[go: up one dir, main page]

FR2957193B1 - Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante - Google Patents

Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante

Info

Publication number
FR2957193B1
FR2957193B1 FR1051526A FR1051526A FR2957193B1 FR 2957193 B1 FR2957193 B1 FR 2957193B1 FR 1051526 A FR1051526 A FR 1051526A FR 1051526 A FR1051526 A FR 1051526A FR 2957193 B1 FR2957193 B1 FR 2957193B1
Authority
FR
France
Prior art keywords
bured
insulating layer
under
data path
control grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1051526A
Other languages
English (en)
Other versions
FR2957193A1 (fr
Inventor
Carlos Mazure
Richard Ferrant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1051526A priority Critical patent/FR2957193B1/fr
Priority to TW099143864A priority patent/TWI436480B/zh
Priority to SG2010093110A priority patent/SG173946A1/en
Priority to CN2010105957092A priority patent/CN102194820A/zh
Priority to KR1020100129299A priority patent/KR101178149B1/ko
Priority to EP10195783A priority patent/EP2363886A1/fr
Priority to JP2010282122A priority patent/JP2011181896A/ja
Priority to US13/007,483 priority patent/US8432216B2/en
Priority to US13/013,580 priority patent/US8508289B2/en
Priority to PCT/EP2011/052413 priority patent/WO2011107355A1/fr
Priority to PCT/EP2011/052421 priority patent/WO2011107356A1/fr
Publication of FR2957193A1 publication Critical patent/FR2957193A1/fr
Application granted granted Critical
Publication of FR2957193B1 publication Critical patent/FR2957193B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6706—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing leakage current 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
FR1051526A 2009-12-08 2010-03-03 Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante Active FR2957193B1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR1051526A FR2957193B1 (fr) 2010-03-03 2010-03-03 Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante
TW099143864A TWI436480B (zh) 2010-03-03 2010-12-15 在ＳｅＯＩ基板上之具有在絕緣層之下的埋入式後控制閘之資料路徑單元
SG2010093110A SG173946A1 (en) 2010-03-03 2010-12-15 DATA PATH CELL ON AN SeOI SUBSTRATE WITH A BURIED BACK CONTROL GATE BENEATH THE INSULATING LAYER
KR1020100129299A KR101178149B1 (ko) 2010-03-03 2010-12-16 절연층 아래에 매립 후면 제어 게이트를 가지는 ＳｅＯＩ 기판 상의 데이터 경로 셀
CN2010105957092A CN102194820A (zh) 2010-03-03 2010-12-16 具有绝缘层下埋入背控制栅极的SeOI衬底上的数据通路单元
JP2010282122A JP2011181896A (ja) 2010-03-03 2010-12-17 絶縁層の下の埋め込み裏面制御ゲートを有するＳｅＯＩ基板上のデータパスセル
EP10195783A EP2363886A1 (fr) 2010-03-03 2010-12-17 Cellule de chemin de données sur un substrat SeOI avec barrière de contrôle arrière enterrée au dessous du film d'isolation
US13/007,483 US8432216B2 (en) 2010-03-03 2011-01-14 Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer
US13/013,580 US8508289B2 (en) 2009-12-08 2011-01-25 Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer
PCT/EP2011/052413 WO2011107355A1 (fr) 2010-03-03 2011-02-18 Cellule de chemin de données sur un substrat seoi avec une grille de contrôle arrière sous la couche isolante
PCT/EP2011/052421 WO2011107356A1 (fr) 2010-03-03 2011-02-18 Cellule de chemin de données sur un substrat seoi avec une grille de contrôle arrière sous la couche isolante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1051526A FR2957193B1 (fr) 2010-03-03 2010-03-03 Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante

Publications (2)

Publication Number Publication Date
FR2957193A1 FR2957193A1 (fr) 2011-09-09
FR2957193B1 true FR2957193B1 (fr) 2012-04-20

Family

ID=42669823

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1051526A Active FR2957193B1 (fr) 2009-12-08 2010-03-03 Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante

Country Status (9)

