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FR2741196B1 - Module de conversion thermoelectrique et procede de fabrication d'un tel module - Google Patents

Module de conversion thermoelectrique et procede de fabrication d'un tel module

Info

Publication number
FR2741196B1
FR2741196B1 FR9613765A FR9613765A FR2741196B1 FR 2741196 B1 FR2741196 B1 FR 2741196B1 FR 9613765 A FR9613765 A FR 9613765A FR 9613765 A FR9613765 A FR 9613765A FR 2741196 B1 FR2741196 B1 FR 2741196B1
Authority
FR
France
Prior art keywords
module
manufacturing
thermoelectric conversion
conversion module
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9613765A
Other languages
English (en)
Other versions
FR2741196A1 (fr
Inventor
Yuichiro Imanishi
Makoto Miyoshi
Tetsuo Watanabe
Keiko Kushibiki
Kazuhiko Shinohara
Mazakazu Kobayashi
Kenji Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of FR2741196A1 publication Critical patent/FR2741196A1/fr
Application granted granted Critical
Publication of FR2741196B1 publication Critical patent/FR2741196B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9613765A 1995-11-13 1996-11-12 Module de conversion thermoelectrique et procede de fabrication d'un tel module Expired - Fee Related FR2741196B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29434995 1995-11-13
JP8282480A JPH09199765A (ja) 1995-11-13 1996-10-24 熱電気変換モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
FR2741196A1 FR2741196A1 (fr) 1997-05-16
FR2741196B1 true FR2741196B1 (fr) 2000-07-21

Family

ID=26554621

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9613765A Expired - Fee Related FR2741196B1 (fr) 1995-11-13 1996-11-12 Module de conversion thermoelectrique et procede de fabrication d'un tel module

Country Status (5)

Country Link
US (2) US5952728A (fr)
JP (1) JPH09199765A (fr)
DE (1) DE19646915C2 (fr)
FR (1) FR2741196B1 (fr)
GB (1) GB2307338B (fr)

