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GB1419613A - Cyanidefree electroplating baths - Google Patents

Cyanidefree electroplating baths

Info

Publication number
GB1419613A
GB1419613A GB2618974A GB2618974A GB1419613A GB 1419613 A GB1419613 A GB 1419613A GB 2618974 A GB2618974 A GB 2618974A GB 2618974 A GB2618974 A GB 2618974A GB 1419613 A GB1419613 A GB 1419613A
Authority
GB
United Kingdom
Prior art keywords
acid
metal
examples
salts
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2618974A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Priority to GB2618974A priority Critical patent/GB1419613A/en
Publication of GB1419613A publication Critical patent/GB1419613A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1419613 Electro-depositing metal LEARONAL Inc 13 June 1974 26189/74 Heading C7B Bright metal or alloy, e.g. Fe, Co, Ni, Zn, Ag, Cu, Cd, Sn, Cu - Ni, Cu - Zn or yellow or white brass, is electro-deposited from a cyanide-free aqueous solution containing a metal chelate formed of a water-soluble phosphonate chelating agent combined with ions of the metal(s) to be electrodeposited and an oxidizing agent, preferably 0.01 to 5 g/l, selected from peroxides (including organic peracids and salts of inorganic peracids that possess -0-0), chlorites, perchlorates, hypochlorites, potassium periodate, permanganates and sulphoxides. Examples of oxidizing agent are (chloro) perbenzoic acid, dimethyl sulphoxide, peracetic or permaleic acid: H 2 O 2 ; potassium perchlorate, periodate, permanganate, peroxymonosulphate, perborate or peroxydiphosphate; sodium perborate, chlorite or hypochlorite; ammonium persulphate. Examples of the phosphonate chelating agent are diethylene triamine pentamethylphosphonic acid, triethylene tetraamine hexamethylphosphonic acid, tetraethylene pentaamine heptamethylphosphonic acid, hexamethylene or ethylene diamine tetramethyl-phosphonic acid, aminoethyl ethanolamine or piperazine trimethylphosphonic acid, diamino pyridine tetramethylphosphonic acid, and hydrazine tetramethylphosphonic acid, and their alkali metal or ammonium salts; suitable chelating agents are organophosphorus ligands of the formula Z (PO 3 M 2 )n as described in U.S. Patent Nos. 3475293 and 3833486. The solution may also contain as brightening agent a soluble salt of Tl, Pb, Cd, As, Sb, or Bi (e.g. Na Bi tartrate); Na selenite or tellurite; or an amino acid, e.g. lysine or cysteine HCl, alanine, methionine, glycine or 1-tyrosine. Examples of plating metal salts in the solution are CuSO 4 ,Na 2 ZnO 2 ,NiSO 4 ; the carbonate, hydroxide or oxide of the plating metal may be added to react with the chelate, the pH being adjusted with NaOH, KOH, NH 4 OH or alkali metal carbonate.
GB2618974A 1974-06-13 1974-06-13 Cyanidefree electroplating baths Expired GB1419613A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2618974A GB1419613A (en) 1974-06-13 1974-06-13 Cyanidefree electroplating baths

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2618974A GB1419613A (en) 1974-06-13 1974-06-13 Cyanidefree electroplating baths

Publications (1)

Publication Number Publication Date
GB1419613A true GB1419613A (en) 1975-12-31

Family

ID=10239733

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2618974A Expired GB1419613A (en) 1974-06-13 1974-06-13 Cyanidefree electroplating baths

Country Status (1)

Country Link
GB (1) GB1419613A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2461024A1 (en) * 1979-07-13 1981-01-30 Oxy Metal Industries Corp METHODS AND COMPOSITIONS FOR ELECTROLYTIC DEPOSIT OF MONEY USING SILVER COMPOUNDS, CYANIDE-FREE ELECTROLYTES AND ORGANIC PHOSPHONATE COMPOUNDS
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore
GB2158100A (en) * 1984-05-01 1985-11-06 Nat Res Dev Chromium electroplating bath
US4648947A (en) * 1984-05-01 1987-03-10 National Research Development Corp. Chromium electroplating and bath therefor
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
EP0446701A1 (en) * 1990-03-08 1991-09-18 Nkk Corporation Method for manufacturing electrogalvanized steel sheet excellent in spot weldability
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
WO2002068727A2 (en) * 2001-02-23 2002-09-06 Ebara Corporation Copper-plating solution, plating method and plating apparatus
WO2015039152A1 (en) 2013-09-18 2015-03-26 Ing.W.Garhöfer Gesellschaft M.B.H. Deposition of cu, sn, zn-layers on metallic substrates
EP2910667A1 (en) * 2014-02-21 2015-08-26 Rohm and Haas Electronic Materials LLC Cyanide-free acidic matte silver electroplating compositions and methods

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2461024A1 (en) * 1979-07-13 1981-01-30 Oxy Metal Industries Corp METHODS AND COMPOSITIONS FOR ELECTROLYTIC DEPOSIT OF MONEY USING SILVER COMPOUNDS, CYANIDE-FREE ELECTROLYTES AND ORGANIC PHOSPHONATE COMPOUNDS
US4265715A (en) * 1979-07-13 1981-05-05 Oxy Metal Industries Corporation Silver electrodeposition process
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore
GB2158100A (en) * 1984-05-01 1985-11-06 Nat Res Dev Chromium electroplating bath
US4648947A (en) * 1984-05-01 1987-03-10 National Research Development Corp. Chromium electroplating and bath therefor
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US5203986A (en) * 1990-03-08 1993-04-20 Nkk Corporation Method for manufacturing electrogalvanized steel sheet excellent in spot weldability
EP0446701A1 (en) * 1990-03-08 1991-09-18 Nkk Corporation Method for manufacturing electrogalvanized steel sheet excellent in spot weldability
WO2002068727A2 (en) * 2001-02-23 2002-09-06 Ebara Corporation Copper-plating solution, plating method and plating apparatus
WO2002068727A3 (en) * 2001-02-23 2002-12-12 Ebara Corp Copper-plating solution, plating method and plating apparatus
WO2015039152A1 (en) 2013-09-18 2015-03-26 Ing.W.Garhöfer Gesellschaft M.B.H. Deposition of cu, sn, zn-layers on metallic substrates
AT514818A1 (en) * 2013-09-18 2015-04-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
AT514818B1 (en) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
EP2910667A1 (en) * 2014-02-21 2015-08-26 Rohm and Haas Electronic Materials LLC Cyanide-free acidic matte silver electroplating compositions and methods
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee