GB1452563A - Additive process for the production of printed circuit boards - Google Patents
Additive process for the production of printed circuit boardsInfo
- Publication number
- GB1452563A GB1452563A GB4924774A GB4924774A GB1452563A GB 1452563 A GB1452563 A GB 1452563A GB 4924774 A GB4924774 A GB 4924774A GB 4924774 A GB4924774 A GB 4924774A GB 1452563 A GB1452563 A GB 1452563A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ammonium
- subsequent
- printed circuit
- nov
- atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
1452563 Surface treatment of epoxy resins ORION RADIO ES VILLAMOSSAGI VALLALAT 14 Nov 1974 [15 Nov 1973] 49247/74 Heading C3B [Also in Divisions C7 and H1] A printed circuit is produced additively on a glass reinforced epoxy substrate by cutting the latter to size, boring any necessary through holes, and pretreatment in a bath containing compounds having atoms with non bound electron pairs two of which atoms are in a common molecule, e.g. one or more of ammonium hydrate, ammonium rhodamide, urea, thiourea, mercaptoethanol, thiazole, amino acids such as cysteine, serine, thioglycollic acid; all with a pH 10 ammonium buffer and an additive, e.g. an alcohol facilitating solution in water, which break up the cross-linkages of the epoxy resin, so that a subsequent chromic acid etch discontinuously attacks the surface into a network of inner holes facilitating subsequent retention of metal. After the etch the surfaces are sensitized in an aqueous solution of palladium and stannic chlorides, and covered by a protective layer defining the circuit; so that the latter is formed by selective electroless deposition of copper, washing, and subsequent electrolytic strengthening and solder coating.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HUOI000165 HU168090B (en) | 1973-11-15 | 1973-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1452563A true GB1452563A (en) | 1976-10-13 |
Family
ID=11000251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4924774A Expired GB1452563A (en) | 1973-11-15 | 1974-11-14 | Additive process for the production of printed circuit boards |
Country Status (6)
| Country | Link |
|---|---|
| DD (1) | DD115159A5 (en) |
| DE (1) | DE2452888B2 (en) |
| FR (1) | FR2251983A1 (en) |
| GB (1) | GB1452563A (en) |
| HU (1) | HU168090B (en) |
| NL (1) | NL7414957A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3021896A1 (en) * | 1980-06-06 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | METHOD FOR PRODUCING PRINTED CIRCUITS |
| FR2498873A1 (en) * | 1981-01-23 | 1982-07-30 | Sev Alternateurs | Printed circuit mfr. using thick film track - subsequently thickened by chemical-and electro-deposition |
| CN109327974A (en) * | 2018-11-06 | 2019-02-12 | 江苏博敏电子有限公司 | Ultralow copper tooth copper foil promotes peel strength laminates method |
-
1973
- 1973-11-15 HU HUOI000165 patent/HU168090B/hu unknown
-
1974
- 1974-11-06 DD DD18219774A patent/DD115159A5/xx unknown
- 1974-11-07 DE DE19742452888 patent/DE2452888B2/en active Pending
- 1974-11-14 FR FR7437558A patent/FR2251983A1/fr not_active Withdrawn
- 1974-11-14 GB GB4924774A patent/GB1452563A/en not_active Expired
- 1974-11-15 NL NL7414957A patent/NL7414957A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DD115159A5 (en) | 1975-09-12 |
| DE2452888B2 (en) | 1976-11-04 |
| FR2251983A1 (en) | 1975-06-13 |
| HU168090B (en) | 1976-02-28 |
| NL7414957A (en) | 1975-05-20 |
| DE2452888A1 (en) | 1975-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |