WO2010142437A1 - Cyanide-free electrolyte for galvanic deposition of gold or alloys thereof - Google Patents
Cyanide-free electrolyte for galvanic deposition of gold or alloys thereof Download PDFInfo
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- WO2010142437A1 WO2010142437A1 PCT/EP2010/003465 EP2010003465W WO2010142437A1 WO 2010142437 A1 WO2010142437 A1 WO 2010142437A1 EP 2010003465 W EP2010003465 W EP 2010003465W WO 2010142437 A1 WO2010142437 A1 WO 2010142437A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form.
- the electrolyte according to the invention is used in galvanic deposition, in particular in coatings made of gold and alloys thereof.
- galvanic baths based on gold- sulphite complexes are known.
- US 4,435,253 teaches a galvanic bath which contains an alkali metal or ammonium-gold-sulphite and also, as further additives, thallium, which is toxic, and a carboxylic acid.
- the disadvantage of galvanic baths which contain gold-sulphite complexes is however their low stability so that the result is formation of colloidal metallic gold in the galvanic bath, as a result of which the electrolyte becomes unusable.
- Galvanic baths in which the gold is present as thio- sulphate complex are known from EP 0 611 840 Al.
- a sulphinate is added here since these baths also have problems with respect to the stability of the complexes.
- a further disadvantage in the just-mentioned galvanic baths concerns the fact that the current densities which can be applied are limited here since decomposition takes place at high current densities. Furthermore, the result with galvanic baths of this type can be odour problems .
- a cyanide- free electrolyte for galvanic deposition of gold or gold alloys from a neutral or alkaline aqueous solution comprising at least one anionic complex of the general formula I
- the gold is thereby present in the anionic complex in the oxidation state +1.
- the electrolyte according to the invention leads to an entire series of important technological, ecological and economic advantages.
- the ligands used according to the invention are easy to handle, in particular with respect to transport, storage, metering and disposal. Furthermore, these ligands are miscible without limitation with water.
- the aqueous solutions are colourless, practically odour-free because of the low vapour pressure and stable thermally and in light and air within a wide temperature range (-30 to +100 0 C) .
- the ligands according to the invention thereby have a low molecular weight, e.g. thioglycerine 108 g/mol or cysteamine 77 g/mol , so that the gold contents of their complexes are very high (above 50%) , which implies a low extraneous material ballast.
- the stability of the complexes is assisted further by the presence of excess ligand concentrations because this counteracts the reverse dissociation of the complexes. It is further advantageous that the same ligand can be used for a plurality of metals, which facilitates the deposition of alloys .
- the cyanide-containing electrolytes known from the prior art can no longer be tolerated by the legislator without onerous conditions with respect to worker safety, storage and disposal for medical and ecological reasons due to the toxicity of the hydrogen cya- nide and of the cyanides.
- the toxicity of the inventive ligands L is in contrast low.
- thioglycerine and cysteamine are used for example partially even in the pharmaceutical and cosmetic field without hesitation.
- the use of the inventive electrolyte in galvanic equipments can thereby represent in many respects great progress .
- ligands L which are soluble in water and cause the water solubility of the complexes are thereby preferred. Likewise, these compounds should have no toxic potential so that handling is not critical.
- at least a part of the ligands L is selected from the group of the anions of 1- and 2 -thioglycerine, monothioglycol, mercapto-n-butane- triol, mercapto-i-butanetriol, mercaptopentanetetrol, cysteamine or combinations hereof .
- thioglycerol is distinguished in that it is colourless and essentially odour- free.
- the new invented electrolyte can contain an excess of ligand for improving the stability of the various metal complexes depending on ion strength, pH or anodic oxidation.
- the number n of ligand is usually 4 but an excess of ligand at least added in the make-up of the first electrolyte gives a better convenient plating maintenance.
- the additional number of ligand can vary from 0 to 10.
- the ligands have a hydrophilic group which is selected from the group of hydroxyl, amino, amido, phosphate, sulphate, phosphonate, car- boxylate, and carbonyl groups or combinations hereof.
- the alloy former for gold is preferably selected from the group consisting of copper, silver, iron, ruthenium, indium, gallium, germanium, tin, palladium, antimony, bismuth, cobalt, rhodium, iridium, nickel, zinc, cadmium, zirconium and lead.
- These metals are preferably present in the following oxidation states in the complexes: Cu(I) or Cu(II), Ag(I), Fe(II) or Fe(III), In(III), Ga(III), Ge(IV), Sn(II) or Sn(IV), Pd(II), Sb(III) or Sb(V), Bi(III) or Bi(V), Co(II), Ni(II), Zn(II), Cd(II), Ru (III), Rh (III), Ir (III), Ir(IV) , Zr(IV) , Pb(II) .
- the electrolyte can comprise further complex formers .
- complex formers There are included herein in particular ethylenedia- minetetraacetate, nitrilotriacetate, oxalate, car- boxylates, ammonia, tartrate or 8-oxyquinoline and also mixtures hereof. These can also act as conductivity additives and as buffers .
- complexes of the further metals with the ligand L or with other ligands common for these metals, in particular the above-mentioned complex formers, are added to the electrolyte.
- the metal content of the electrolyte for gold as for each individual further metal present in the electrolyte is preferably in the range of 0.1 to 50 g/1 electrolyte, in particular of 0.1 to 15 g/1 electro- Iyte.
- the electrolyte comprises further supplements or additives.
- brighteners there are included herein in particular brighteners, wetting agents, conducting salts and mixtures hereof.
- the brightener is thereby comprised preferably in a concentration of 0.001 to 5 g/1 in the electrolyte.
- brighteners there are suitable inorganic bright- eners, in particular selenium or tellurium compounds, or organic brighteners, in particular pyridine-3- sulphonic acid, benzaldehyde, 2-butin-l, 4-diol and/or sodium nicotinate, amines and polyamines : Amines and reaction products between amine and chloro derivatives (epichlorhydrin, dichlordiethylether, chloro- bromo propane), e.g.
- the wetting agent is preferably comprised in a concentration of 0.001 to 5 g/1 in the electrolyte.
- concentration is in the range of 0.2 to 2 g/1.
- the wetting agent is thereby preferably selected from the group of cationic, ani- onic, non- ionic or amphoteric surfactants.
- Cationic surfactants include for example tetraal- kylammonium halides, alkyltrimethylammonium halides, hydroxyethylalkylimidazolines, polyoxyethylenealkyl- methylammonium halides, alkyldimethylammonium halides, alkyldimethylbenzylammonium halides, alkylamine hydrochlorides, alkylamine acetates, alkylamine oleates, alkylaminoethylglycines and alkylpyridinium halides .
- anionic surfactants e.g.
- alkyl- ⁇ -naphthalene sulphonic acids or salts thereof saponified fats, alkylsulphonates, ⁇ -olefin sulpho- nates, alkylbenzene sulphonates, alkylnaphthalene sulphonates, alkyldiphenylether disulphonates, al- kylether sulphonates, alkylsulphuric acid esters, polyoxyethylenealkylether sulphuric acid esters, polyoxyethylenealkylphenolether sulphuric acid esters, phosphoric acid monoesters of higher alcohols, polyoxyalkylenealkylether phosphoric acids and esters thereof, polyoxyalkylenealkylphenyl ether phosphates, polyoxyalkylenephenylether phosphates, poloxyethyl- enealkylether phosphates, polyoxyethylenealkylether acetates, alkanoylsarcosines, alkanoides
- non-ionic surfactants there are used e.g. poly- oxyalkylenealkyl ethers or esters , polyoxyalkylene phenylethers, polyoxyalkylenenaphthyl (or alkyl- naphthyl) ethers, polyoxyalkylenebisphenolethers, polyoxyethylene-polyoxypropylene block copolymers, polyoxyalkylenesorbitan fatty acid esters, polyoxyal- kylenesorbitol fatty acid esters, polyethylene glycol fatty acid esters, polyoxyalkylene glycerine fatty acid esters, polyoxyalkylenealkylamines, polyoxyalkylene condensates of ethylene diamine, polyoxy- alkylenealkylphenylformalin condensates, glycerine fatty acid esters, polyglycerine fatty acid asters, pentaerythritol fatty acid esters, sorbitan mono fatty acid esters, higher fatty acid
- amphoteric surfactants are preferably selected from the group consisting of 2-alkyl-N-carboxymethyl- N-hydroxyethylimidazolinium betaines, 2-alkyl-N- carboxyethyl-N-hydroxyethylimidazolinium betaines, 2- alkyl-N-carboxymethyl-N-carboxymethyloxyethylimidazo- linium betaines, 2-alkyl-N-carboxyethyl-N-carboxy- methyloxyethylimidazolinium betaines, dimethylalkyl betaines, N-alkyl- ⁇ -amino propionic acid or sodium salts thereof, alkylaminoethylglycine, N-alkyl-N- methyl-p-alanines or sodium salts thereof and fatty acid amidopropyldimethylaminoacetic acid betaines.
- the electrolyte preferably comprises at least one conducting salt in a concentration of 0.01 to 250 g/1, in particular 0.01 to 100 g/1 or 0.01 to 50 g/1.
- conducting salts preferably inorganic conducting salts, in particular from the group of sulphates, phosphates and pyrophosphates, or organic conducting salts, in particular from the group of salts of weak organic acids like formic, citric or acetic acid or preferably sodium citrate.
- the conducting salt thereby serves to reduce the voltage with appropriate current density. During the electrolysis on the anode, it must thereby have sufficient stability.
- the electrolyte preferably has a pH value in the range of 7 to 14, in particular of 10 to 13.
- a caustic solution in particular NaOH, is thereby preferably used.
- the inventive electrolyte is preferably free of chlo- rides, as a result of which formation of chlorine and resulting products in the galvanic bath can be avoided.
- the inventive electrolyte is preferably thermally stable in the range of 20 to 85°C so that it can be used in standard temperature conditions by galvanic baths .
- the number of ligands L of the complexes contained in the electrolyte corresponds at least to the sum of the coordination numbers of gold and also to the metals which are present. It is thereby preferred that an excess of ligands is present relative to the stoichiometrically fixed number of ligands for complete coordination of all metals, including gold. As a result, an improvement in the solubility and stability of the electrolyte can be ensured.
- the inventive electrolyte is used preferably for the deposition of coatings made of gold and alloys thereof .
- the inventive electrolyte can be used for flash plating of layers with a thickness of 0.03 ⁇ m to 0.5 ⁇ m.
- the inventive electrolyte can be used for thick plating of layers with a thickness of 0.05 ⁇ m to 20 ⁇ m.
- the present invention allows the electroforming of layers with a thickness of 20 ⁇ m to 500 ⁇ m.
- Example 1 The subject according to the invention is intended to be explained in more detail with reference to the subsequent examples without wishing to restrict said subject to the special embodiments represented here.
- Example 1 The subject according to the invention is intended to be explained in more detail with reference to the subsequent examples without wishing to restrict said subject to the special embodiments represented here.
- Example 1 The subject according to the invention is intended to be explained in more detail with reference to the subsequent examples without wishing to restrict said subject to the special embodiments represented here.
- This solution (50 ml, pH 13) with a content of 4.2 gl "1 gold (Au) is stable over at least 10 days in air in the temperature range 20 - 80 0 C, colourless and odour-free and can be used directly or with additives for galvanic gold deposition on various substrates.
- Well tested electrolyte addi- tives are secondary potassium phosphate K 2 HPO 4 , sodium-potassium-tartrate NaKC 4 H 6 O 6 , tetrasodium ethyl- enediaminetetraacetate Na 4 Ci 0 H 8 N 2 O 8 (Na 4 EDTA) and others.
- the thus produced electrolyte, without or with additives also represents a suitable original or storage solution for the galvanic deposition of gold alloys. For this purpose, there are admixed therewith corresponding proportions of original solutions of the desired other alloy components.
- substrates made of copper, brass, bronze etc. are galvanically gold plated (1 Adm "2 , 3.1 V, 55°C, 5 min) .
- the desired surface characteristic of the obtained coatings is adjusted by known methods (pre- and post-treatment of the substrates) and additives to the electrolyte (in particular brighteners) .
- An electrolyte for gold- indium alloy has been made up with 2 g/L of gold thioglycerol and 0,4 g/L of indium thioglycerol .
- 100 g/L of sodium formiate gave the needed electrical conductivity while the pH was stabilized at 11 with potassium hydroxide.
- An anode of platinated titanium and a stirring agitation allows to pass 1,5 A/dm 2 at 50 0 C without burning at high current density.
- the deposit is bright enough up to 1 ⁇ m plated in 10 min.
- the alloy composition is Au 80% and In 20%.
- the colour of the deposit in L, a, b values according Minolta colorimeter values is 85.0, 1,29 and 11,49, respectively, close to the IN or 2N colour.
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Abstract
The invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form. The electrolyte according to the invention is used in galvanic deposition, in particular for coatings made of gold and alloys thereof.
Description
Cyanide-free electrolyte for galvanic deposition of gold or alloys thereof
The invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form. The electrolyte according to the invention is used in galvanic deposition, in particular in coatings made of gold and alloys thereof.
The galvanic deposition of gold has been effected for many years using electrolytes based on gold-cyanide complexes. In the alkaline range, proportions of toxic alkali cyanides are present and also the remaining metal cyanides are extremely toxic. In the acidic or neutral range, the cyanide released during electrolysis can escape in the form of toxic hydrogen cyanide or cyanogen. This toxicity and problematic handling associated therewith represents one of the substantial disadvantages of cyanide-containing elec-
trolytes . A further problem relates to disposal of the cyanides contained in the depleted electrolyte.
Hence attempts have been made for some time to make available galvanic baths which dispense with the use of cyanides completely.
In this respect, galvanic baths based on gold- sulphite complexes are known. Thus US 4,435,253 teaches a galvanic bath which contains an alkali metal or ammonium-gold-sulphite and also, as further additives, thallium, which is toxic, and a carboxylic acid. The disadvantage of galvanic baths which contain gold-sulphite complexes is however their low stability so that the result is formation of colloidal metallic gold in the galvanic bath, as a result of which the electrolyte becomes unusable.
Galvanic baths in which the gold is present as thio- sulphate complex are known from EP 0 611 840 Al. For stabilisation of these complexes, a sulphinate is added here since these baths also have problems with respect to the stability of the complexes. A further disadvantage in the just-mentioned galvanic baths concerns the fact that the current densities which can be applied are limited here since decomposition takes place at high current densities. Furthermore, the result with galvanic baths of this type can be odour problems .
In US 6,165,342, electrolysis baths for deposition of gold and gold alloys are presented, in which gold complexes with mercapto sulphonic acids and disul- phide disulphonic acids are used. These compounds have the disadvantage that, because of the high molar weight of the sulphonic acids and the excess acid
functions to be neutralised, they have a high proportion of extraneous material and hence only low gold contents. This fact also leads to corresponding processing and disposal problems.
