GB1324895A - Stabilized electroless copper plating solutions - Google Patents
Stabilized electroless copper plating solutionsInfo
- Publication number
- GB1324895A GB1324895A GB1643771A GB1643771A GB1324895A GB 1324895 A GB1324895 A GB 1324895A GB 1643771 A GB1643771 A GB 1643771A GB 1643771 A GB1643771 A GB 1643771A GB 1324895 A GB1324895 A GB 1324895A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless
- cooh
- stabilizer
- ppm
- aryl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1324895 Electroless Cu plating SHIPLEY CO Inc 21 May 1971 [21 May 1970] 16436/71 Addition to 1304100 Heading C7F An aqueous electroless Cu-plating solution contains a source of copper ions, a reducing agent, a complexing agent and as stabilizer, a covalent Hg compound. The reducing agent may be HCHO or a pre-cursor thereof; there may be present a known stabilizer to co-act with the Hg compound, which is preferably R-Hg-R' where R is alkyl, cyclo-alkyl, aryl, aralkyl, alkaryl, alkoxy, aryloxy, or heterocyclic and R' is R or a polar group such as -NO 2 , -SO 2 OH or -SO 2 OM (M = alkali metal) -COOH or -COOM, -NH 2 , -Cl, -Br, -I, -OH or -Cn (many examples are given); a preferred amount in solution is 1-100 ppm. The known stabilizer may be Na 2 S K 2 S, Na or K polysulphide, NaCNS, KCNS, K 2 S 2 O 6 , Na 2 S 2 O 3 , K 2 S 2 O 3 , thiourea, 2- mercaptobenzothlazole, 1, 2-ethanedithiol, 1,2-benzoisothiazane, methionine, 2, 2'- thiodiethanol, dithioglycol, thioglycollic acid, a water-soluble cyanide, e.g. NaCN or KCN, an α-hydroxynitrile, iminodiacetonitrile or 3, 3'- iminodlpropionitrlle (trace to 300 ppm) or R<SP>2</SP> -C#CH or R<SP>3</SP> -C#C-R<SP>4</SP> where R<SP>2</SP>, R<SP>3</SP>, and R<SP>4</SP> are lower monovalent hydroxyalkyl, cyclohydroxyalkyl, or hydroxyalkylether groups, or aryl, aliphatic or cycloaliphatic groups substituted with a watersolubilizing group such as -COOH or -OH. Cotton cloth or phenolic resin is cleaned, sensitized with SnCl 2 /PdCl 2 or with precious metal-stannic acid colloid and electroless plated with the above solution.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3950370A | 1970-05-21 | 1970-05-21 | |
| NL7007511A NL7007511A (en) | 1970-05-25 | 1970-05-25 | |
| NL7007510A NL7007510A (en) | 1970-05-21 | 1970-05-25 | |
| FR7019372A FR2088202B1 (en) | 1970-05-21 | 1970-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1324895A true GB1324895A (en) | 1973-07-25 |
Family
ID=27446064
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1643771A Expired GB1324895A (en) | 1970-05-21 | 1971-05-21 | Stabilized electroless copper plating solutions |
| GB1643571A Expired GB1324827A (en) | 1970-05-21 | 1971-05-21 | Stabilized electroless nickel and or cobalt plating solutions |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1643571A Expired GB1324827A (en) | 1970-05-21 | 1971-05-21 | Stabilized electroless nickel and or cobalt plating solutions |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3649308A (en) |
| DE (2) | DE2124330B2 (en) |
| FR (2) | FR2088202B1 (en) |
| GB (2) | GB1324895A (en) |
| NL (2) | NL7007510A (en) |
| SE (1) | SE366069B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2671988C1 (en) * | 2017-10-02 | 2018-11-08 | Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" | Application process of drawing copper coating on polyetheretherketone |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4005229A (en) * | 1975-06-23 | 1977-01-25 | Ppg Industries, Inc. | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures |
| US4167601A (en) * | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| DE3622090C1 (en) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
