ES375193A1 - Electroless copper plating bath - Google Patents
Electroless copper plating bathInfo
- Publication number
- ES375193A1 ES375193A1 ES375193A ES375193A ES375193A1 ES 375193 A1 ES375193 A1 ES 375193A1 ES 375193 A ES375193 A ES 375193A ES 375193 A ES375193 A ES 375193A ES 375193 A1 ES375193 A1 ES 375193A1
- Authority
- ES
- Spain
- Prior art keywords
- copper plating
- plating bath
- electroless copper
- ions
- chemical reduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
Chemical reduction copper plating process, especially copper plating of a metallic catalytic surface or made up of an activated synthetic material, characterized by the fact that it brings the catalytic surface into contact with an aqueous alkaline solution of chemical reduction copper plating that contains copper ions, a complexing agent for cupric ion, and a reducing agent for copper ions, to which a small amount of o-phenanthroline and iodide ions have been incorporated as a stabilizing agent. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78940269A | 1969-01-06 | 1969-01-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES375193A1 true ES375193A1 (en) | 1973-08-16 |
Family
ID=25147540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES375193A Expired ES375193A1 (en) | 1969-01-06 | 1970-01-05 | Electroless copper plating bath |
Country Status (3)
Country | Link |
---|---|
US (1) | US3615736A (en) |
ES (1) | ES375193A1 (en) |
GB (1) | GB1286941A (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627594B2 (en) * | 1975-03-14 | 1981-06-25 | ||
US4217182A (en) * | 1978-06-07 | 1980-08-12 | Litton Systems, Inc. | Semi-additive process of manufacturing a printed circuit |
US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
US4751106A (en) * | 1986-09-25 | 1988-06-14 | Shipley Company Inc. | Metal plating process |
JPH04234765A (en) * | 1990-08-29 | 1992-08-24 | Xerox Corp | Base body, belt and electrostatic photographic image forming member, and these manufacture |
JP3052515B2 (en) * | 1991-11-28 | 2000-06-12 | 上村工業株式会社 | Electroless copper plating bath and plating method |
JP2001073182A (en) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | Improved acidic copper electroplating solution |
GB2385863A (en) * | 2001-10-29 | 2003-09-03 | Qinetiq Ltd | High resolution patterning method |
US20060063382A1 (en) * | 2004-09-17 | 2006-03-23 | Dubin Valery M | Method to fabricate copper-cobalt interconnects |
DE102010012204B4 (en) * | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Improved process for direct metallization of non-conductive substrates |
EP2862959A1 (en) * | 2013-10-21 | 2015-04-22 | ATOTECH Deutschland GmbH | Method of selectively treating copper in the presence of further metal |
JP6733016B1 (en) * | 2019-07-17 | 2020-07-29 | 上村工業株式会社 | Electroless copper plating bath |
KR20210019752A (en) * | 2019-08-13 | 2021-02-23 | 삼성전기주식회사 | Composition for electroless copper plating and method for electroless plating using the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377144A (en) * | 1965-04-08 | 1968-04-09 | Paragon Die Casting Company | Speaker grill |
-
1969
- 1969-01-06 US US789402A patent/US3615736A/en not_active Expired - Lifetime
-
1970
- 1970-01-05 ES ES375193A patent/ES375193A1/en not_active Expired
- 1970-01-05 GB GB460/70A patent/GB1286941A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3615736A (en) | 1971-10-26 |
GB1286941A (en) | 1972-08-31 |
DE2000320B2 (en) | 1976-04-22 |
DE2000320A1 (en) | 1970-07-16 |
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