式会社 ナノインプリント用のモールドの製造方法
EP2060534A1 (fr) * 2007-11-16 2009-05-20 Nivarox-FAR S.A. Pièce de micromécanique composite silicium - métal et son procédé de fabrication
US8197029B2 (en) * 2008-12-30 2012-06-12 Fujifilm Corporation Forming nozzles
EP2230206B1 (fr) * 2009-03-13 2013-07-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication

Also Published As

Publication number Publication date
US20130213800A1 (en) 2013-08-22
EP2230208A1 (fr) 2010-09-22
KR20100103434A (ko) 2010-09-27
RU2526108C2 (ru) 2014-08-20
JP2010216014A (ja) 2010-09-30
EP2230208B1 (fr) 2014-01-08
US20100236934A1 (en) 2010-09-23
RU2010109438A (ru) 2011-09-20
CN101831672A (zh) 2010-09-15
JP5443220B2 (ja) 2014-03-19
US9139925B2 (en) 2015-09-22
US8512539B2 (en) 2013-08-20
CN101831672B (zh) 2013-01-16
TW201100224A (en) 2011-01-01
TWI598206B (zh) 2017-09-11
EP2230207A1 (fr) 2010-09-22

Similar Documents

Publication Publication Date Title
HK1148561A1 (en) Mould for galvanoplasty and method of fabricating the same
HK1144190A1 (en) Silicon-metal composite micromechanical part and method for producing same
WO2009041551A1 (ja) マスクブランク、及びインプリント用モールドの製造方法
WO2002064496A3 (en) Method for forming microelectronic spring structures on a substrate
SG169930A1 (en) Semiconductor device and method of forming integrated passive device
JP2009164481A5 (xx)
WO2009003542A3 (de) Verfahren zur herstellung von leiterbahnbrücken und bauteil mit leitfähiger schicht
WO2011160985A3 (en) Micro-electro-mechanical system
RU2010123368A (ru) Композиционный микромеханический компонент и способ его изготовления
JP2012096329A5 (xx)
TW200705537A (en) Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device
WO2013061204A3 (en) Pre-collapsed capacitive micro-machined transducer cell with plug
WO2009050209A3 (en) Manufacturing a mems element having cantilever and cavity on a substrate
WO2011157883A8 (en) Method for manufacturing an autocompensating antenna structure by etching
RU2010109439A (ru) Форма для гальванопластики и способы ее изготовления
WO2007126956A3 (en) Damascene interconnection having porous low k layer with improved mechanical properties
JP2011525437A5 (xx)
SG155835A1 (en) Method of forming electrical interconnects within insulating layers that form consecutive sidewalls
WO2011043580A3 (ko) 플라스틱 전극필름 제조방법
TW200638826A (en) Circuit board structure and fabricating method thereof
MY146154A (en) Radio frequency mems switch
FR2965659B1 (fr) Procédé de fabrication d'un circuit intégré
TW200605143A (en) Molding material transfer method and substrate structure
WO2011082857A3 (de) Herstellung eines bauelements
CN203206467U (zh) 一种可防水汽的电容式微型麦克风