| US7410899B2 (en) * | 2005-09-20 | 2008-08-12 | Enthone, Inc. | Defectivity and process control of electroless deposition in microelectronics applications |
| EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
| EP2671969A1 (en) * | 2012-06-04 | 2013-12-11 | ATOTECH Deutschland GmbH | Plating bath for electroless deposition of nickel layers |
| CN103820773A (en) * | 2014-03-11 | 2014-05-28 | 上海贺鸿电子有限公司 | Solution used for laser antenna LDS plated copper and use method of solution |
| TWI707061B (en) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | Plating bath composition and method for electroless plating of palladium |
| US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1254935B (en) * | 1960-12-31 | 1967-11-23 | Bayer Ag | Aqueous bath for chemical deposition of boron-containing metal coatings |
| DE1621352C3 (en) * | 1967-02-03 | 1975-05-28 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Stabilized alkaline copper bath for the electroless deposition of copper |
-
1970
- 1970-05-21 US US39503A patent/US3649308A/en not_active Expired - Lifetime
- 1970-05-25 NL NL7007510A patent/NL7007510A/xx unknown
- 1970-05-27 FR FR7019372A patent/FR2088202B1/fr not_active Expired
-
1971
- 1971-04-15 NL NL717105020A patent/NL144667B/en unknown
- 1971-05-14 FR FR7117546A patent/FR2091636A5/fr not_active Expired
- 1971-05-17 DE DE19712124330 patent/DE2124330B2/en not_active Withdrawn
- 1971-05-17 DE DE2124331A patent/DE2124331C3/en not_active Expired
- 1971-05-18 SE SE06452/71A patent/SE366069B/xx unknown
- 1971-05-21 GB GB1643771A patent/GB1324895A/en not_active Expired
- 1971-05-21 GB GB1643571A patent/GB1324827A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2671988C1 (en) * | 2017-10-02 | 2018-11-08 | Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" | Application process of drawing copper coating on polyetheretherketone |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7105020A (en) | 1971-11-23 |
| US3649308A (en) | 1972-03-14 |
| DE2124331A1 (en) | 1971-12-02 |
| DE2124330A1 (en) | 1971-12-02 |
| DE2124331B2 (en) | 1976-05-20 |
| DE2124331C3 (en) | 1982-11-11 |
| FR2088202B1 (en) | 1975-01-10 |
| SE366069B (en) | 1974-04-08 |
| DE2124330B2 (en) | 1976-05-20 |
| NL7007510A (en) | 1971-11-29 |
| FR2091636A5 (en) | 1972-01-14 |
| NL144667B (en) | 1975-01-15 |
| FR2088202A1 (en) | 1972-01-07 |
| GB1324827A (en) | 1973-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1324895A (en) | Stabilized electroless copper plating solutions | |
| US3485643A (en) | Electroless copper plating | |
| GB1310610A (en) | Electro-less nickel plating compositions | |
| ES375193A1 (en) | Electroless copper plating bath | |
| US3915718A (en) | Chemical silver bath | |
| GB1346273A (en) | Metal plating of plastics materials | |
| GB1315212A (en) | Electroless nickel and or cobalt plating solutions | |
| GB1051383A (en) | ||
| US1536859A (en) | Electroplating | |
| GB1304100A (en) | ||
| GB1432871A (en) | Silvering solutions | |
| GB1310306A (en) | Process for preparing metal-coated plastics materials | |
| GB1260390A (en) | Method of electrolessly nickel plating a substrate | |
| GB1322203A (en) | Method of electroless plating of gold | |
| GB1448831A (en) | Currentless plating of solid bodies with nickel | |
| GB1506496A (en) | Gold plating baths | |
| GB1039947A (en) | Improvements in or relating to gold plating | |
| JPH0414189B2 (en) | ||
| GB1302673A (en) | ||
| GB1500435A (en) | Electroless copper plating solution | |
| JPS5735675A (en) | Preventing method for decomposition of electroless copper plating bath | |
| KR800000192B1 (en) | Chemical plating solution | |
| GB1375020A (en) | ||
| GB1453174A (en) | Electroless plating | |
| GB1213314A (en) | Stabilized chemical coppering liquids |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |