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GB1324827A - Stabilized electroless nickel and or cobalt plating solutions - Google Patents

Stabilized electroless nickel and or cobalt plating solutions

Info

Publication number
GB1324827A
GB1324827A GB1643571A GB1643571A GB1324827A GB 1324827 A GB1324827 A GB 1324827A GB 1643571 A GB1643571 A GB 1643571A GB 1643571 A GB1643571 A GB 1643571A GB 1324827 A GB1324827 A GB 1324827A
Authority
GB
United Kingdom
Prior art keywords
compound
electroless
cooh
stabilizer
aryl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1643571A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7007511A external-priority patent/NL7007511A/xx
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of GB1324827A publication Critical patent/GB1324827A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1324827 Electroless Ni and/or Co plating SHIPLEY CO Inc 21 May 1971 [21 May 1970] 16435/71 Addition to 1315212 Heading C7F An aqueous electroless plating solution contains a source of nickel and/or cobalt ions, a reducing agent, a pH adjuster, and as stabilizer, a covalent Hg compound. The reducing agent may be a hypophosphite or a borane; a complexing agent may be present, as may a known stabilizer to co-act with the Hg compound. The Hg compound is preferably R-Hg-R' where R is alkyl, cycloalkyl, aryl, aralkyl, alkaryl, alkoxy, aryloxy or heterocyclic and R' is R or a polar group such as -NO 2 , -SO 2 OH or -SO 2 OM (M is alkali metal) -COOH or -COOM, -NH 2 , -Cl, -Br, -I, -OH or -CN; many examples are given; a preferred amount is 1-100 p.p.m. in the solution. The known stabilizer may be Na 2 S, K 2 S, Na or K polysulphide, a thiocyanate, Na or K thiosulphate, thiourea, 2-mercaptobenzothiazole, 1,2, ethanedithiole, 1, 2-benzoisothiazane, methionine, 2,2'-thiodiethanol dithioglycol, thioglycollic acid, a water-soluble cyanide, e.g. NaCN or KCN, an α-hydroxynitirle iminodiacetonitrile, or 3, 3'-iminodipropionitrile (trace to 300 p.p.m.), an iodate or Pb<SP>+</SP> (< 50ppm) or R<SP>2</SP> - C # CH or R<SP>3</SP> - C # C-R<SP>4</SP> where R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> are lower monovalent hydroxyalkyl, cyclohydroxy-alkyl or hydroxyalkyl ether groups or aryl, aliphatic or cyloaliphatic substituted with a water solubilizing group such as -OH or -COOH. Cotton cloth is cleaned, sensitized with SnCl 2 /PdCl 2 or else with a precious metalstannic colloid, and electroless plated with the above solution.
GB1643571A 1970-05-21 1971-05-21 Stabilized electroless nickel and or cobalt plating solutions Expired GB1324827A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3950370A 1970-05-21 1970-05-21
NL7007511A NL7007511A (en) 1970-05-25 1970-05-25
NL7007510A NL7007510A (en) 1970-05-21 1970-05-25
FR7019372A FR2088202B1 (en) 1970-05-21 1970-05-27

Publications (1)

Publication Number Publication Date
GB1324827A true GB1324827A (en) 1973-07-25

Family

ID=27446064

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1643771A Expired GB1324895A (en) 1970-05-21 1971-05-21 Stabilized electroless copper plating solutions
GB1643571A Expired GB1324827A (en) 1970-05-21 1971-05-21 Stabilized electroless nickel and or cobalt plating solutions

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1643771A Expired GB1324895A (en) 1970-05-21 1971-05-21 Stabilized electroless copper plating solutions

Country Status (6)

Country Link
US (1) US3649308A (en)
DE (2) DE2124330B2 (en)
FR (2) FR2088202B1 (en)
GB (2) GB1324895A (en)
NL (2) NL7007510A (en)
SE (1) SE366069B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
DE3622090C1 (en) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
CN103820773A (en) * 2014-03-11 2014-05-28 上海贺鸿电子有限公司 Solution used for laser antenna LDS plated copper and use method of solution
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
RU2671988C1 (en) * 2017-10-02 2018-11-08 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Application process of drawing copper coating on polyetheretherketone

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1254935B (en) * 1960-12-31 1967-11-23 Bayer Ag Aqueous bath for chemical deposition of boron-containing metal coatings
DE1621352C3 (en) * 1967-02-03 1975-05-28 Schering Ag, 1000 Berlin Und 4619 Bergkamen Stabilized alkaline copper bath for the electroless deposition of copper

Also Published As

Publication number Publication date
NL7105020A (en) 1971-11-23
US3649308A (en) 1972-03-14
DE2124331A1 (en) 1971-12-02
DE2124330A1 (en) 1971-12-02
DE2124331B2 (en) 1976-05-20
DE2124331C3 (en) 1982-11-11
FR2088202B1 (en) 1975-01-10
SE366069B (en) 1974-04-08
DE2124330B2 (en) 1976-05-20
NL7007510A (en) 1971-11-29
FR2091636A5 (en) 1972-01-14
NL144667B (en) 1975-01-15
FR2088202A1 (en) 1972-01-07
GB1324895A (en) 1973-07-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee