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GB9218898D0 - Semiconductor memory devices - Google Patents

Semiconductor memory devices

Info

Publication number
GB9218898D0
GB9218898D0 GB929218898A GB9218898A GB9218898D0 GB 9218898 D0 GB9218898 D0 GB 9218898D0 GB 929218898 A GB929218898 A GB 929218898A GB 9218898 A GB9218898 A GB 9218898A GB 9218898 D0 GB9218898 D0 GB 9218898D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor memory
memory devices
devices
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB929218898A
Other versions
GB2259406B (en
GB2259406A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to GB9514098A priority Critical patent/GB2290908B/en
Priority to GB9521898A priority patent/GB2293691B/en
Publication of GB9218898D0 publication Critical patent/GB9218898D0/en
Publication of GB2259406A publication Critical patent/GB2259406A/en
Application granted granted Critical
Publication of GB2259406B publication Critical patent/GB2259406B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/033Making the capacitor or connections thereto the capacitor extending over the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/712Electrodes having non-planar surfaces, e.g. formed by texturisation being rough surfaces, e.g. using hemispherical grains
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/714Electrodes having non-planar surfaces, e.g. formed by texturisation having horizontal extensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB9218898A 1991-09-07 1992-09-07 Semiconductor memory devices Expired - Fee Related GB2259406B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9514098A GB2290908B (en) 1991-09-07 1992-09-07 Semiconductor memory device
GB9521898A GB2293691B (en) 1991-09-07 1992-09-07 Semiconductor memory devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR910015626 1991-09-07
KR920005409 1992-03-31

Publications (3)

Publication Number Publication Date
GB9218898D0 true GB9218898D0 (en) 1992-10-21
GB2259406A GB2259406A (en) 1993-03-10
GB2259406B GB2259406B (en) 1996-05-01

Family

ID=26628732

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9218898A Expired - Fee Related GB2259406B (en) 1991-09-07 1992-09-07 Semiconductor memory devices

Country Status (6)

Country Link
JP (1) JP2690434B2 (en)
DE (1) DE4229837C2 (en)
FR (1) FR2681178A1 (en)
GB (1) GB2259406B (en)
IT (1) IT1256130B (en)
TW (1) TW222710B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960002097B1 (en) * 1992-02-28 1996-02-10 삼성전자주식회사 Method of making a capacitor for a semiconductor device
US5254503A (en) * 1992-06-02 1993-10-19 International Business Machines Corporation Process of making and using micro mask
JPH0774268A (en) * 1993-07-07 1995-03-17 Mitsubishi Electric Corp Semiconductor memory and fabrication thereof
US5383088A (en) * 1993-08-09 1995-01-17 International Business Machines Corporation Storage capacitor with a conducting oxide electrode for metal-oxide dielectrics
US5512768A (en) * 1994-03-18 1996-04-30 United Microelectronics Corporation Capacitor for use in DRAM cell using surface oxidized silicon nodules
US5869368A (en) * 1997-09-22 1999-02-09 Yew; Tri-Rung Method to increase capacitance
KR100675275B1 (en) 2004-12-16 2007-01-26 삼성전자주식회사 Semiconductor Device and Pad Arrangement Method
TWI295822B (en) 2006-03-29 2008-04-11 Advanced Semiconductor Eng Method for forming a passivation layer
FR2988712B1 (en) 2012-04-02 2014-04-11 St Microelectronics Rousset INTEGRATED CIRCUIT EQUIPPED WITH A DEVICE FOR DETECTING ITS SPACE ORIENTATION AND / OR CHANGE OF THIS ORIENTATION.
FR2998417A1 (en) * 2012-11-16 2014-05-23 St Microelectronics Rousset METHOD FOR PRODUCING AN INTEGRATED CIRCUIT POINT ELEMENT, AND CORRESPONDING INTEGRATED CIRCUIT
US11825645B2 (en) 2020-06-04 2023-11-21 Etron Technology, Inc. Memory cell structure
JP7339319B2 (en) * 2021-12-03 2023-09-05 ▲ゆ▼創科技股▲ふん▼有限公司 memory cell structure

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63240057A (en) * 1987-03-27 1988-10-05 Fujitsu Ltd stack type capacitor
JPH01282855A (en) * 1988-05-09 1989-11-14 Mitsubishi Electric Corp How to form a capacitor on a semiconductor substrate
JPH03165552A (en) * 1989-11-24 1991-07-17 Sony Corp Stacked capacitor type dram and manufacture thereof
JPH03166730A (en) * 1989-11-27 1991-07-18 Seiko Instr Inc Manufacture of semiconductor device
DD299990A5 (en) * 1990-02-23 1992-05-14 Dresden Forschzentr Mikroelek One-transistor memory cell arrangement and method for its production
US5049517A (en) * 1990-11-07 1991-09-17 Micron Technology, Inc. Method for formation of a stacked capacitor
US5037773A (en) * 1990-11-08 1991-08-06 Micron Technology, Inc. Stacked capacitor doping technique making use of rugged polysilicon
KR930009583B1 (en) * 1990-11-29 1993-10-07 삼성전자 주식회사 Manufacturing Method of Semiconductor Memory Device with Villi-shaped Capacitor Structure
JPH04207066A (en) * 1990-11-30 1992-07-29 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
KR930009593B1 (en) * 1991-01-30 1993-10-07 삼성전자 주식회사 Highly Integrated Semiconductor Memory Device and Manufacturing Method (HCC Cell)
KR940005288B1 (en) * 1991-07-11 1994-06-15 금성일렉트론 주식회사 Manufacturing Method of Semiconductor Device

Also Published As

Publication number Publication date
IT1256130B (en) 1995-11-29
ITMI922067A1 (en) 1994-03-04
GB2259406B (en) 1996-05-01
FR2681178B1 (en) 1997-02-07
DE4229837A1 (en) 1993-03-11
JP2690434B2 (en) 1997-12-10
DE4229837C2 (en) 1996-07-11
ITMI922067A0 (en) 1992-09-04
JPH05198745A (en) 1993-08-06
GB2259406A (en) 1993-03-10
TW222710B (en) 1994-04-21
FR2681178A1 (en) 1993-03-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090907