FR2695253B1 - Dispositif a transistor de puissance ayant une region a concentration accrue ultra-profonde. - Google Patents
Dispositif a transistor de puissance ayant une region a concentration accrue ultra-profonde.Info
- Publication number
- FR2695253B1 FR2695253B1 FR9310793A FR9310793A FR2695253B1 FR 2695253 B1 FR2695253 B1 FR 2695253B1 FR 9310793 A FR9310793 A FR 9310793A FR 9310793 A FR9310793 A FR 9310793A FR 2695253 B1 FR2695253 B1 FR 2695253B1
- Authority
- FR
- France
- Prior art keywords
- ultra
- power transistor
- transistor device
- concentration region
- increased concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/491—Vertical IGBTs having both emitter contacts and collector contacts in the same substrate side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/109—Reduced surface field [RESURF] PN junction structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52117790A | 1990-05-09 | 1990-05-09 | |
FR9105460A FR2662025A1 (fr) | 1990-05-09 | 1991-05-03 | Dispositif a transistor de puissance ayant une region a concentration accrue ultra-profonde. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2695253A1 FR2695253A1 (fr) | 1994-03-04 |
FR2695253B1 true FR2695253B1 (fr) | 1997-09-19 |
Family
ID=26228667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9310793A Expired - Fee Related FR2695253B1 (fr) | 1990-05-09 | 1993-09-10 | Dispositif a transistor de puissance ayant une region a concentration accrue ultra-profonde. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2695253B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19608003C2 (de) * | 1996-03-04 | 2001-11-29 | Daimler Chrysler Ag | Leistungs-Feldeffekt-Transistor und Verfahren zu seiner Herstellung |
RU189905U1 (ru) * | 2019-04-01 | 2019-06-11 | Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" | Биполярный кремниевый планарный транзистор |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62298120A (ja) * | 1986-06-18 | 1987-12-25 | Hitachi Ltd | 半導体装置およびその製造方法 |
US4717679A (en) * | 1986-11-26 | 1988-01-05 | General Electric Company | Minimal mask process for fabricating a lateral insulated gate semiconductor device |
JP2751926B2 (ja) * | 1986-12-22 | 1998-05-18 | 日産自動車株式会社 | 電導度変調形mosfet |
US4866495A (en) * | 1987-05-27 | 1989-09-12 | International Rectifier Corporation | High power MOSFET and integrated control circuit therefor for high-side switch application |
JPH0650776B2 (ja) * | 1987-08-28 | 1994-06-29 | 富士電機株式会社 | 半導体装置に対するライフタイムキラ−導入方法 |
JPS6481271A (en) * | 1987-09-22 | 1989-03-27 | Nec Corp | Conductivity-modulation type mosfet |
JPH0247874A (ja) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Mos型半導体装置の製造方法 |
-
1993
- 1993-09-10 FR FR9310793A patent/FR2695253B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2695253A1 (fr) | 1994-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |