HK1064713A1 - Copper electrolytic solution and electrolytic copper foil produced using the same - Google Patents

Copper electrolytic solution and electrolytic copper foil produced using the same

Info

Publication number: HK1064713A1
Authority: HK; Hong Kong
Prior art keywords: electrolytic; copper; same; foil produced; copper foil
Prior art date: 2002-07-23

Application number

HK04107322A

Other languages

English (en)

Inventor

Masashi Kumagai

Mikio Hanafusa

Original Assignee

Nippon Mining Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-23

Filing date

2004-09-23

Publication date

2005-02-04

2004-09-23 Application filed by Nippon Mining Co filed Critical Nippon Mining Co

2005-02-04 Publication of HK1064713A1 publication Critical patent/HK1064713A1/xx

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Laminated Bodies (AREA)

HK04107322A 2002-07-23 2004-09-23 Copper electrolytic solution and electrolytic copper foil produced using the same HK1064713A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2002213889		2002-07-23
JP2002291403A JP3789107B2 (ja)	2002-07-23	2002-10-03	特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
PCT/JP2003/006363 WO2004009876A1 (ja)	2002-07-23	2003-05-21	特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔

Publications (1)

Publication Number	Publication Date
HK1064713A1 true HK1064713A1 (en)	2005-02-04

Family

ID=30772236

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK04107322A HK1064713A1 (en)	2002-07-23	2004-09-23	Copper electrolytic solution and electrolytic copper foil produced using the same

Country Status (10)

Country	Link
US (3)	US7005055B2 (xx)
EP (1)	EP1524335B8 (xx)
JP (1)	JP3789107B2 (xx)
KR (1)	KR100588176B1 (xx)
CN (1)	CN1293235C (xx)
ES (1)	ES2497090T3 (xx)
HK (1)	HK1064713A1 (xx)
MY (1)	MY146397A (xx)
TW (1)	TWI250225B (xx)
WO (1)	WO2004009876A1 (xx)

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US7824534B2 (en)	2005-01-25	2010-11-02	Nippon Mining & Metals Co., Ltd.	Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
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KR20070044774A (ko) *	2005-10-25	2007-04-30	미쓰이 긴조꾸 고교 가부시키가이샤	2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법
JP2007146289A (ja) *	2005-10-31	2007-06-14	Mitsui Mining & Smelting Co Ltd	電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
KR100723391B1 (ko) *	2006-01-13	2007-05-30	삼성에스디아이 주식회사	고분자 전해질막 및 이를 구비한 연료전지
TWI414638B (zh) *	2006-06-07	2013-11-11	Furukawa Electric Co Ltd	A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
US20080142249A1 (en) *	2006-12-13	2008-06-19	International Business Machines Corporation	Selective surface roughness for high speed signaling
US7872297B2 (en) *	2007-04-17	2011-01-18	Snu R&Db Foundation	Flash memory device and fabricating method thereof comprising a body recess region
WO2010061737A1 (ja) *	2008-11-25	2010-06-03	日鉱金属株式会社	銅箔又は銅張り積層板の巻取り方法
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JP4999126B2 (ja) *	2010-06-15	2012-08-15	古河電気工業株式会社	回路部品
JP5352542B2 (ja)	2010-07-15	2013-11-27	エルエスエムトロンリミテッド	リチウム二次電池の集電体用銅箔
JP5312412B2 (ja)	2010-08-06	2013-10-09	三洋電機株式会社	コンテンツ再生装置
CN103210124B (zh) *	2010-11-15	2016-01-06	吉坤日矿日石金属株式会社	电解铜箔
JPWO2012121020A1 (ja) *	2011-03-04	2014-07-17	Jx日鉱日石金属株式会社	強度が高く、異常電着による突起形状が少ない電解銅箔及びその製造方法
JP5822928B2 (ja)	2011-07-13	2015-11-25	Jx日鉱日石金属株式会社	強度が高く、かつ反りの少ない電解銅箔及びその製造方法
WO2014033917A1 (ja) *	2012-08-31	2014-03-06	Jx日鉱日石金属株式会社	電解銅箔及びその製造方法
JP6640567B2 (ja)	2015-01-16	2020-02-05	Ｊｘ金属株式会社	キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
JP6346244B2 (ja) *	2015-11-10	2018-06-20	Ｊｘ金属株式会社	電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
KR102377286B1 (ko)	2017-03-23	2022-03-21	에스케이넥실리스 주식회사	리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
TW201900939A (zh) *	2017-05-09	2019-01-01	日商Ｊｘ金屬股份有限公司	電解銅箔、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法
WO2018207785A1 (ja) *	2017-05-09	2018-11-15	Ｊｘ金属株式会社	電解銅箔及びその製造方法、銅張積層板、プリント配線板及びその製造方法、並びに電子機器及びその製造方法
KR20190131579A (ko) *	2017-05-09	2019-11-26	제이엑스금속주식회사	전해 구리박 및 그 제조 방법, 동장 적층판, 프린트 배선판 및 그 제조 방법, 그리고 전자 기기 및 그 제조 방법

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2002
- 2002-10-03 JP JP2002291403A patent/JP3789107B2/ja not_active Expired - Lifetime
2003
- 2003-05-21 KR KR1020037016792A patent/KR100588176B1/ko active IP Right Grant
- 2003-05-21 WO PCT/JP2003/006363 patent/WO2004009876A1/ja active Application Filing
- 2003-05-21 CN CNB038005557A patent/CN1293235C/zh not_active Expired - Lifetime
- 2003-05-21 US US10/479,896 patent/US7005055B2/en not_active Expired - Lifetime
- 2003-05-21 ES ES03730553.9T patent/ES2497090T3/es not_active Expired - Lifetime
- 2003-05-21 EP EP03730553.9A patent/EP1524335B8/en not_active Expired - Lifetime
- 2003-07-04 TW TW092118287A patent/TWI250225B/zh not_active IP Right Cessation
- 2003-07-10 MY MYPI20032589A patent/MY146397A/en unknown
2004
- 2004-09-23 HK HK04107322A patent/HK1064713A1/xx not_active IP Right Cessation
2005
- 2005-07-22 US US11/187,282 patent/US7378160B2/en not_active Expired - Lifetime
2007
- 2007-10-03 US US11/906,663 patent/US8449751B2/en active Active

Also Published As

Publication number	Publication date
US20080073219A1 (en)	2008-03-27
US8449751B2 (en)	2013-05-28
EP1524335B1 (en)	2014-06-04
KR100588176B1 (ko)	2006-06-08
EP1524335A1 (en)	2005-04-20
JP3789107B2 (ja)	2006-06-21
CN1522316A (zh)	2004-08-18
ES2497090T3 (es)	2014-09-22
US7378160B2 (en)	2008-05-27
US20050252778A1 (en)	2005-11-17
EP1524335A4 (en)	2006-03-29
US20040149583A1 (en)	2004-08-05
TW200402482A (en)	2004-02-16
CN1293235C (zh)	2007-01-03
WO2004009876A1 (ja)	2004-01-29
US7005055B2 (en)	2006-02-28
TWI250225B (en)	2006-03-01
JP2004107786A (ja)	2004-04-08
MY146397A (en)	2012-08-15
EP1524335B8 (en)	2014-11-19
KR20040028792A (ko)	2004-04-03

Publication	Publication Date	Title
HK1064713A1 (en)	2005-02-04	Copper electrolytic solution and electrolytic copper foil produced using the same
HK1084159A1 (en)	2006-07-21	Copper electrolytic solution and electrolytic copper foil produced therewith
EP1221498A4 (en)	2003-07-30	ELECTROLYSIS DEVICE FOR THE PRODUCTION OF COPPER FILM AND CORRESPONDLY PRODUCED COPPER FILM
AU2003238635A8 (en)	2004-02-02	Inverter
AU2003265826A8 (en)	2004-03-29	Electrolyte
GB2392460B (en)	2006-02-08	Delayed-gelation solution
AU2003290809A8 (en)	2004-06-15	Flip-flop circuit
AU2003259049A8 (en)	2004-03-03	Electrolytic copper plating solutions
GB0224133D0 (en)	2002-11-27	Electric circuit
EP1482524A4 (en)	2008-08-27	ELECTRONIC COMPONENT OF LAMINATE TYPE
AU2003262851A8 (en)	2004-04-30	Low harmonic rectifier circuit
SG112868A1 (en)	2005-07-28	Electric circuit
HK1042325A1 (zh)	2002-08-09	附有載體箔的電解銅箔及其製作方法和使用該電解銅箔的敷銅層壓板
HK1068655A1 (en)	2005-04-29	Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same
TWI316260B (en)	2009-10-21	Electrolytic condenser
PL368584A1 (en)	2005-04-04	Counterfeit-proof metallic foil
AU2003280836A8 (en)	2004-06-15	Solid electrolytic capacitor
TWI318650B (en)	2009-12-21	Electrolytic silver-plating solution
GB2407253B (en)	2006-03-08	Cabinets
TWI319586B (en)	2010-01-11	Electrolytic condenser
GB2387804B (en)	2005-06-29	Component structure
GB0225981D0 (en)	2002-12-11	Electronic de-scalers
GB0213461D0 (en)	2002-07-24	Baths
PT1493174E (pt)	2014-07-24	Unidade de cátodo homogénea
GB0318333D0 (en)	2003-09-10	Laminate

Legal Events

Date	Code	Title	Description
2023-06-02	PE	Patent expired	Effective date: 20230520