Starting herefrom, it was the object of the present invention to provide cyanide-free galvanic baths, the electrolyte of which has high stability and handling of which is substantially improved with respect to operating safety and environmental compatibility, relative to the galvanic baths known from the state of the art .
This object is achieved by the cyanide- free electro- lytes for galvanic deposition of gold or gold alloys having the features of claim 1. The further dependent claims reveal advantageous developments . In claim 20, a use according to the invention is cited.
According to the invention, a cyanide- free electrolyte for galvanic deposition of gold or gold alloys from a neutral or alkaline aqueous solution is provided, comprising at least one anionic complex of the general formula I
[Au(L)n] (n-1J- I
with
L = linear or branched C1-Ci8 alkyl - , Ci- Ci8 alkenyl , Ci- Ci8 alkynyl , Ci- Ci8 aralkyl - , and C1- Ci8 cycloalkyl - ligands which can be substituted by heteroatoms and which have at least one thiolate group and at least one hydrophilic group, and n = 2 to 5, preferably n = 2 to 4
and, optionally, at least one anionic complex of the general formula II
[M (L) J χ- II
with
M = alloy former for gold,
L = linear or branched Ci-C18 alkyl-, Ci-Ci8 aralkyl-, Ci-Ci8 cycloalkyl-, Cx-Ci8 alkenyl, and Ci-Ci8 alkynyl- ligands which can be substituted by heteroatoms and which have at least one thiolate group and at least one hydrophilic group, and m = 2 to 6 and x = 1 to 4.
The gold is thereby present in the anionic complex in the oxidation state +1.
The electrolyte according to the invention leads to an entire series of important technological, ecological and economic advantages.
Thus with the electrolyte according to the invention, both matt, semi-glossy and glossy coatings with excellent quality can be produced.
The ligands used according to the invention (e.g. ra- cemic 1-thioglycerine or cysteamine) are easy to handle, in particular with respect to transport, storage, metering and disposal. Furthermore, these ligands are miscible without limitation with water. The aqueous solutions are colourless, practically odour-free because of the low vapour pressure and stable thermally and in light and air within a wide temperature range (-30 to +1000C) . The same applies to the anionic complexes formed therefrom with gold and metals M. They are also extremely readily water- soluble and in particular stable and odour- free in
the preferred alkaline aqueous solutions in the temperature range +20 to +85°C. The ligands according to the invention thereby have a low molecular weight, e.g. thioglycerine 108 g/mol or cysteamine 77 g/mol , so that the gold contents of their complexes are very high (above 50%) , which implies a low extraneous material ballast. The stability of the complexes is assisted further by the presence of excess ligand concentrations because this counteracts the reverse dissociation of the complexes. It is further advantageous that the same ligand can be used for a plurality of metals, which facilitates the deposition of alloys .
The cyanide-containing electrolytes known from the prior art can no longer be tolerated by the legislator without onerous conditions with respect to worker safety, storage and disposal for medical and ecological reasons due to the toxicity of the hydrogen cya- nide and of the cyanides. The toxicity of the inventive ligands L is in contrast low. Thus thioglycerine and cysteamine are used for example partially even in the pharmaceutical and cosmetic field without hesitation. The use of the inventive electrolyte in galvanic equipments can thereby represent in many respects great progress .
Those complex ligands L which are soluble in water and cause the water solubility of the complexes are thereby preferred. Likewise, these compounds should have no toxic potential so that handling is not critical. Preferably, at least a part of the ligands L is selected from the group of the anions of 1- and 2 -thioglycerine, monothioglycol, mercapto-n-butane- triol, mercapto-i-butanetriol, mercaptopentanetetrol, cysteamine or combinations hereof .
In particular thioglycerol is distinguished in that it is colourless and essentially odour- free. It forms soluble complexes with gold but also with cop- per, tin, indium, silver, iron, palladium, bismuth, zinc, cobalt, nickel, cadmium, gallium, germanium and antimony. A further advantage resides in the fact that thioglycerol is very easy to handle.
The new invented electrolyte can contain an excess of ligand for improving the stability of the various metal complexes depending on ion strength, pH or anodic oxidation. For gold, the number n of ligand is usually 4 but an excess of ligand at least added in the make-up of the first electrolyte gives a better convenient plating maintenance. The additional number of ligand can vary from 0 to 10.
It is preferred that the ligands have a hydrophilic group which is selected from the group of hydroxyl, amino, amido, phosphate, sulphate, phosphonate, car- boxylate, and carbonyl groups or combinations hereof.
The alloy former for gold is preferably selected from the group consisting of copper, silver, iron, ruthenium, indium, gallium, germanium, tin, palladium, antimony, bismuth, cobalt, rhodium, iridium, nickel, zinc, cadmium, zirconium and lead. These metals are preferably present in the following oxidation states in the complexes: Cu(I) or Cu(II), Ag(I), Fe(II) or Fe(III), In(III), Ga(III), Ge(IV), Sn(II) or Sn(IV), Pd(II), Sb(III) or Sb(V), Bi(III) or Bi(V), Co(II), Ni(II), Zn(II), Cd(II), Ru (III), Rh (III), Ir (III), Ir(IV) , Zr(IV) , Pb(II) .
