[go: up one dir, main page]

ES405960A2 - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
ES405960A2
ES405960A2 ES405960A ES405960A ES405960A2 ES 405960 A2 ES405960 A2 ES 405960A2 ES 405960 A ES405960 A ES 405960A ES 405960 A ES405960 A ES 405960A ES 405960 A2 ES405960 A2 ES 405960A2
Authority
ES
Spain
Prior art keywords
formaldehyde
copper
solution
source
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES405960A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of ES405960A2 publication Critical patent/ES405960A2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Improvements introduced in the object of the main patent no. 370,451 granted on may 6, 1971, by: "improvements in the preparation of aqueous solutions for chemical copper, capable of depositing ductile copper and comprising a source of cupric ions, hydroxyl radicals, a source of formaldehyde and sufficient complexing agent to make said cupric ions soluble in alkaline solution, characterized in that they comprise adding a formaldehyde addition agent to the solution in an amount of at least 1 mole, per 100 moles of formaldehyde until an amount that restricts the deposition of copper from the solution. (Machine-translation by Google Translate, not legally binding)
ES405960A 1971-08-23 1972-08-18 Electroless copper plating Expired ES405960A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17415771A 1971-08-23 1971-08-23

Publications (1)

Publication Number Publication Date
ES405960A2 true ES405960A2 (en) 1975-09-16

Family

ID=22635075

Family Applications (1)

Application Number Title Priority Date Filing Date
ES405960A Expired ES405960A2 (en) 1971-08-23 1972-08-18 Electroless copper plating

Country Status (5)

Country Link
US (1) US3728137A (en)
BE (1) BE787837R (en)
ES (1) ES405960A2 (en)
FR (1) FR2150431B2 (en)
IT (1) IT1044885B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4324589A (en) * 1979-02-05 1982-04-13 Shipley Company Inc. Solute monitoring process
EP0109015A1 (en) * 1982-11-15 1984-05-23 Shipley Company Inc. Electroless copper plating
US4539044A (en) * 1982-11-15 1985-09-03 Shipley Company Inc. Electroless copper plating
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US6395402B1 (en) 1999-06-09 2002-05-28 Laird Technologies, Inc. Electrically conductive polymeric foam and method of preparation thereof
JP2006093651A (en) * 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture

Also Published As

Publication number Publication date
FR2150431B2 (en) 1975-03-07
FR2150431A2 (en) 1973-04-06
IT1044885B (en) 1980-04-21
BE787837R (en) 1972-12-18
US3728137A (en) 1973-04-17

Similar Documents

Publication Publication Date Title
GB924049A (en) Electroless plating of copper
ES314564A2 (en) A procedure for the copper inelectric coating. (Machine-translation by Google Translate, not legally binding)
ES405960A2 (en) Electroless copper plating
ES8701853A1 (en) Formaldehyde-free autocatalytic electroless copper plating
GB1334879A (en) Regeneration of electroless nickel plating baths
ES485980A1 (en) Process for the chemical deposition of gold by autocatalytic reduction
ES375193A1 (en) Electroless copper plating bath
GB1263445A (en) Ductility promoter and stabilizer for electroless plating baths
ES434868A1 (en) Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization
GB1194625A (en) Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition
SE8302798L (en) WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH
GB1411429A (en) Replenishment of electroless copper solutions
GB1195330A (en) Electroless Copper Plating
ES370451A1 (en) Electroless copper plating
JPS56271A (en) Non-electrolytic copper plating solution
GB1218850A (en) Improvements in autocatalytic copper plating solutions
GB1097848A (en) Electroless copper deposition
GB1071550A (en) Chemical deposition of copper and solutions therefor
GB1262060A (en) Method of electrolessly plating a substrate
GB1058915A (en) Autocatalytic metal plating
GB1227143A (en)
GB1135159A (en) Chemical deposition of copper and solutions therefor
GB1343747A (en) Electroless deposition of substantially pure cadmium and cadmium copper alloys
GB1315213A (en) Electroless nickel plating solutions
ES375455A1 (en) A method of preparing a composition derived from the hemicellulose. (Machine-translation by Google Translate, not legally binding)

Legal Events

Date Code Title Description
FD2A Announcement of lapse in spain

Effective date: 20170704