Country Link
US (1) US8432216B2 (fr)
EP (1) EP2363886A1 (fr)
JP (1) JP2011181896A (fr)
KR (1) KR101178149B1 (fr)
CN (1) CN102194820A (fr)
FR (1) FR2957193B1 (fr)
SG (1) SG173946A1 (fr)
TW (1) TWI436480B (fr)
WO (1) WO2011107355A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2987710B1 (fr) 2012-03-05 2017-04-28 Soitec Silicon On Insulator Architecture de table de correspondance
US9672316B2 (en) * 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
FR3009149A1 (fr) 2013-07-24 2015-01-30 St Microelectronics Sa Element a retard variable
US10062680B2 (en) 2014-05-08 2018-08-28 Qualcomm Incorporated Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) standard library cell circuits having a gate back-bias rail(s), and related systems and methods
US9634697B2 (en) 2015-09-09 2017-04-25 Qualcomm Incorporated Antenna selection and tuning
US10348243B2 (en) * 2016-07-19 2019-07-09 Globalfoundries Inc. Switched capacitor circuit structure with method of controlling source-drain resistance across same
US10374092B2 (en) * 2017-04-17 2019-08-06 Globalfoundries Inc. Power amplifier ramping and power control with forward and reverse back-gate bias
US10043826B1 (en) * 2017-07-26 2018-08-07 Qualcomm Incorporated Fully depleted silicon on insulator integration
US11152396B2 (en) 2017-12-26 2021-10-19 Intel Corporation Semiconductor device having stacked transistors and multiple threshold voltage control

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169233A (en) 1978-02-24 1979-09-25 Rockwell International Corporation High performance CMOS sense amplifier
KR100213602B1 (ko) 1988-05-13 1999-08-02 가나이 쓰도무 다이나믹형 반도체 기억장치
US5028810A (en) 1989-07-13 1991-07-02 Intel Corporation Four quadrant synapse cell employing single column summing line
JPH04345064A (ja) 1991-05-22 1992-12-01 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP2717740B2 (ja) 1991-08-30 1998-02-25 三菱電機株式会社 半導体集積回路装置
EP0836194B1 (fr) 1992-03-30 2000-05-24 Mitsubishi Denki Kabushiki Kaisha Dispositif à semi-conducteurs
JPH0621455A (ja) * 1992-06-30 1994-01-28 Sanyo Electric Co Ltd 薄膜トランジスタ
US5325054A (en) 1992-07-07 1994-06-28 Texas Instruments Incorporated Method and system for screening reliability of semiconductor circuits
US5306530A (en) 1992-11-23 1994-04-26 Associated Universities, Inc. Method for producing high quality thin layer films on substrates
JP3488730B2 (ja) * 1993-11-05 2004-01-19 株式会社ルネサステクノロジ 半導体集積回路装置
US5455791A (en) 1994-06-01 1995-10-03 Zaleski; Andrzei Method for erasing data in EEPROM devices on SOI substrates and device therefor
JP3003088B2 (ja) 1994-06-10 2000-01-24 住友イートンノバ株式会社 イオン注入装置
JP3549602B2 (ja) 1995-01-12 2004-08-04 株式会社ルネサステクノロジ 半導体記憶装置
JPH08255846A (ja) 1995-03-17 1996-10-01 Nippondenso Co Ltd 半導体装置及びその製造方法
JP3288554B2 (ja) 1995-05-29 2002-06-04 株式会社日立製作所 イオン注入装置及びイオン注入方法
JPH0982814A (ja) 1995-07-10 1997-03-28 Denso Corp 半導体集積回路装置及びその製造方法
US6787844B2 (en) 1995-09-29 2004-09-07 Nippon Steel Corporation Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
JP3265178B2 (ja) 1996-02-20 2002-03-11 株式会社東芝 半導体記憶装置及びその製造方法
JPH10125064A (ja) 1996-10-14 1998-05-15 Toshiba Corp 記憶装置
JPH10208484A (ja) 1997-01-29 1998-08-07 Mitsubishi Electric Corp 半導体記憶装置のデータ読出回路及び半導体記憶装置
US5889293A (en) 1997-04-04 1999-03-30 International Business Machines Corporation Electrical contact to buried SOI structures
US5982004A (en) * 1997-06-20 1999-11-09 Hong Kong University Of Science & Technology Polysilicon devices and a method for fabrication thereof
JPH11150276A (ja) * 1997-11-19 1999-06-02 Nec Corp 電界効果型トランジスタ
JP3699823B2 (ja) 1998-05-19 2005-09-28 株式会社東芝 半導体装置
US6072217A (en) * 1998-06-11 2000-06-06 Sun Microsystems, Inc. Tunable threshold SOI device using isolated well structure for back gate
FR2779869B1 (fr) 1998-06-15 2003-05-16 Commissariat Energie Atomique Circuit integre de type soi a capacite de decouplage, et procede de realisation d'un tel circuit
US6826730B2 (en) 1998-12-15 2004-11-30 Texas Instruments Incorporated System and method for controlling current in an integrated circuit
JP3456913B2 (ja) 1998-12-25 2003-10-14 株式会社東芝 半導体装置
US6372600B1 (en) 1999-08-30 2002-04-16 Agere Systems Guardian Corp. Etch stops and alignment marks for bonded wafers
US6476462B2 (en) 1999-12-28 2002-11-05 Texas Instruments Incorporated MOS-type semiconductor device and method for making same
US6417697B2 (en) 2000-02-02 2002-07-09 Broadcom Corporation Circuit technique for high speed low power data transfer bus
US6300218B1 (en) 2000-05-08 2001-10-09 International Business Machines Corporation Method for patterning a buried oxide thickness for a separation by implanted oxygen (simox) process
US6602765B2 (en) * 2000-06-12 2003-08-05 Seiko Epson Corporation Fabrication method of thin-film semiconductor device
US6350653B1 (en) 2000-10-12 2002-02-26 International Business Machines Corporation Embedded DRAM on silicon-on-insulator substrate
JP2002164544A (ja) * 2000-11-28 2002-06-07 Sony Corp 半導体装置
US6614190B2 (en) 2001-01-31 2003-09-02 Hitachi, Ltd. Ion implanter
JP3982218B2 (ja) 2001-02-07 2007-09-26 ソニー株式会社 半導体装置およびその製造方法
JP3884266B2 (ja) 2001-02-19 2007-02-21 株式会社東芝 半導体メモリ装置及びその製造方法
US6611023B1 (en) 2001-05-01 2003-08-26 Advanced Micro Devices, Inc. Field effect transistor with self alligned double gate and method of forming same
US6759282B2 (en) 2001-06-12 2004-07-06 International Business Machines Corporation Method and structure for buried circuits and devices
US6498057B1 (en) 2002-03-07 2002-12-24 International Business Machines Corporation Method for implementing SOI transistor source connections using buried dual rail distribution
EP1357603A3 (fr) 2002-04-18 2004-01-14 Innovative Silicon SA Dispositif semiconducteur
US6838723B2 (en) 2002-08-29 2005-01-04 Micron Technology, Inc. Merged MOS-bipolar capacitor memory cell
US7710771B2 (en) 2002-11-20 2010-05-04 The Regents Of The University Of California Method and apparatus for capacitorless double-gate storage
JP2004179506A (ja) 2002-11-28 2004-06-24 Seiko Epson Corp Ｓｏｉ構造を有する半導体基板及びその製造方法及び半導体装置
US7030436B2 (en) 2002-12-04 2006-04-18 Micron Technology, Inc. Embedded DRAM gain memory cell having MOS transistor body provided with a bi-polar transistor charge injecting means
JP2004303499A (ja) 2003-03-31 2004-10-28 Hitachi High-Technologies Corp イオン注入装置およびイオン注入方法
JP4077381B2 (ja) 2003-08-29 2008-04-16 株式会社東芝 半導体集積回路装置
US6965143B2 (en) 2003-10-10 2005-11-15 Advanced Micro Devices, Inc. Recess channel flash architecture for reduced short channel effect
JP2005158952A (ja) 2003-11-25 2005-06-16 Toshiba Corp 半導体装置及びその製造方法
US7109532B1 (en) 2003-12-23 2006-09-19 Lee Zachary K High Ion/Ioff SOI MOSFET using body voltage control
US20050255666A1 (en) 2004-05-11 2005-11-17 Miradia Inc. Method and structure for aligning mechanical based device to integrated circuits
US7112997B1 (en) * 2004-05-19 2006-09-26 Altera Corporation Apparatus and methods for multi-gate silicon-on-insulator transistors
JP4795653B2 (ja) 2004-06-15 2011-10-19 ルネサスエレクトロニクス株式会社 半導体記憶装置
US7196921B2 (en) 2004-07-19 2007-03-27 Silicon Storage Technology, Inc. High-speed and low-power differential non-volatile content addressable memory cell and array
US7190616B2 (en) 2004-07-19 2007-03-13 Micron Technology, Inc. In-service reconfigurable DRAM and flash memory device
JP4664631B2 (ja) * 2004-08-05 2011-04-06 株式会社東芝 半導体装置及びその製造方法
US7560361B2 (en) 2004-08-12 2009-07-14 International Business Machines Corporation Method of forming gate stack for semiconductor electronic device
KR100663359B1 (ko) 2005-03-31 2007-01-02 삼성전자주식회사 리세스 채널 트랜지스터 구조를 갖는 단일 트랜지스터플로팅 바디 디램 셀 및 그 제조방법
US20060267064A1 (en) 2005-05-31 2006-11-30 Infineon Technologies Ag Semiconductor memory device
US7274618B2 (en) 2005-06-24 2007-09-25 Monolithic System Technology, Inc. Word line driver for DRAM embedded in a logic process
JP4967264B2 (ja) 2005-07-11 2012-07-04 株式会社日立製作所 半導体装置
JP4800700B2 (ja) 2005-08-01 2011-10-26 ルネサスエレクトロニクス株式会社 半導体装置およびそれを用いた半導体集積回路
US7314794B2 (en) 2005-08-08 2008-01-01 International Business Machines Corporation Low-cost high-performance planar back-gate CMOS
JP4413841B2 (ja) 2005-10-03 2010-02-10 株式会社東芝 半導体記憶装置及びその製造方法
JP4822791B2 (ja) 2005-10-04 2011-11-24 ルネサスエレクトロニクス株式会社 半導体記憶装置
US7592841B2 (en) * 2006-05-11 2009-09-22 Dsm Solutions, Inc. Circuit configurations having four terminal JFET devices
US7601271B2 (en) 2005-11-28 2009-10-13 S.O.I.Tec Silicon On Insulator Technologies Process and equipment for bonding by molecular adhesion
JP5054919B2 (ja) 2005-12-20 2012-10-24 ルネサスエレクトロニクス株式会社 半導体集積回路装置
KR100735613B1 (ko) 2006-01-11 2007-07-04 삼성전자주식회사 이온주입설비의 디스크 어셈블리
US7304903B2 (en) 2006-01-23 2007-12-04 Purdue Research Foundation Sense amplifier circuit
JP4762036B2 (ja) 2006-04-14 2011-08-31 株式会社東芝 半導体装置
JPWO2007125775A1 (ja) 2006-04-24 2009-09-10 パナソニック株式会社 受信装置、それを用いた電子機器、及び受信方法
US7494902B2 (en) 2006-06-23 2009-02-24 Interuniversitair Microelektronica Centrum Vzw (Imec) Method of fabricating a strained multi-gate transistor
KR100843055B1 (ko) 2006-08-17 2008-07-01 주식회사 하이닉스반도체 플래쉬 메모리 소자 및 그의 제조방법
US7560344B2 (en) 2006-11-15 2009-07-14 Samsung Electronics Co., Ltd. Semiconductor device having a pair of fins and method of manufacturing the same
JP2008130670A (ja) 2006-11-17 2008-06-05 Seiko Epson Corp 半導体装置、論理回路および電子機器
JP5057430B2 (ja) 2006-12-18 2012-10-24 ルネサスエレクトロニクス株式会社 半導体集積回路とその製造方法
JP4869088B2 (ja) * 2007-01-22 2012-02-01 株式会社東芝 半導体記憶装置及びその書き込み方法
JP5019436B2 (ja) 2007-02-22 2012-09-05 ルネサスエレクトロニクス株式会社 半導体集積回路
JP5594927B2 (ja) 2007-04-11 2014-09-24 ピーエスフォー ルクスコ エスエイアールエル 半導体記憶装置
FR2915024A1 (fr) 2007-04-12 2008-10-17 St Microelectronics Crolles 2 Procede de fabrication permettant l'homogeneisation de l'environnement de transistors et dispositif associe
US7729149B2 (en) 2007-05-01 2010-06-01 Suvolta, Inc. Content addressable memory cell including a junction field effect transistor
EP2015362A1 (fr) 2007-06-04 2009-01-14 STMicroelectronics (Crolles 2) SAS Matrice à semi-conducteurs et procédé de fabrication correspondant
US7449922B1 (en) 2007-06-15 2008-11-11 Arm Limited Sensing circuitry and method of detecting a change in voltage on at least one input line
US7759714B2 (en) 2007-06-26 2010-07-20 Hitachi, Ltd. Semiconductor device
FR2918823B1 (fr) 2007-07-13 2009-10-16 Ecole Centrale De Lyon Etablis Cellule logique reconfigurable a base de transistors mosfet double grille
FR2919112A1 (fr) 2007-07-16 2009-01-23 St Microelectronics Crolles 2 Circuit integre comprenant un transistor et un condensateur et procede de fabrication
JP5049691B2 (ja) * 2007-08-06 2012-10-17 株式会社日立製作所 半導体集積回路
JP5035345B2 (ja) 2007-08-30 2012-09-26 富士通セミコンダクター株式会社 イオン注入装置、基板クランプ機構、及びイオン注入方法
KR100884344B1 (ko) 2007-10-10 2009-02-18 주식회사 하이닉스반도체 비대칭 소스/드레인 접합을 갖는 불휘발성 메모리소자 및그 제조방법
JP5222520B2 (ja) 2007-10-11 2013-06-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20090101940A1 (en) * 2007-10-19 2009-04-23 Barrows Corey K Dual gate fet structures for flexible gate array design methodologies
DE102007052097B4 (de) 2007-10-31 2010-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Herstellung eines SOI-Bauelements mit einer Substratdiode
FR2925223B1 (fr) 2007-12-18 2010-02-19 Soitec Silicon On Insulator Procede d'assemblage avec marques enterrees
US7593265B2 (en) 2007-12-28 2009-09-22 Sandisk Corporation Low noise sense amplifier array and method for nonvolatile memory
US8148242B2 (en) 2008-02-20 2012-04-03 Soitec Oxidation after oxide dissolution
JP6053250B2 (ja) 2008-06-12 2016-12-27 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置
WO2010007478A1 (fr) * 2008-06-13 2010-01-21 Yale University Dispositifs à semi-conducteurs à oxyde de métal complémentaire améliorés
US8120110B2 (en) 2008-08-08 2012-02-21 International Business Machines Corporation Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate
US8012814B2 (en) 2008-08-08 2011-09-06 International Business Machines Corporation Method of forming a high performance fet and a high voltage fet on a SOI substrate
KR101623958B1 (ko) 2008-10-01 2016-05-25 삼성전자주식회사 인버터 및 그의 동작방법과 인버터를 포함하는 논리회로
KR101522400B1 (ko) 2008-11-10 2015-05-21 삼성전자주식회사 인버터 및 그를 포함하는 논리소자

Also Published As

Publication number Publication date
US20110215860A1 (en) 2011-09-08
KR20110100130A (ko) 2011-09-09
TW201140830A (en) 2011-11-16
JP2011181896A (ja) 2011-09-15
TWI436480B (zh) 2014-05-01
KR101178149B1 (ko) 2012-08-29
SG173946A1 (en) 2011-09-29
FR2957193A1 (fr) 2011-09-09
WO2011107355A1 (fr) 2011-09-09
US8432216B2 (en) 2013-04-30
CN102194820A (zh) 2011-09-21
EP2363886A1 (fr) 2011-09-07

Similar Documents

Publication Publication Date Title
FR2957193B1 (fr) Cellule a chemin de donnees sur substrat seoi avec grille de controle arriere enterree sous la couche isolante
FR2922886B1 (fr) Substrat verrier revetu de couches a resistivite amelioree.
EP2698356A4 (fr) Substrat de verre antireflet
TWI563592B (en) Thermal plate and substrate support assembly comprising the thermal plate and method for manufacturing the thermal plate
DK3115194T3 (da) Gulvpanel med en opskummet syntetisk materialeplade som substrat
EP3079911A4 (fr) Fabrication de couche à base d'encre en utilisant la création de grisés pour contrôler une épaisseur
EP2787638A4 (fr) Substrat composite
FR2972446B1 (fr) Substrat pour cellule photovoltaique
FR2928461B1 (fr) Substrat transparent comportant un revetement antireflet
EP2273476A4 (fr) Substrat transparent
EP2168171A4 (fr) Cellule solaire à composé iii-v en couche mince
DK2844487T4 (da) Fleksibelt substrat med integreret kredsløb
EP2628186A4 (fr) Dispositif semi-conducteur vertical à substrat aminci
EP2880693A4 (fr) Photocathode comprenant un substrat de silicium ayant une couche de bore
PL2797745T3 (pl) Nanoszenie polimerów na podłoża przy użyciu technik natryskiwania cieplnego
FR3002534B1 (fr) Substrat revetu d'un empilement bas-emissif.
EP2579276A4 (fr) Film conducteur transparent et substrat conducteur l'utilisant
FR2953643B1 (fr) Cellule memoire flash sur seoi disposant d'une seconde grille de controle enterree sous la couche isolante
ATE525994T1 (de) Saugfähiger artikel mit bedruckter schicht
FR2964785B1 (fr) Dispositif multiplicateur d'électrons a couche de nanodiamant.
FR2996854B1 (fr) Ruban adhesif technique a haute resistance a l'abrasion avec support a double couche.
FR2962593B1 (fr) Procede d'assemblage d'une puce dans un substrat souple.
DK2753418T3 (da) Fremgangsmåde til overtrækning af et substrat med et polymerlag
EP2657331A4 (fr) Substrat de culture et film de culture
EP2784829A4 (fr) Cellule photovoltaïque cis/cigs comprenant une couche arrière d'oct et procédé de fabrication associé

Legal Events

Date Code Title Description
CD Change of name or company name

Owner name: SOITEC, FR

Effective date: 20120423

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16