The electrolyte comprises, as counterion for the anionic complex, preferably at least one cation E selected from the group consisting of alkali ions, in particular Na+ and K+, quaternary ions, in particular NH4 +, NR4 +, PR4 + with R = Ci-C12 alkyl or aryl, or dia- zolium ions and combinations hereof.
In addition to the previously-mentioned components, the electrolyte can comprise further complex formers . There are included herein in particular ethylenedia- minetetraacetate, nitrilotriacetate, oxalate, car- boxylates, ammonia, tartrate or 8-oxyquinoline and also mixtures hereof. These can also act as conductivity additives and as buffers .
For deposition of alloys, complexes of the further metals with the ligand L or with other ligands common for these metals, in particular the above-mentioned complex formers, are added to the electrolyte.
The metal content of the electrolyte for gold as for each individual further metal present in the electrolyte is preferably in the range of 0.1 to 50 g/1 electrolyte, in particular of 0.1 to 15 g/1 electro- Iyte.
It is furthermore possible that the electrolyte comprises further supplements or additives. There are included herein in particular brighteners, wetting agents, conducting salts and mixtures hereof.
The brightener is thereby comprised preferably in a concentration of 0.001 to 5 g/1 in the electrolyte. As brighteners there are suitable inorganic bright- eners, in particular selenium or tellurium compounds, or organic brighteners, in particular pyridine-3-
sulphonic acid, benzaldehyde, 2-butin-l, 4-diol and/or sodium nicotinate, amines and polyamines : Amines and reaction products between amine and chloro derivatives (epichlorhydrin, dichlordiethylether, chloro- bromo propane), e.g. condensation product of N, N' - bis {3 - (dimethylamino) propyl) urea on dichlordiethyl ether, polyethylene-imine and derivatives (oxidized or ethylenated) , e.g. polyethylene-imine of molecular weight lower than 1000, aldehydes and ketones, sul- fonated or solubilised by solvent or hydrotrope, e.g. anisaldehyde, vanillin, piperonal, benzyliden acetone, aryl sulfonates, e.g. para toluene benzene sulfonate, benzene sulfonate, naphtalene disulfonate acetylenic derivates, e.g. butynediol ethylenic deri- vates, e.g. allyl sulfonate, pyridine derivatives, e.g. sodium pyridin propane sulfonate or sodium benzyl pyridine carboxylate, amino acid + polypeptides: Peptone .
The wetting agent is preferably comprised in a concentration of 0.001 to 5 g/1 in the electrolyte. For particular preference, the concentration is in the range of 0.2 to 2 g/1. The wetting agent is thereby preferably selected from the group of cationic, ani- onic, non- ionic or amphoteric surfactants.
Cationic surfactants include for example tetraal- kylammonium halides, alkyltrimethylammonium halides, hydroxyethylalkylimidazolines, polyoxyethylenealkyl- methylammonium halides, alkyldimethylammonium halides, alkyldimethylbenzylammonium halides, alkylamine hydrochlorides, alkylamine acetates, alkylamine oleates, alkylaminoethylglycines and alkylpyridinium halides .
There are included in the anionic surfactants e.g. alkyl-β-naphthalene sulphonic acids or salts thereof, saponified fats, alkylsulphonates, α-olefin sulpho- nates, alkylbenzene sulphonates, alkylnaphthalene sulphonates, alkyldiphenylether disulphonates, al- kylether sulphonates, alkylsulphuric acid esters, polyoxyethylenealkylether sulphuric acid esters, polyoxyethylenealkylphenolether sulphuric acid esters, phosphoric acid monoesters of higher alcohols, polyoxyalkylenealkylether phosphoric acids and esters thereof, polyoxyalkylenealkylphenyl ether phosphates, polyoxyalkylenephenylether phosphates, poloxyethyl- enealkylether phosphates, polyoxyethylenealkylether acetates, alkanoylsarcosines, alkanoidesarconisates, alkanoylmethylalanine salts, alkylsulphoatetates, acylmethyltaurines, alkyl fatty acid glycerine sulphuric acid esters, alkylsulphocarboxylesters, alkyl- sulphosuccinates, dialkylsulphosuccinates, alkyl polyoxyethylenesulphosuccinates and sodium succinic acid monooleylamides .
As non-ionic surfactants there are used e.g. poly- oxyalkylenealkyl ethers or esters , polyoxyalkylene phenylethers, polyoxyalkylenenaphthyl (or alkyl- naphthyl) ethers, polyoxyalkylenebisphenolethers, polyoxyethylene-polyoxypropylene block copolymers, polyoxyalkylenesorbitan fatty acid esters, polyoxyal- kylenesorbitol fatty acid esters, polyethylene glycol fatty acid esters, polyoxyalkylene glycerine fatty acid esters, polyoxyalkylenealkylamines, polyoxyalkylene condensates of ethylene diamine, polyoxy- alkylenealkylphenylformalin condensates, glycerine fatty acid esters, polyglycerine fatty acid asters, pentaerythritol fatty acid esters, sorbitan mono fatty acid esters, higher fatty acid monoethanola- mides, alkylalkylolamides and oxyethylenealkylamines .
The amphoteric surfactants are preferably selected from the group consisting of 2-alkyl-N-carboxymethyl- N-hydroxyethylimidazolinium betaines, 2-alkyl-N- carboxyethyl-N-hydroxyethylimidazolinium betaines, 2- alkyl-N-carboxymethyl-N-carboxymethyloxyethylimidazo- linium betaines, 2-alkyl-N-carboxyethyl-N-carboxy- methyloxyethylimidazolinium betaines, dimethylalkyl betaines, N-alkyl-β-amino propionic acid or sodium salts thereof, alkylaminoethylglycine, N-alkyl-N- methyl-p-alanines or sodium salts thereof and fatty acid amidopropyldimethylaminoacetic acid betaines.
The electrolyte preferably comprises at least one conducting salt in a concentration of 0.01 to 250 g/1, in particular 0.01 to 100 g/1 or 0.01 to 50 g/1. There are thereby used as conducting salts preferably inorganic conducting salts, in particular from the group of sulphates, phosphates and pyrophosphates, or organic conducting salts, in particular from the group of salts of weak organic acids like formic, citric or acetic acid or preferably sodium citrate. The conducting salt thereby serves to reduce the voltage with appropriate current density. During the electrolysis on the anode, it must thereby have sufficient stability.
The electrolyte preferably has a pH value in the range of 7 to 14, in particular of 10 to 13. In or- der to adjust the pH value of the electrolyte, a caustic solution, in particular NaOH, is thereby preferably used.
The inventive electrolyte is preferably free of chlo- rides, as a result of which formation of chlorine and
resulting products in the galvanic bath can be avoided.
The inventive electrolyte is preferably thermally stable in the range of 20 to 85°C so that it can be used in standard temperature conditions by galvanic baths .
Preferably, the number of ligands L of the complexes contained in the electrolyte corresponds at least to the sum of the coordination numbers of gold and also to the metals which are present. It is thereby preferred that an excess of ligands is present relative to the stoichiometrically fixed number of ligands for complete coordination of all metals, including gold. As a result, an improvement in the solubility and stability of the electrolyte can be ensured.
The inventive electrolyte is used preferably for the deposition of coatings made of gold and alloys thereof .
At first, the inventive electrolyte can be used for flash plating of layers with a thickness of 0.03 μm to 0.5 μm. Similarly, the inventive electrolyte can be used for thick plating of layers with a thickness of 0.05 μm to 20 μm. Moreover, the present invention allows the electroforming of layers with a thickness of 20 μm to 500 μm.
The subject according to the invention is intended to be explained in more detail with reference to the subsequent examples without wishing to restrict said subject to the special embodiments represented here.
Example 1
Cyanide- free electrolyte for galvanic gold plating
425 mg tetrachloroauric acid trihydrate HAuCl4 -3H2O (50% Au) is dissolved at room temperature in 45 ml distilled water. With agitation, 0.50 ml 1- thioglycerine (C3H8O2S, racemic, 98%, d 1.25 gem"3) is added in drops and the mixture is further agitated until a colourless suspension which reacts strongly acidic is produced. This suspension is treated with a solution of 0.225 g sodium hydroxide NaOH in 5 ml water, a clear colourless solution being produced showing approx. pH 10. This solution (50 ml, pH 13) with a content of 4.2 gl"1 gold (Au) is stable over at least 10 days in air in the temperature range 20 - 800C, colourless and odour-free and can be used directly or with additives for galvanic gold deposition on various substrates. Well tested electrolyte addi- tives are secondary potassium phosphate K2HPO4, sodium-potassium-tartrate NaKC4H6O6, tetrasodium ethyl- enediaminetetraacetate Na4Ci0H8N2O8 (Na4EDTA) and others. The thus produced electrolyte, without or with additives, also represents a suitable original or storage solution for the galvanic deposition of gold alloys. For this purpose, there are admixed therewith corresponding proportions of original solutions of the desired other alloy components.
Example 2
Cyanide- and chloride-free electrolyte for galvanic gold plating
420 mg tetrachloroauric acid trihydrate HAuCl4 • 3H2O (50% Au) is dissolved in 50 ml distilled water and
the obtained solution is mixed at 230C in drops with agitation with 0.37 ml 1-thioglycerine (C3H8O2S, race- mic, 98%, d = 1.25 gem"3). The thus obtained colourless suspension is further agitated at 40° for 30 minutes, allowed to settle and filtered. The precipitate of gold- (I) -thioglycerolate is washed with distilled water and alcohol and air-dried. There remain 275 mg of a yellow product which is suspended in 30 ml water and is treated therein at approx. 500C with agitation with 0.28 ml 1-thioglycerine (C3H8O2S, racemic, 98%, d 1.25 gem"3) and 0.12 g sodium hydroxide NaOH. A clear, colourless and odour-free solution is produced (pH 12, approx. 5.7 gl"1 Au) which can be used directly or with additives (cf . Example 1) for galvanic gold deposition on various substrates. This electrolyte likewise represents a suitable original or storage solution for the galvanic deposition of gold alloys. For this purpose, there are admixed therewith corresponding proportions of original solutions of the desired other alloy components .
Example 3
Galvanic deposition of gold
From the original solution produced according to Example 2 an electrolyte is prepared which contains 2.5 gl"1 gold and 80 gl"1 dipotassium phosphate (pH 11.5). According to requirement, wetting agents are added.
In this solution, substrates made of copper, brass, bronze etc. are galvanically gold plated (1 Adm"2, 3.1 V, 55°C, 5 min) . The desired surface characteristic of the obtained coatings is adjusted by known methods (pre- and post-treatment of the substrates)
and additives to the electrolyte (in particular brighteners) .
Example 4
Cyanide- free electrolyte for galvanic deposition of gold
394 mg tetrachloroauric acid trihydrate HAuCl4 • 3H2O (50% gold, Au) is dissolved in 40 ml water and the obtained solution is mixed with 750 mg cysteamine hydrochloride H2NCH2CH2SH+Cl . The resulting precipitate is dissolved with concentrated sodium hydroxide (pH 11) . The thus obtained clear, colourless and odour- free solution (50 ml, 3.694 gl'1 gold Au) is stable for several days and can be used directly or after the addition of additives (cf . Example 1) as electrolyte for galvanic deposition of gold.
Example 5
Galvanic deposition of a gold-indium alloy
An electrolyte for gold- indium alloy has been made up with 2 g/L of gold thioglycerol and 0,4 g/L of indium thioglycerol . 100 g/L of sodium formiate gave the needed electrical conductivity while the pH was stabilized at 11 with potassium hydroxide. An anode of platinated titanium and a stirring agitation allows to pass 1,5 A/dm2 at 500C without burning at high current density. The deposit is bright enough up to 1 μm plated in 10 min. The alloy composition is Au 80% and In 20%. The colour of the deposit in L, a, b values according Minolta colorimeter values is 85.0, 1,29 and 11,49, respectively, close to the IN or 2N colour.
Claims
1. Cyanide- free electrolyte for galvanic deposition of gold or gold alloys comprising a neutral or alkaline aqueous solution of at least one anionic complex of the general formula I
[Au(L)n] ^1'- I
with
L = linear or branched Ci-Ci8 alkyl, Ci-Ci8 al- kenyl, Ci-Ci8 alkynyl, Ci-Ci8 aralkyl, Ci-Ci8- cycloalkyl ligands which can be substituted by heteroatoms and which have at least one thiolate group and at least one hydrophilic group, and n = 2 to 5
and, optionally, at least one anionic complex of the general formula II
[M(L)m]χ- II
with M = alloy former for gold,
L = linear or branched Ci-Ci8 alkyl, Ci-Ci8 al- kenyl, C1-Ci8 alkynyl, Ci-Ci8 aralkyl, Ci-Ci8- cycloalkyl ligands which can be substituted by heteroatoms and which have at least one thiolate group and at least one hydrophilic group, and m = 2 to 6 and x = 1 to 4.
2. Electrolyte according to claim 1, characterised in that at least a part of the ligands L is selected from the group of the anions of 1- and 2-thioglycerine, monothioglycol, mercapto-n-butanetriol, mercapto-i-butanetriol, mercaptopentanetetrol, cysteamine or combinations hereof .
3. Electrolyte according to one of the preceding claims, characterised in that the hydrophilic group is selected from the group of hydroxyl, amino, amido, phosphate, sulphate, phosphonate, carboxylate, carbonyl groups or combinations hereof.
4. Electrolyte according to one of the preceding claims, characterised in that the at least one alloy former for gold is selected from the group comprising Cu, Ag, Fe, Ru, In, Ga, Ge, Sn, Pd, Sb, Bi, Co, Rh, Ir, Ni, Zn, Cd, Zr and Pb.
5. Electrolyte according to one of the preceding claims, characterised in that the electrolyte contains, as counterion for the anionic complex, at least one cation E selected from the group comprising alkali ions, in particular Na+ and K+, quaternary ions, in particular NH4 +, NR4 +, PR4 + with R = Ci-Ci2-alkyl or aryl, or diazolium ions and combinations hereof .
6. Electrolyte according to one of the preceding claims, characterised in that the electrolyte contains further complex formers, in particular ethyl- enediaminetetraacetate, nitrilotriacetate, ammo- nium tartrate or 8-oxyquinoline .
7. Electrolyte according to one of the preceding claims, characterised in that the metal content of the electrolyte for each individual metal is in the range of 0.1 to 50 g/1 electrolyte, in particular of 0.1 to 15 g/1 electrolyte.
8. Electrolyte according to one of the preceding claims, characterised in that the electrolyte comprises as further additives brighteners, wetting a- gents, conducting salts or mixtures hereof.
9. Electrolyte according to claim 8, characterised in that the at least one bright- ener is comprised in a concentration of 0.001 to 5 g/1 in the electrolyte.
10. Electrolyte according to claim 8 or 9, characterised in that an inorganic brightener is comprised as brightener, in particular a selenium and/or tellurium compound, or an organic brightener, in particular pyridine-3 -sulphonic acid, benzaldehyde, 2-butin-l, 4-diol and/or so- dium nicotinate.
11. Electrolyte according to one of the claims 8 to 10, characterised in that the at least one wetting agent is comprised in a concentration of 0.001 to 5 g/1, in particular of 0.2 to 2 g/1 in the electrolyte .
12. Electrolyte according to one of the claims 8 to 11, characterised in that the wetting agent is se- lected from the group of cationic, anionic, non- ionic, amphoteric surfactants or mixtures hereof .
13. Electrolyte according to one of the claims 8 to 12, characterised in that the at least one conducting salt is comprised in a concentration of 0.01 to 250 g/1, in particular 0.01 to 100 g/1.
14. Electrolyte according to one of the claims 8 to 13, characterised in that the at least one conducting salt is an inorganic conducting salt, in particular from the group of sulphates, phosphates and pyrophosphates, or an organic conducting salt, in particular from the group of salts of weak organic acids, preferably formic, citric or acetic acid.
15. Electrolyte according to one of the preceding claims, characterised in that the pH value of the electrolyte is in the range of 7 to 14 , in particu- lar of 10 to 13.
16. Electrolyte according to one of the preceding claims, characterised in that the electrolyte is free of chlorides.
17. Electrolyte according to one of the preceding claims, characterised in that the electrolyte is ther- mally stable in the range of 20 to 85 °C.
18. Electrolyte according to one of the preceding claims, characterised in that the number of ligands L of the complexes comprised in the electrolyte cor- responds at least to the sum of the maximum coordination numbers of gold and also of the metals present .
19. Electrolyte according to one of the preceding claims, characterised in that the electrolyte is produced by dissolving at least one gold salt, at least one complex former selected from the group comprising linear or branched Ci-Ci8 alkyl, Ci-Ci8 alkenyl, Ci-Ci8 alkynyl, CX-CI8 aralkyl, Ci-Ci8 cycloalkyl ligands which can be substituted by heteroatoms and which have at least one thiolate group and at least one hydrophilic group, an ammonium- or alkali-containing caustic solution and, optionally, a salt of an alloy former for gold.
20. Use of the electrolyte according to one of the preceding claims for deposition of coatings made of gold and gold alloys.
21. Use according to the preceding claim for flash plating of layers with a thickness of 0.03 μm to 0.5 μm, for thick plating of layers with a thickness of 0.05 μm to 20 μm or for electro- forming of layers with a thickness of 20 μm to 500 μm.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES10724310.7T ES2562005T3 (en) | 2009-06-09 | 2010-06-09 | Cyanide-free electrolyte for galvanic deposition of gold alloys |
EP10724310.7A EP2313541B1 (en) | 2009-06-09 | 2010-06-09 | Cyanide-free electrolyte for galvanic deposition of gold alloys |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE102009024396.8 | 2009-06-09 | ||
DE102009024396A DE102009024396A1 (en) | 2009-06-09 | 2009-06-09 | Cyanide-free electrolyte for electrodeposition of gold or its alloys |
US18578909P | 2009-06-10 | 2009-06-10 | |
US61/185,789 | 2009-06-10 |
Publications (1)
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WO2010142437A1 true WO2010142437A1 (en) | 2010-12-16 |
Family
ID=43069719
Family Applications (1)
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PCT/EP2010/003465 WO2010142437A1 (en) | 2009-06-09 | 2010-06-09 | Cyanide-free electrolyte for galvanic deposition of gold or alloys thereof |
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EP (1) | EP2313541B1 (en) |
DE (1) | DE102009024396A1 (en) |
ES (1) | ES2562005T3 (en) |
WO (1) | WO2010142437A1 (en) |
Cited By (3)
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FR2978765A1 (en) * | 2011-08-04 | 2013-02-08 | Commissariat Energie Atomique | NOVEL IONIC LIQUIDS USEFUL FOR ENTERING THE ELECTROLYTE COMPOSITION FOR ENERGY STORAGE DEVICES |
CN103122471A (en) * | 2013-03-01 | 2013-05-29 | 沈阳师范大学 | Cyanide-free indium plating electroplate liquid |
CN119392325A (en) * | 2024-12-31 | 2025-02-07 | 深圳创智芯联科技股份有限公司 | Cyanide-free gold plating solution and electroplating method for gold plating of micro blind holes |
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CN119392325A (en) * | 2024-12-31 | 2025-02-07 | 深圳创智芯联科技股份有限公司 | Cyanide-free gold plating solution and electroplating method for gold plating of micro blind holes |
Also Published As
Publication number | Publication date |
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EP2313541B1 (en) | 2016-01-13 |
DE102009024396A1 (en) | 2010-12-16 |
EP2313541A1 (en) | 2011-04-27 |
ES2562005T3 (en) | 2016-03-02 |
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