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JP3528471B2 (ja) * 1996-02-26 2004-05-17 松下電工株式会社 熱電モジュールの製造方法
USRE41801E1 (en) 1997-03-31 2010-10-05 Nextreme Thermal Solutions, Inc. Thin-film thermoelectric device and fabrication method of same
JP3982080B2 (ja) * 1997-12-05 2007-09-26 松下電工株式会社 熱電モジュールの製造法と熱電モジュール
KR100320761B1 (ko) * 1997-08-25 2002-01-18 하루타 히로시 열전 장치
JP3462469B2 (ja) * 2000-12-15 2003-11-05 Ｓｍｃ株式会社 円形冷却プレート用異形サーモモジュール及びそれを用いた円形冷却プレート
US6410971B1 (en) 2001-07-12 2002-06-25 Ferrotec (Usa) Corporation Thermoelectric module with thin film substrates
US7038234B2 (en) * 2001-12-12 2006-05-02 Hi-Z Technology, Inc. Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs
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US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
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US8222511B2 (en) 2006-08-03 2012-07-17 Gentherm Thermoelectric device
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
EP1965446B1 (fr) * 2007-02-28 2011-11-16 Corning Incorporated Module thermoélectrique en céramique-verre
WO2008111218A1 (fr) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. Convertisseur thermoélectrique
WO2008111220A1 (fr) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. Procédé de fabrication d'un convertisseur thermoélectrique
WO2008111219A1 (fr) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. Convertisseur thermoélectrique
WO2009036077A1 (fr) 2007-09-10 2009-03-19 Amerigon, Inc. Systèmes de commande de fonctionnement pour ensembles lit ou siège ventilé
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US20090090409A1 (en) * 2007-10-05 2009-04-09 Marlow Industries, Inc. System and Method for Assembling a Microthermoelectric Device
US7871847B2 (en) * 2007-10-05 2011-01-18 Marlow Industries, Inc. System and method for high temperature compact thermoelectric generator (TEG) device construction
JP2009099686A (ja) * 2007-10-15 2009-05-07 Sumitomo Chemical Co Ltd 熱電変換モジュール
EP2234839B1 (fr) 2008-02-01 2016-06-29 Gentherm Incorporated Capteurs de condensation et d'humidité pour dispositifs thermoélectriques
JP5997899B2 (ja) 2008-07-18 2016-09-28 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 空調されるベッドアセンブリ
DE102008058779A1 (de) 2008-11-24 2010-05-27 Emitec Gesellschaft Für Emissionstechnologie Mbh Modul für einen thermoelektrischen Generator und ein thermoelektrischer Generator
KR100989643B1 (ko) * 2009-10-27 2010-10-26 한국기계연구원 박막형 열전모듈 제조방법 및 이를 이용한 적층 반도체칩 패키지
US8487177B2 (en) 2010-02-27 2013-07-16 The Boeing Company Integrated thermoelectric honeycomb core and method
JP5235038B2 (ja) * 2011-04-12 2013-07-10 パナソニック株式会社 熱電変換素子の製造装置および製造方法
US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
JP5662490B2 (ja) 2012-03-07 2015-01-28 パナソニックＩｐマネジメント株式会社 熱電変換装置
DE102012105743A1 (de) * 2012-06-29 2014-01-02 Elringklinger Ag Wärmeabschirmvorrichtung mit thermoelektrischer Energienutzung
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
KR102051617B1 (ko) 2014-02-14 2019-12-03 젠썸 인코포레이티드 전도식 대류식 기온 제어 시트
CN104037318A (zh) * 2014-05-23 2014-09-10 浙江大学 柔性温差发电微单元结构
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
CN108370615A (zh) * 2015-12-18 2018-08-03 麦格纳座椅公司 加热及冷却工具
US10247685B2 (en) * 2016-01-28 2019-04-02 Korea Institute Of Energy Research High-temperature structure for measuring properties of curved thermoelectric device, and system and method for measuring properties of curved thermoelectric device using the same
US10736576B2 (en) 2016-10-31 2020-08-11 Tegway Co., Ltd. Feedback device and method for providing thermal feedback using the same
WO2018080028A1 (fr) * 2016-10-31 2018-05-03 주식회사 테그웨이 Dispositif de rétroaction et procédé pour fournir une rétroaction thermique au moyen de celui-ci
KR20180048227A (ko) 2016-10-31 2018-05-10 주식회사 테그웨이 피드백 디바이스 및 이를 이용하는 열적 피드백 제공 방법
KR102369905B1 (ko) 2016-10-31 2022-03-03 주식회사 테그웨이 피드백 디바이스 및 이를 이용하는 열적 피드백 제공 방법
US20190148617A1 (en) * 2017-05-19 2019-05-16 Tegway Co., Ltd. Flexible thermoelectric module and thermoelectric apparatus comprising same
CN110268369A (zh) * 2016-10-31 2019-09-20 泰格韦有限公司 柔性热电模块和包含柔性热电模块的热电装置
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US11993132B2 (en) 2018-11-30 2024-05-28 Gentherm Incorporated Thermoelectric conditioning system and methods
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US20230180611A1 (en) * 2020-05-01 2023-06-08 E-ThermoGentek Co., Ltd. Thermoelectric power-generation module, wearable biological-body-sensing device, biological-body location detection system
KR102414221B1 (ko) * 2020-08-04 2022-06-27 서울시립대학교 산학협력단 열전 소자 어셈블리, 이의 제조 방법, 및 이를 포함하는 열전 모듈

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JPH09139526A (ja) * 1995-11-13 1997-05-27 Ngk Insulators Ltd 熱電気変換モジュールおよびその製造方法

Also Published As

Publication number Publication date
US5952728A (en) 1999-09-14
DE19646915A1 (de) 1997-05-15
DE19646915C2 (de) 2003-05-28
JPH09199765A (ja) 1997-07-31
FR2741196A1 (fr) 1997-05-16
GB2307338A (en) 1997-05-21
US6306673B1 (en) 2001-10-23
GB2307338B (en) 1998-02-04
GB9623554D0 (en) 1997-01-08

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