[go: up one dir, main page]

FI954292A0 - Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö - Google Patents

Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö

Info

Publication number
FI954292A0
FI954292A0 FI954292A FI954292A FI954292A0 FI 954292 A0 FI954292 A0 FI 954292A0 FI 954292 A FI954292 A FI 954292A FI 954292 A FI954292 A FI 954292A FI 954292 A0 FI954292 A0 FI 954292A0
Authority
FI
Finland
Prior art keywords
pct
date sep
acids
phosphorus
sec
Prior art date
Application number
FI954292A
Other languages
English (en)
Swedish (sv)
Other versions
FI954292L (fi
Inventor
Gentzkow Wolfgang Von
Juergen Huber
Heinrich Kapitza
Wolfgang Rogler
Hans-Jerg Kleiner
Original Assignee
Siemens Ag
Hoechst Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19934308184 external-priority patent/DE4308184A1/de
Application filed by Siemens Ag, Hoechst Ag filed Critical Siemens Ag
Publication of FI954292L publication Critical patent/FI954292L/fi
Publication of FI954292A0 publication Critical patent/FI954292A0/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
    • C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
FI954292A 1993-03-15 1995-09-13 Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö FI954292A0 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19934308184 DE4308184A1 (de) 1993-03-15 1993-03-15 Epoxidharzmischungen
PCT/EP1994/000749 WO1994021705A1 (de) 1993-03-15 1994-03-10 Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung sowie deren verwendung

Publications (2)

Publication Number Publication Date
FI954292L FI954292L (fi) 1995-09-13
FI954292A0 true FI954292A0 (fi) 1995-09-13

Family

ID=6482839

Family Applications (2)

Application Number Title Priority Date Filing Date
FI954292A FI954292A0 (fi) 1993-03-15 1995-09-13 Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö
FI954321A FI107612B (fi) 1993-03-15 1995-09-14 Epoksidihartsiseoksia

Family Applications After (1)

Application Number Title Priority Date Filing Date
FI954321A FI107612B (fi) 1993-03-15 1995-09-14 Epoksidihartsiseoksia

Country Status (15)

Country Link
US (1) US5648171A (fi)
EP (2) EP0689560A1 (fi)
JP (2) JPH08507814A (fi)
KR (2) KR960701118A (fi)
CN (2) CN1119447A (fi)
AT (1) ATE154369T1 (fi)
CA (2) CA2158362A1 (fi)
CZ (2) CZ287737B6 (fi)
DE (2) DE4340834A1 (fi)
FI (2) FI954292A0 (fi)
HU (2) HU213902B (fi)
PL (2) PL176714B1 (fi)
RU (2) RU2126426C1 (fi)
TW (2) TW261622B (fi)
WO (2) WO1994021705A1 (fi)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW294693B (fi) * 1994-09-09 1997-01-01 Siemens Ag
DE19613066C2 (de) * 1996-04-01 1998-09-10 Clariant Gmbh Verfahren zur Herstellung phosphormodifizierter Epoxidharze
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
DE19619095A1 (de) 1996-05-06 1997-11-13 Schill & Seilacher Flammfeste Epoxidharze und Flammschutzmittel für Epoxidharze
ATE271574T1 (de) * 1996-09-26 2004-08-15 Siemens Ag Epoxidharzmischungen
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
DE19917428A1 (de) 1999-04-19 2000-10-26 Clariant Gmbh Flammwidrige phosphormodifizierte Epoxidharze
CN101925260A (zh) 1999-08-12 2010-12-22 Ibiden股份有限公司 多层印刷电路板
JP4535559B2 (ja) * 2000-04-04 2010-09-01 イビデン株式会社 多層プリント配線板
JP4530469B2 (ja) * 2000-04-04 2010-08-25 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
US6887950B2 (en) * 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
US6733698B2 (en) 2001-02-15 2004-05-11 Pabu Services, Inc. Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions
JP2002275244A (ja) * 2001-03-19 2002-09-25 Dainippon Ink & Chem Inc エポキシ樹脂組成物
AT411061B (de) * 2001-11-30 2003-09-25 Solutia Austria Gmbh Wässrige härter für wässrige epoxidharzdispersionen
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
CN101824205B (zh) * 2004-02-27 2014-04-16 东丽株式会社 一体化成型品、纤维增强复合材料板及电气·电子设备用外壳
US7655871B2 (en) * 2004-03-29 2010-02-02 Sumitomo Bakelite Company Limited Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7078816B2 (en) 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
JP5502277B2 (ja) 2004-05-28 2014-05-28 ダウ グローバル テクノロジーズ エルエルシー ハロゲン非含有耐発火性ポリマーの製造に有用なリン含有化合物
GB2451233A (en) * 2007-07-21 2009-01-28 Leigh S Paints Intumescent coating composition
US20090110835A1 (en) * 2007-10-31 2009-04-30 Pressley Mark W Additives for improved adhesion to oily substrates
EP2083030A1 (en) * 2008-01-15 2009-07-29 Cytec Surface Specialties Austria GmbH Water-borne epoxy resin systems
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101591471B (zh) * 2008-05-26 2011-03-16 台燿科技股份有限公司 处理无卤素铜箔基板材料的树脂组合物
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
KR101704097B1 (ko) * 2010-01-29 2017-02-07 블루 큐브 아이피 엘엘씨 인-함유 화합물을 갖는 조성물
CN101880507B (zh) * 2010-07-02 2013-03-13 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法
CN102304322B (zh) * 2011-08-31 2013-07-31 蚌埠市英路光电有限公司 一种耐热聚酯亚胺漆包线漆及其制备方法
CN102304320A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 一种低温环保聚酯亚胺漆包线漆及其制备方法
CN102304321A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 酚型聚酯漆包线漆及其制备方法
US9181628B2 (en) 2011-09-14 2015-11-10 Prc-Desoto International, Inc. Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating
CN102559014B (zh) * 2011-12-14 2014-05-28 东华大学 一种电动工具转子用无溶剂滴浸漆及其制备方法
RU2573003C2 (ru) * 2013-11-28 2016-01-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Эпоксивинилэфирная смола и огнестойкий полимерный композиционный материал на ее основе
RU2569537C1 (ru) * 2014-09-19 2015-11-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Комсомольский-на-Амуре государственный технический университет" (ФГБОУ ВПО "КнАГТУ") Способ получения слоистого пластика
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
CN108191840B (zh) * 2017-12-13 2020-11-24 华南理工大学 一种含六氢三嗪结构环氧树脂预聚物及其制备方法
CN109400957B (zh) * 2018-07-19 2020-11-27 中国科学院宁波材料技术与工程研究所 一种生物碱磷酸盐阻燃剂及其制备方法
WO2020197561A1 (en) * 2019-03-28 2020-10-01 Safran Cabin Inc. Fire retardant epoxy resin
WO2021074684A1 (en) * 2019-10-18 2021-04-22 Toray Industries, Inc. Flame retardant epoxy resin composition
US20240093003A1 (en) * 2019-10-18 2024-03-21 Toray Industries, Inc. Flame retardant composition, prepreg, and fiber reinforced composite material

