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FR2844634B1 - Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon - Google Patents

Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon

Info

Publication number
FR2844634B1
FR2844634B1 FR0211543A FR0211543A FR2844634B1 FR 2844634 B1 FR2844634 B1 FR 2844634B1 FR 0211543 A FR0211543 A FR 0211543A FR 0211543 A FR0211543 A FR 0211543A FR 2844634 B1 FR2844634 B1 FR 2844634B1
Authority
FR
France
Prior art keywords
layer
formation
plate
buffer layer
relaxed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0211543A
Other languages
English (en)
Other versions
FR2844634A1 (fr
Inventor
Takeshi Akatsu
Bruno Ghyselen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0211543A priority Critical patent/FR2844634B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to TW092125544A priority patent/TWI296819B/zh
Priority to US10/663,917 priority patent/US7001826B2/en
Priority to JP2004537455A priority patent/JP5032743B2/ja
Priority to AU2003274477A priority patent/AU2003274477A1/en
Priority to KR1020057004766A priority patent/KR100787261B1/ko
Priority to EP03758452A priority patent/EP1543552A1/fr
Priority to CN038223058A priority patent/CN1774798B/zh
Priority to PCT/IB2003/004793 priority patent/WO2004027858A1/fr
Publication of FR2844634A1 publication Critical patent/FR2844634A1/fr
Application granted granted Critical
Publication of FR2844634B1 publication Critical patent/FR2844634B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76259—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along a porous layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/933—Germanium or silicon or Ge-Si on III-V

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
FR0211543A 2002-09-18 2002-09-18 Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon Expired - Lifetime FR2844634B1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR0211543A FR2844634B1 (fr) 2002-09-18 2002-09-18 Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon
US10/663,917 US7001826B2 (en) 2002-09-18 2003-09-17 Wafer with a relaxed useful layer and method of forming the wafer
JP2004537455A JP5032743B2 (ja) 2002-09-18 2003-09-17 バッファ層を有しないウエハからの緩和された有用層の形成
AU2003274477A AU2003274477A1 (en) 2002-09-18 2003-09-17 Formation of a relaxed useful layer from a wafer with no buffer layer
TW092125544A TWI296819B (en) 2002-09-18 2003-09-17 Formation of a relaxed useful layer from a wafer with no buffer layer and a structure formed thereby
KR1020057004766A KR100787261B1 (ko) 2002-09-18 2003-09-17 버퍼층이 없는 웨이퍼로부터 완화된 유용층을 형성하는방법
EP03758452A EP1543552A1 (fr) 2002-09-18 2003-09-17 Formation d'une couche utile relaxee a partir d'une plaquette depourvue de couche tampon
CN038223058A CN1774798B (zh) 2002-09-18 2003-09-17 从不具有缓冲层的晶片形成松弛的有用层
PCT/IB2003/004793 WO2004027858A1 (fr) 2002-09-18 2003-09-17 Formation d'une couche utile relaxee a partir d'une plaquette depourvue de couche tampon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0211543A FR2844634B1 (fr) 2002-09-18 2002-09-18 Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon

Publications (2)

Publication Number Publication Date
FR2844634A1 FR2844634A1 (fr) 2004-03-19
FR2844634B1 true FR2844634B1 (fr) 2005-05-27

Family

ID=31897466

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0211543A Expired - Lifetime FR2844634B1 (fr) 2002-09-18 2002-09-18 Formation d'une couche utile relaxee a partir d'une plaquette sans couche tampon

Country Status (8)

Country Link
US (1) US7001826B2 (fr)
EP (1) EP1543552A1 (fr)
KR (1) KR100787261B1 (fr)
CN (1) CN1774798B (fr)
AU (1) AU2003274477A1 (fr)
FR (1) FR2844634B1 (fr)
TW (1) TWI296819B (fr)
WO (1) WO2004027858A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018910B2 (en) * 2002-07-09 2006-03-28 S.O.I.Tec Silicon On Insulator Technologies S.A. Transfer of a thin layer from a wafer comprising a buffer layer
US7538010B2 (en) * 2003-07-24 2009-05-26 S.O.I.Tec Silicon On Insulator Technologies Method of fabricating an epitaxially grown layer
FR2857983B1 (fr) * 2003-07-24 2005-09-02 Soitec Silicon On Insulator Procede de fabrication d'une couche epitaxiee
DE10360874B4 (de) * 2003-12-23 2009-06-04 Infineon Technologies Ag Feldeffekttransistor mit Heteroschichtstruktur sowie zugehöriges Herstellungsverfahren
US20060014363A1 (en) * 2004-03-05 2006-01-19 Nicolas Daval Thermal treatment of a semiconductor layer
US7282449B2 (en) * 2004-03-05 2007-10-16 S.O.I.Tec Silicon On Insulator Technologies Thermal treatment of a semiconductor layer
FR2867307B1 (fr) * 2004-03-05 2006-05-26 Soitec Silicon On Insulator Traitement thermique apres detachement smart-cut
FR2867310B1 (fr) 2004-03-05 2006-05-26 Soitec Silicon On Insulator Technique d'amelioration de la qualite d'une couche mince prelevee
US6893936B1 (en) * 2004-06-29 2005-05-17 International Business Machines Corporation Method of Forming strained SI/SIGE on insulator with silicon germanium buffer
US7172930B2 (en) * 2004-07-02 2007-02-06 International Business Machines Corporation Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer
FR2880189B1 (fr) * 2004-12-24 2007-03-30 Tracit Technologies Sa Procede de report d'un circuit sur un plan de masse
US8007675B1 (en) * 2005-07-11 2011-08-30 National Semiconductor Corporation System and method for controlling an etch process for a single crystal having a buried layer
FR2907966B1 (fr) * 2006-10-27 2009-01-30 Soitec Silicon On Insulator Procede de fabrication d'un substrat.
FR2910179B1 (fr) * 2006-12-19 2009-03-13 Commissariat Energie Atomique PROCEDE DE FABRICATION DE COUCHES MINCES DE GaN PAR IMPLANTATION ET RECYCLAGE D'UN SUBSTRAT DE DEPART
JP2008198656A (ja) 2007-02-08 2008-08-28 Shin Etsu Chem Co Ltd 半導体基板の製造方法
FR2912550A1 (fr) * 2007-02-14 2008-08-15 Soitec Silicon On Insulator Procede de fabrication d'une structure ssoi.
FR2924273B1 (fr) * 2007-11-28 2010-02-19 Commissariat Energie Atomique Procede de moderation de deformation
FR2931293B1 (fr) 2008-05-15 2010-09-03 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure support d'epitaxie et heterostructure correspondante
FR2977074A1 (fr) * 2011-06-23 2012-12-28 Soitec Silicon On Insulator Procede de fabrication d'un substrat semi-conducteur comprenant du silicium poreux
FR3029538B1 (fr) * 2014-12-04 2019-04-26 Soitec Procede de transfert de couche
DE102015210384A1 (de) 2015-06-05 2016-12-08 Soitec Verfahren zur mechanischen Trennung für eine Doppelschichtübertragung
JPWO2021060367A1 (fr) * 2019-09-27 2021-04-01

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461243A (en) * 1993-10-29 1995-10-24 International Business Machines Corporation Substrate for tensilely strained semiconductor
EP0799495A4 (fr) * 1994-11-10 1999-11-03 Lawrence Semiconductor Researc Compositions silicium-germanium-carbone et processus associes
CA2225131C (fr) 1996-12-18 2002-01-01 Canon Kabushiki Kaisha Procede de production d'articles semi-conducteurs
FR2773261B1 (fr) 1997-12-30 2000-01-28 Commissariat Energie Atomique Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions
US7227176B2 (en) 1998-04-10 2007-06-05 Massachusetts Institute Of Technology Etch stop layer system
CA2327421A1 (fr) 1998-04-10 1999-10-21 Jeffrey T. Borenstein Systeme de couche d'arret d'attaque chimique au silicium et au germanium
US6323108B1 (en) * 1999-07-27 2001-11-27 The United States Of America As Represented By The Secretary Of The Navy Fabrication ultra-thin bonded semiconductor layers
JP3967515B2 (ja) * 2000-02-16 2007-08-29 株式会社神戸製鋼所 マフラー用チタン合金材およびマフラー
JP2004507084A (ja) * 2000-08-16 2004-03-04 マサチューセッツ　インスティテュート　オブ　テクノロジー グレーデッドエピタキシャル成長を用いた半導体品の製造プロセス
US6646322B2 (en) 2001-03-02 2003-11-11 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
EP1364411A1 (fr) * 2001-03-02 2003-11-26 Amberwave Systems Corporation Plate-forme de silicium germanium relachee pour electronique cmos tres rapide et circuits analogiques tres rapides
US6593641B1 (en) 2001-03-02 2003-07-15 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6677192B1 (en) 2001-03-02 2004-01-13 Amberwave Systems Corporation Method of fabricating a relaxed silicon germanium platform having planarizing for high speed CMOS electronics and high speed analog circuits
US6723661B2 (en) 2001-03-02 2004-04-20 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6900103B2 (en) 2001-03-02 2005-05-31 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6724008B2 (en) 2001-03-02 2004-04-20 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6593625B2 (en) * 2001-06-12 2003-07-15 International Business Machines Corporation Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
JP3970011B2 (ja) * 2001-12-11 2007-09-05 シャープ株式会社 半導体装置及びその製造方法
US6746902B2 (en) * 2002-01-31 2004-06-08 Sharp Laboratories Of America, Inc. Method to form relaxed sige layer with high ge content
US6852652B1 (en) * 2003-09-29 2005-02-08 Sharp Laboratories Of America, Inc. Method of making relaxed silicon-germanium on glass via layer transfer

Also Published As

Publication number Publication date
WO2004027858A8 (fr) 2005-04-28
FR2844634A1 (fr) 2004-03-19
EP1543552A1 (fr) 2005-06-22
WO2004027858A1 (fr) 2004-04-01
TW200414296A (en) 2004-08-01
TWI296819B (en) 2008-05-11
AU2003274477A8 (en) 2004-04-08
KR20050084568A (ko) 2005-08-26
CN1774798A (zh) 2006-05-17
US20040067622A1 (en) 2004-04-08
CN1774798B (zh) 2010-04-28
US7001826B2 (en) 2006-02-21
KR100787261B1 (ko) 2007-12-20
AU2003274477A1 (en) 2004-04-08

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Owner name: SOITEC, FR

Effective date: 20120423

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