FR2953641B1 - Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante - Google Patents
Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolanteInfo
- Publication number
- FR2953641B1 FR2953641B1 FR0958747A FR0958747A FR2953641B1 FR 2953641 B1 FR2953641 B1 FR 2953641B1 FR 0958747 A FR0958747 A FR 0958747A FR 0958747 A FR0958747 A FR 0958747A FR 2953641 B1 FR2953641 B1 FR 2953641B1
- Authority
- FR
- France
- Prior art keywords
- transistor
- region
- insulating layer
- bured
- seoi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/903—Masterslice integrated circuits comprising field effect technology
- H10D84/907—CMOS gate arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Logic Circuits (AREA)
Abstract
L'invention concerne selon un premier aspect un dispositif semi-conducteur formé sur un substrat semi-conducteur sur isolant comprenant une couche mince de matériau semi-conducteur séparée d'un substrat de base par une couche isolante, le dispositif comprenant un ensemble de motifs chacun formés d'au moins un transistor à effet de champ, chaque transistor disposant dans la couche mince d'une région de source, d'une région de drain et d'une région de canal délimitée par les régions de source et de drain, et comprenant en outre une région de grille de contrôle avant formée au dessus de la région de canal, les motifs étant agencés sous forme de rangées, les régions de source et de drain d'une même rangée présentant les mêmes dimensions et étant espacés par des régions de grille de contrôle avant de dimensions fixes, caractérisé en ce qu'au moins un transistor d'un motif dispose d'une région de grille de contrôle arrière formée dans le substrat de base au-dessous de la région de canal, la région de grille arrière étant apte à être polarisée pour décaler la tension de seuil du transistor et simuler ainsi une modification de la largeur du canal du transistor.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0958747A FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
TW099140776A TW201131739A (en) | 2009-12-08 | 2010-11-25 | Circuit of uniform transistors on SeOI with buried back control gate beneath the insulating film |
SG2010087047A SG172545A1 (en) | 2009-12-08 | 2010-11-25 | Circuit of uniform transistors on seoi with buried back control gate beneath the insulating film |
KR1020100118916A KR20110065343A (ko) | 2009-12-08 | 2010-11-26 | 절연막 아래 후방 컨트롤 게이트가 매설된 절연기판상 반도체(SeOI) 상의 균일한 트랜지스터 회로 |
JP2010263678A JP2011166116A (ja) | 2009-12-08 | 2010-11-26 | 絶縁膜下の埋め込みバック・コントロール・ゲートを有するSeOI上の同型のトランジスタからなる回路 |
CN2010105670660A CN102088027A (zh) | 2009-12-08 | 2010-11-26 | 具有绝缘膜下埋入背控制栅极的SeOI上一致晶体管电路 |
EP10192766A EP2333833A1 (fr) | 2009-12-08 | 2010-11-26 | Circuit de transistors uniformes sur SOI avec grille de contrôle arrière enterrée au dessous du film d'isolation |
US12/961,293 US8384425B2 (en) | 2009-12-08 | 2010-12-06 | Arrays of transistors with back control gates buried beneath the insulating film of a semiconductor-on-insulator substrate |
US13/013,580 US8508289B2 (en) | 2009-12-08 | 2011-01-25 | Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0958747A FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2953641A1 FR2953641A1 (fr) | 2011-06-10 |
FR2953641B1 true FR2953641B1 (fr) | 2012-02-10 |
Family
ID=42102200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0958747A Active FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
Country Status (8)
Country | Link |
---|---|
US (1) | US8384425B2 (fr) |
EP (1) | EP2333833A1 (fr) |
JP (1) | JP2011166116A (fr) |
KR (1) | KR20110065343A (fr) |
CN (1) | CN102088027A (fr) |
FR (1) | FR2953641B1 (fr) |
SG (1) | SG172545A1 (fr) |
TW (1) | TW201131739A (fr) |
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FR2987709B1 (fr) | 2012-03-05 | 2017-04-28 | Soitec Silicon On Insulator | Table de correspondance |
FR2988513B1 (fr) | 2012-03-23 | 2014-11-21 | Soitec Silicon On Insulator | Cellule eprom |
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US9466536B2 (en) | 2013-03-27 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator integrated circuit with back side gate |
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CN112687301B (zh) * | 2020-12-31 | 2024-03-19 | 广东省大湾区集成电路与系统应用研究院 | 存储单元及存储器 |
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JP5222520B2 (ja) | 2007-10-11 | 2013-06-26 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20090101940A1 (en) * | 2007-10-19 | 2009-04-23 | Barrows Corey K | Dual gate fet structures for flexible gate array design methodologies |
DE102007052097B4 (de) * | 2007-10-31 | 2010-10-28 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Herstellung eines SOI-Bauelements mit einer Substratdiode |
FR2925223B1 (fr) | 2007-12-18 | 2010-02-19 | Soitec Silicon On Insulator | Procede d'assemblage avec marques enterrees |
US7593265B2 (en) | 2007-12-28 | 2009-09-22 | Sandisk Corporation | Low noise sense amplifier array and method for nonvolatile memory |
US8148242B2 (en) | 2008-02-20 | 2012-04-03 | Soitec | Oxidation after oxide dissolution |
JP6053250B2 (ja) * | 2008-06-12 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
WO2010007478A1 (fr) | 2008-06-13 | 2010-01-21 | Yale University | Dispositifs à semi-conducteurs à oxyde de métal complémentaire améliorés |
US8012814B2 (en) * | 2008-08-08 | 2011-09-06 | International Business Machines Corporation | Method of forming a high performance fet and a high voltage fet on a SOI substrate |
US8120110B2 (en) * | 2008-08-08 | 2012-02-21 | International Business Machines Corporation | Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate |
KR101623958B1 (ko) * | 2008-10-01 | 2016-05-25 | 삼성전자주식회사 | 인버터 및 그의 동작방법과 인버터를 포함하는 논리회로 |
KR101522400B1 (ko) * | 2008-11-10 | 2015-05-21 | 삼성전자주식회사 | 인버터 및 그를 포함하는 논리소자 |
-
2009
- 2009-12-08 FR FR0958747A patent/FR2953641B1/fr active Active
-
2010
- 2010-11-25 TW TW099140776A patent/TW201131739A/zh unknown
- 2010-11-25 SG SG2010087047A patent/SG172545A1/en unknown
- 2010-11-26 JP JP2010263678A patent/JP2011166116A/ja active Pending
- 2010-11-26 EP EP10192766A patent/EP2333833A1/fr not_active Withdrawn
- 2010-11-26 CN CN2010105670660A patent/CN102088027A/zh active Pending
- 2010-11-26 KR KR1020100118916A patent/KR20110065343A/ko active IP Right Grant
- 2010-12-06 US US12/961,293 patent/US8384425B2/en active Active
Also Published As
Publication number | Publication date |
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SG172545A1 (en) | 2011-07-28 |
CN102088027A (zh) | 2011-06-08 |
TW201131739A (en) | 2011-09-16 |
KR20110065343A (ko) | 2011-06-15 |
US20110133776A1 (en) | 2011-06-09 |
JP2011166116A (ja) | 2011-08-25 |
FR2953641A1 (fr) | 2011-06-10 |
EP2333833A1 (fr) | 2011-06-15 |
US8384425B2 (en) | 2013-02-26 |
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