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FR2406676A1 - Procede pour stabiliser des bains pour depot par galvanoplastie d'etain ou d'alliage d'etain - Google Patents

Procede pour stabiliser des bains pour depot par galvanoplastie d'etain ou d'alliage d'etain

Info

Publication number
FR2406676A1
FR2406676A1 FR7829893A FR7829893A FR2406676A1 FR 2406676 A1 FR2406676 A1 FR 2406676A1 FR 7829893 A FR7829893 A FR 7829893A FR 7829893 A FR7829893 A FR 7829893A FR 2406676 A1 FR2406676 A1 FR 2406676A1
Authority
FR
France
Prior art keywords
tin
galvanoplasy
deposit
salts
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7829893A
Other languages
English (en)
Other versions
FR2406676B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Publication of FR2406676A1 publication Critical patent/FR2406676A1/fr
Application granted granted Critical
Publication of FR2406676B1 publication Critical patent/FR2406676B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

L'invention concerne l'industrie de la galvanoplastie. On ajoute à un bain de dépôt par galvanoplastie d'étain ou d'alliage d'étain contenant de l'acide citrique ou un de ses sels et un sel d'ammonium, au moins un acide hydroxycarboxylique saturé ou un de ses sels autres que l'acide citrique ou un citrate, et/ou au moins un acide dicarboxylique saturé ou un de ses sels. L'invention s'applique en particulier à l'obtention de dépôts galvanoplastiques d'étain ou d'alliage d'étain d'excellente qualité.
FR7829893A 1977-10-21 1978-10-20 Procede pour stabiliser des bains pour depot par galvanoplastie d'etain ou d'alliage d'etain Granted FR2406676A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52125865A JPS6015716B2 (ja) 1977-10-21 1977-10-21 錫または錫合金電気めつき用浴の安定化方法

Publications (2)

Publication Number Publication Date
FR2406676A1 true FR2406676A1 (fr) 1979-05-18
FR2406676B1 FR2406676B1 (fr) 1982-12-17

Family

ID=14920840

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7829893A Granted FR2406676A1 (fr) 1977-10-21 1978-10-20 Procede pour stabiliser des bains pour depot par galvanoplastie d'etain ou d'alliage d'etain

Country Status (5)

Country Link
US (1) US4163700A (fr)
JP (1) JPS6015716B2 (fr)
DE (1) DE2845439C2 (fr)
FR (1) FR2406676A1 (fr)
GB (1) GB2007713B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2582676A1 (fr) * 1985-06-03 1986-12-05 Nat Semiconductor Corp Procede d'etamage des connexions exterieures d'un dispositif a semi-conducteur encapsule
EP0715003A1 (fr) * 1993-06-01 1996-06-05 Dipsol Chemical Co., Ltd Bain et procédé pour l'électrodeposition d'un alliage étain-bismuth

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2084191A (en) * 1980-09-23 1982-04-07 Vandervell Products Ltd Electro-deposition of alloys
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4640746A (en) * 1984-10-11 1987-02-03 Learonal, Inc. Bath and process for plating tin/lead alloys on composite substrates
US4832685A (en) * 1985-06-05 1989-05-23 Coopervision, Inc. Fluid flow control system and connecting fitting therefor
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
JPS6264360A (ja) * 1985-09-17 1987-03-23 日本アビオニクス株式会社 歯科臨床用補綴物の酸化方法に用いる電解錫メツキ液
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
GB2296714B (en) * 1994-12-15 1998-03-25 Abbey Coating composition
US5538617A (en) * 1995-03-08 1996-07-23 Bethlehem Steel Corporation Ferrocyanide-free halogen tin plating process and bath
GB2312438A (en) * 1996-04-26 1997-10-29 Ibm Electrodeposition bath containing zinc salt
US6936142B2 (en) * 1997-12-22 2005-08-30 George Hradil Spouted bed apparatus for contacting objects with a fluid
US20050217989A1 (en) * 1997-12-22 2005-10-06 George Hradil Spouted bed apparatus with annular region for electroplating small objects
EP1091023A3 (fr) * 1999-10-08 2003-05-14 Shipley Company LLC Composition d'alliage et procédé de plaquage
US20020166774A1 (en) * 1999-12-10 2002-11-14 Shipley Company, L.L.C. Alloy composition and plating method
US6436269B1 (en) 2000-10-19 2002-08-20 Atotech Deutschland Gmbh Plating bath and method for electroplating tin-zinc alloys
US6582582B2 (en) 2001-03-09 2003-06-24 Donald Becking Electroplating composition and process
US20040149587A1 (en) * 2002-02-15 2004-08-05 George Hradil Electroplating solution containing organic acid complexing agent
JP2008522030A (ja) * 2004-11-29 2008-06-26 テクニック・インコーポレイテッド ほぼ中性ｐＨのスズ電気めっき用溶液
EP2175048A1 (fr) * 2008-10-13 2010-04-14 Atotech Deutschland Gmbh Composition de placage métallique pour le dépôt d'alliages d'étain et de zinc sur un substrat
CN102644096A (zh) * 2012-04-25 2012-08-22 上海交通大学 耐蚀性锡-锌合金电沉积液及镀层的制备方法
US10633754B2 (en) * 2013-07-05 2020-04-28 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
TWI779884B (zh) * 2021-10-19 2022-10-01 優勝奈米科技股份有限公司 無硼電鍍添加劑及其使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031400A (en) * 1960-05-27 1962-04-24 Ibm Preparation of superconductive tin by electrodeposition
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
FR2185007A1 (fr) * 1972-05-17 1973-12-28 Sony Corp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB190325550A (en) * 1903-11-23 1904-11-23 Franz Egon Clotten Process and Apparatus for the Electrolytic Recovery of Tin from Materials Containing the same and for the Simultaneous Recovery of other Metals.
US3951760A (en) * 1972-05-17 1976-04-20 Sony Corporation Bath for the electrodeposition of bright tin-cobalt alloy
JPS5175632A (en) * 1974-12-27 1976-06-30 Dipsol Chem Kotakusuzu aengokindenkimetsukyotenkabutsu

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031400A (en) * 1960-05-27 1962-04-24 Ibm Preparation of superconductive tin by electrodeposition
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
FR2185007A1 (fr) * 1972-05-17 1973-12-28 Sony Corp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CA1975 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2582676A1 (fr) * 1985-06-03 1986-12-05 Nat Semiconductor Corp Procede d'etamage des connexions exterieures d'un dispositif a semi-conducteur encapsule
EP0715003A1 (fr) * 1993-06-01 1996-06-05 Dipsol Chemical Co., Ltd Bain et procédé pour l'électrodeposition d'un alliage étain-bismuth
US5674374A (en) * 1993-06-01 1997-10-07 Dipsol Chemicals Co., Ltd. Sn-Bi alloy-plating bath and plating method using the same

Also Published As

Publication number Publication date
GB2007713A (en) 1979-05-23
JPS5460230A (en) 1979-05-15
DE2845439C2 (de) 1982-05-06
FR2406676B1 (fr) 1982-12-17
US4163700A (en) 1979-08-07
JPS6015716B2 (ja) 1985-04-20
DE2845439A1 (de) 1979-04-26
GB2007713B (en) 1982-06-30

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