HK1040322A1 - 在大面積平面顯示器的通道板上敷設作為電極的金屬導電條的方法 - Google Patents
在大面積平面顯示器的通道板上敷設作為電極的金屬導電條的方法Info
- Publication number
- HK1040322A1 HK1040322A1 HK02102029.9A HK02102029A HK1040322A1 HK 1040322 A1 HK1040322 A1 HK 1040322A1 HK 02102029 A HK02102029 A HK 02102029A HK 1040322 A1 HK1040322 A1 HK 1040322A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- ultrawide
- electrodes
- channel plate
- printed conductors
- flat screens
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
- H01J11/26—Address electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49207—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19841900A DE19841900A1 (de) | 1998-09-11 | 1998-09-11 | Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme |
PCT/EP1999/005615 WO2000016366A2 (de) | 1998-09-11 | 1999-08-03 | Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte für grossflächige flachbildschirme |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1040322A1 true HK1040322A1 (zh) | 2002-05-31 |
Family
ID=7880821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02102029.9A HK1040322A1 (zh) | 1998-09-11 | 2002-03-15 | 在大面積平面顯示器的通道板上敷設作為電極的金屬導電條的方法 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1112586A2 (de) |
JP (1) | JP2002525797A (de) |
KR (1) | KR20010090726A (de) |
CN (1) | CN1319245A (de) |
CA (1) | CA2343386A1 (de) |
DE (1) | DE19841900A1 (de) |
HK (1) | HK1040322A1 (de) |
TW (1) | TW442817B (de) |
WO (1) | WO2000016366A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10011455B4 (de) * | 2000-03-10 | 2005-12-08 | Schott Ag | Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme |
DE10026976C2 (de) * | 2000-05-31 | 2002-08-01 | Schott Glas | Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung |
DE10026974A1 (de) * | 2000-05-31 | 2002-01-03 | Schott Glas | Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung |
JP3960064B2 (ja) * | 2002-02-05 | 2007-08-15 | 松下電器産業株式会社 | プラズマディスプレイパネルの製造方法 |
CN100477057C (zh) * | 2004-11-19 | 2009-04-08 | 中华映管股份有限公司 | 等离子显示器之寻址电极与导电结构的形成方法 |
CN101489356B (zh) * | 2008-01-16 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
CN102522292B (zh) * | 2011-12-31 | 2015-07-15 | 四川虹欧显示器件有限公司 | 等离子显示屏中显示电极及其制备方法 |
CN102496547A (zh) * | 2011-12-31 | 2012-06-13 | 四川虹欧显示器件有限公司 | 等离子显示屏中寻址电极及其制备方法 |
CN102522293B (zh) * | 2011-12-31 | 2015-06-17 | 四川虹欧显示器件有限公司 | 等离子显示屏中寻址电极及其制备方法 |
CN103384452A (zh) * | 2012-05-02 | 2013-11-06 | 力达通讯股份有限公司 | 线路图案的制造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53112056A (en) * | 1977-03-11 | 1978-09-30 | Fujitsu Ltd | Gas discharging panel of self shift type |
DE3132452A1 (de) * | 1981-08-17 | 1983-02-24 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen einer nach dem galvanischen aufbau von metallischen strukturen planaren strukturebene |
NL8105922A (nl) * | 1981-12-31 | 1983-07-18 | Philips Nv | Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen. |
JPS60221928A (ja) * | 1984-04-19 | 1985-11-06 | Sony Corp | 放電表示装置の製造方法 |
US4686114A (en) * | 1986-01-17 | 1987-08-11 | Halliwell Michael J | Selective electroless plating |
JP2962776B2 (ja) * | 1989-08-31 | 1999-10-12 | 大日本印刷株式会社 | 導電性パターン形成用組成物及び導電性パターン形成方法 |
US5137618A (en) * | 1991-06-07 | 1992-08-11 | Foster Miller, Inc. | Methods for manufacture of multilayer circuit boards |
DE4125863A1 (de) * | 1991-08-03 | 1993-02-04 | Lpkf Cad Cam Systeme Gmbh | Verfahren zum aufbringen von strukturierten metallschichten auf glassubstraten |
DE4330961C1 (de) * | 1993-09-09 | 1994-07-28 | Krone Ag | Verfahren zur Herstellung von strukturierten Metallisierungen auf Oberflächen |
BE1007610A3 (nl) * | 1993-10-11 | 1995-08-22 | Philips Electronics Nv | Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat. |
DE59503175D1 (de) * | 1994-04-25 | 1998-09-17 | Siemens Nv | Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen |
DE4438799A1 (de) * | 1994-10-18 | 1996-04-25 | Atotech Deutschland Gmbh | Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen |
JPH08222128A (ja) * | 1995-02-14 | 1996-08-30 | Fujitsu Ltd | 表示パネルの電極形成方法 |
US5804920A (en) * | 1996-01-19 | 1998-09-08 | Philips Electronics North America Corporation | Plasma addressed liquid crystal display with etched glass spacers |
DE69738794D1 (de) * | 1996-02-08 | 2008-08-14 | Canon Kk | Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes und Verfahren zur Überprüfung der Herstellung |
-
1998
- 1998-09-11 DE DE19841900A patent/DE19841900A1/de not_active Withdrawn
-
1999
- 1999-08-03 CN CN99810719A patent/CN1319245A/zh active Pending
- 1999-08-03 CA CA002343386A patent/CA2343386A1/en not_active Abandoned
- 1999-08-03 EP EP99939446A patent/EP1112586A2/de not_active Withdrawn
- 1999-08-03 JP JP2000570808A patent/JP2002525797A/ja active Pending
- 1999-08-03 WO PCT/EP1999/005615 patent/WO2000016366A2/de not_active Application Discontinuation
- 1999-08-03 KR KR1020017003105A patent/KR20010090726A/ko not_active Application Discontinuation
- 1999-09-10 TW TW088115651A patent/TW442817B/zh active
-
2002
- 2002-03-15 HK HK02102029.9A patent/HK1040322A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW442817B (en) | 2001-06-23 |
KR20010090726A (ko) | 2001-10-19 |
CA2343386A1 (en) | 2000-03-23 |
EP1112586A2 (de) | 2001-07-04 |
CN1319245A (zh) | 2001-10-24 |
JP2002525797A (ja) | 2002-08-13 |
WO2000016366A2 (de) | 2000-03-23 |
WO2000016366A3 (de) | 2000-07-13 |
DE19841900A1 (de) | 2000-03-30 |
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