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ES375193A1 - Electroless copper plating bath - Google Patents

Electroless copper plating bath

Info

Publication number
ES375193A1
ES375193A1 ES375193A ES375193A ES375193A1 ES 375193 A1 ES375193 A1 ES 375193A1 ES 375193 A ES375193 A ES 375193A ES 375193 A ES375193 A ES 375193A ES 375193 A1 ES375193 A1 ES 375193A1
Authority
ES
Spain
Prior art keywords
copper plating
plating bath
electroless copper
ions
chemical reduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES375193A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pernix Enthone SA
Original Assignee
Pernix Enthone SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pernix Enthone SA filed Critical Pernix Enthone SA
Publication of ES375193A1 publication Critical patent/ES375193A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)

Abstract

Chemical reduction copper plating process, especially copper plating of a metallic catalytic surface or made up of an activated synthetic material, characterized by the fact that it brings the catalytic surface into contact with an aqueous alkaline solution of chemical reduction copper plating that contains copper ions, a complexing agent for cupric ion, and a reducing agent for copper ions, to which a small amount of o-phenanthroline and iodide ions have been incorporated as a stabilizing agent. (Machine-translation by Google Translate, not legally binding)
ES375193A 1969-01-06 1970-01-05 Electroless copper plating bath Expired ES375193A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78940269A 1969-01-06 1969-01-06

Publications (1)

Publication Number Publication Date
ES375193A1 true ES375193A1 (en) 1973-08-16

Family

ID=25147540

Family Applications (1)

Application Number Title Priority Date Filing Date
ES375193A Expired ES375193A1 (en) 1969-01-06 1970-01-05 Electroless copper plating bath

Country Status (3)

Country Link
US (1) US3615736A (en)
ES (1) ES375193A1 (en)
GB (1) GB1286941A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (en) * 1975-03-14 1981-06-25
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
JPH04234765A (en) * 1990-08-29 1992-08-24 Xerox Corp Base body, belt and electrostatic photographic image forming member, and these manufacture
JP3052515B2 (en) * 1991-11-28 2000-06-12 上村工業株式会社 Electroless copper plating bath and plating method
JP2001073182A (en) * 1999-07-15 2001-03-21 Boc Group Inc:The Improved acidic copper electroplating solution
GB2385863A (en) * 2001-10-29 2003-09-03 Qinetiq Ltd High resolution patterning method
US20060063382A1 (en) * 2004-09-17 2006-03-23 Dubin Valery M Method to fabricate copper-cobalt interconnects
DE102010012204B4 (en) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Improved process for direct metallization of non-conductive substrates
EP2862959A1 (en) * 2013-10-21 2015-04-22 ATOTECH Deutschland GmbH Method of selectively treating copper in the presence of further metal
JP6733016B1 (en) * 2019-07-17 2020-07-29 上村工業株式会社 Electroless copper plating bath
KR20210019752A (en) * 2019-08-13 2021-02-23 삼성전기주식회사 Composition for electroless copper plating and method for electroless plating using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377144A (en) * 1965-04-08 1968-04-09 Paragon Die Casting Company Speaker grill

Also Published As

Publication number Publication date
US3615736A (en) 1971-10-26
GB1286941A (en) 1972-08-31
DE2000320B2 (en) 1976-04-22
DE2000320A1 (en) 1970-07-16

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