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FR2828628B1 - Pate conductrice photosensible, procede de formation d'un motif conducteur, et element de circuit - Google Patents

Pate conductrice photosensible, procede de formation d'un motif conducteur, et element de circuit

Info

Publication number
FR2828628B1
FR2828628B1 FR0210036A FR0210036A FR2828628B1 FR 2828628 B1 FR2828628 B1 FR 2828628B1 FR 0210036 A FR0210036 A FR 0210036A FR 0210036 A FR0210036 A FR 0210036A FR 2828628 B1 FR2828628 B1 FR 2828628B1
Authority
FR
France
Prior art keywords
circuit element
conductive pattern
conductive paste
photosensitive
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0210036A
Other languages
English (en)
Other versions
FR2828628A1 (fr
Inventor
Masahiro Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of FR2828628A1 publication Critical patent/FR2828628A1/fr
Application granted granted Critical
Publication of FR2828628B1 publication Critical patent/FR2828628B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5188—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal organic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/05599—Material
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR0210036A 2001-08-07 2002-08-07 Pate conductrice photosensible, procede de formation d'un motif conducteur, et element de circuit Expired - Fee Related FR2828628B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239425 2001-08-07
JP2002122029A JP3614152B2 (ja) 2001-08-07 2002-04-24 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法

Publications (2)

Publication Number Publication Date
FR2828628A1 FR2828628A1 (fr) 2003-02-14
FR2828628B1 true FR2828628B1 (fr) 2006-09-22

Family

ID=26620113

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0210036A Expired - Fee Related FR2828628B1 (fr) 2001-08-07 2002-08-07 Pate conductrice photosensible, procede de formation d'un motif conducteur, et element de circuit

Country Status (6)

Country Link
US (1) US6806028B2 (fr)
JP (1) JP3614152B2 (fr)
KR (1) KR100476280B1 (fr)
CN (1) CN1223900C (fr)
FR (1) FR2828628B1 (fr)
GB (1) GB2380198B (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247659B2 (en) * 2001-07-26 2007-07-24 Ciba Specialty Chemicals Corporation Photosensitive resin composition
US6873529B2 (en) * 2002-02-26 2005-03-29 Kyocera Corporation High frequency module
US20050008828A1 (en) * 2002-07-25 2005-01-13 Trustees Of Stevens Institute Of Technology Patterned polymer microgel and method of forming same
JP3975932B2 (ja) * 2003-02-12 2007-09-12 株式会社村田製作所 光反応性樹脂組成物、回路基板の製造方法、およびセラミック多層基板の製造方法
US20060014003A1 (en) * 2003-07-24 2006-01-19 Libera Matthew R Functional nano-scale gels
JP4211782B2 (ja) * 2003-11-25 2009-01-21 株式会社村田製作所 厚膜パターンの形成方法、電子部品の製造方法
JP2005209681A (ja) * 2004-01-20 2005-08-04 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品の製造方法
DE102006057332B4 (de) * 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
JP2008251888A (ja) * 2007-03-30 2008-10-16 Sony Corp パターン形成方法および電子素子の製造方法
US8093039B2 (en) * 2007-04-10 2012-01-10 The Trustees Of The Stevens Institute Of Technology Surfaces differentially adhesive to eukaryotic cells and non-eukaryotic cells
JP5076725B2 (ja) * 2007-08-13 2012-11-21 富士電機株式会社 絶縁トランスおよび電力変換装置
JP5076868B2 (ja) * 2007-12-20 2012-11-21 セイコーエプソン株式会社 配線基板の製造方法
US8749038B2 (en) * 2008-01-25 2014-06-10 Azurewave Technologies, Inc. Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof
US7887992B2 (en) * 2008-12-23 2011-02-15 E. I. Du Pont De Nemours And Company Photosensitive paste and process for production of pattern using the same
JP2011018636A (ja) * 2009-06-09 2011-01-27 Fujifilm Corp 導電性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
JP5560014B2 (ja) * 2009-09-30 2014-07-23 太陽ホールディングス株式会社 導電性ペースト
JP5757749B2 (ja) * 2010-05-19 2015-07-29 富士フイルム株式会社 重合性組成物
KR102011477B1 (ko) * 2011-03-29 2019-08-16 썬 케미칼 코포레이션 왁스 요변체를 함유하는 고-종횡비 스크린 인쇄성 후막 페이스트 조성물
CN102902425B (zh) * 2011-07-28 2016-06-08 宸鸿科技(厦门)有限公司 电容式触控面板结构及制造方法
CN103917917B (zh) * 2012-02-27 2017-02-15 株式会社村田制作所 感光性树脂组合物以及使用其的感光性膏
JP6163876B2 (ja) * 2013-05-24 2017-07-19 株式会社村田製作所 感光性ペースト
JP5899259B2 (ja) * 2014-03-18 2016-04-06 太陽ホールディングス株式会社 導電性ペースト
WO2016126801A1 (fr) * 2015-02-04 2016-08-11 E I Du Pont De Nemours And Company Composition de pâte conductrice et dispositifs à semi-conducteurs réalisés à l'aide de celle-ci
WO2017030070A1 (fr) 2015-08-20 2017-02-23 東レ株式会社 Procédé de fabrication d'un substrat d'antenne, procédé de fabrication d'un substrat d'antenne comportant un câblage et une électrode, et procédé de fabrication d'un élément rfid
JP6742877B2 (ja) * 2016-09-28 2020-08-19 株式会社ノリタケカンパニーリミテド 導電性ペースト
KR20180083122A (ko) 2017-01-12 2018-07-20 (주) 소프트브리지 패턴 체결 데이터를 활용하는 금융정보 시스템 및 그 이용방법
CN110136922B (zh) * 2018-02-09 2021-03-12 弘邺科技有限公司 具有导电胶成型的线圈导体的电感元件
WO2020196752A1 (fr) * 2019-03-28 2020-10-01 株式会社村田製作所 Module
CN111929989B (zh) * 2020-08-28 2022-03-15 乾宇电子材料（深圳）有限公司 感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料
CN114141806A (zh) * 2021-11-26 2022-03-04 深圳市华星光电半导体显示技术有限公司 导电浆料、阵列基板侧面走线的制备方法以及显示面板
CN114437359B (zh) * 2022-03-09 2023-04-18 广州亦盛环保科技有限公司 一种透明光刻胶用感光性树脂组合物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598037A (en) * 1984-12-21 1986-07-01 E. I. Du Pont De Nemours And Company Photosensitive conductive metal composition
JPH05287221A (ja) * 1992-02-12 1993-11-02 Toray Ind Inc 感光性導電ペースト
JPH06224538A (ja) * 1993-01-22 1994-08-12 Sumitomo Metal Ind Ltd セラミックス回路基板の製造方法
JP3239723B2 (ja) * 1994-11-17 2001-12-17 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JPH08335757A (ja) 1995-06-08 1996-12-17 Ngk Spark Plug Co Ltd セラミック配線基板、その製造方法及び導電ペースト
JP3520647B2 (ja) 1996-02-08 2004-04-19 東レ株式会社 感光性ペースト
JPH09218508A (ja) 1996-02-08 1997-08-19 Toray Ind Inc 感光性ペースト
JP4017086B2 (ja) 1996-02-16 2007-12-05 東京応化工業株式会社 感光性ペースト組成物
JPH10112216A (ja) * 1996-08-09 1998-04-28 Toray Ind Inc 感光性導電ペースト、それを用いた電極およびその製造方法
JPH10171107A (ja) 1996-12-06 1998-06-26 Tokyo Ohka Kogyo Co Ltd 感光性ペースト組成物
JP3920449B2 (ja) * 1998-03-13 2007-05-30 太陽インキ製造株式会社 アルカリ現像型光硬化性組成物及びそれを用いて得られる焼成物パターン
JP3528669B2 (ja) * 1999-03-25 2004-05-17 株式会社村田製作所 導体パターンの形成方法並びにセラミック多層基板の製造方法
US6183669B1 (en) * 1999-03-25 2001-02-06 Murata Manufacturing Co., Ltd. Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
JP3394938B2 (ja) * 1999-03-25 2003-04-07 株式会社村田製作所 感光性導体ペースト
GB2348205B (en) * 1999-03-25 2001-06-27 Murata Manufacturing Co Paste composition green sheet and multilayer substrate
JP2000276945A (ja) * 1999-03-25 2000-10-06 Murata Mfg Co Ltd 導体ペースト及びそれを用いた回路基板
GB2360292B (en) * 2000-03-15 2002-04-03 Murata Manufacturing Co Photosensitive thick film composition and electronic device using the same
JP3674501B2 (ja) * 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
JP3757886B2 (ja) * 2002-01-25 2006-03-22 株式会社村田製作所 光反応性樹脂組成物、それを用いた回路基板およびセラミック多層基板の製造方法

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KR100476280B1 (ko) 2005-03-16
GB0216765D0 (en) 2002-08-28
US6806028B2 (en) 2004-10-19
US20030036020A1 (en) 2003-02-20
FR2828628A1 (fr) 2003-02-14
CN1223900C (zh) 2005-10-19
GB2380198B (en) 2003-11-19
JP2003123536A (ja) 2003-04-25
GB2380198A (en) 2003-04-02
KR20030035828A (ko) 2003-05-09
CN1403874A (zh) 2003-03-19

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