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732367A (en) * 1956-01-24 ruuivj
GB191110794A (en) * 1911-05-04 1912-04-11 John Dugmore Improvements in or relating to Studs, Solitaires, Buttons or the like.
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
US3364159A (en) * 1965-09-27 1968-01-16 Argus Chem Curing vicinal epoxy compounds and curing compositions therefor
GB1112139A (en) * 1967-01-13 1968-05-01 Shell Int Research Curable polyepoxide compositions for making flame retardant articles
US3862148A (en) * 1968-09-11 1975-01-21 Merck & Co Inc P-(-)-(cis-1,2-epoxypropyl)-isohypophosphoric acid compounds
DE2743680C2 (de) * 1977-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Selbstverlöschende Verbundwerkstoffe
GB8610067D0 (en) * 1986-04-24 1986-05-29 Steetley Refractories Ltd Coated magnesium hydroxide
ATE72450T1 (de) * 1986-12-15 1992-02-15 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.
EP0384940B1 (de) * 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharzmischungen
ATE107676T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.

Also Published As

Publication number Publication date
HU213902B (en) 1997-11-28
DE4340834A1 (de) 1994-09-22
PL175777B1 (pl) 1999-02-26
DE59403119D1 (de) 1997-07-17
RU2126426C1 (ru) 1999-02-20
CZ240095A3 (en) 1996-01-17
PL310629A1 (en) 1995-12-27
KR960701118A (ko) 1996-02-24
PL310630A1 (en) 1995-12-27
WO1994021706A1 (de) 1994-09-29
TW261622B (fi) 1995-11-01
US5648171A (en) 1997-07-15
CZ287737B6 (en) 2001-01-17
RU2116323C1 (ru) 1998-07-27
CN1119447A (zh) 1996-03-27
KR960701115A (ko) 1996-02-24
FI954321A0 (fi) 1995-09-14
HUT73149A (en) 1996-06-28
WO1994021705A1 (de) 1994-09-29
FI954321L (fi) 1995-09-14
EP0689560A1 (de) 1996-01-03
FI107612B (fi) 2001-09-14
EP0689559B1 (de) 1997-06-11
FI954292L (fi) 1995-09-13
ATE154369T1 (de) 1997-06-15
TW261623B (fi) 1995-11-01
HU9502639D0 (en) 1995-11-28
EP0689559A1 (de) 1996-01-03
KR100304600B1 (ko) 2001-11-22
CA2158366A1 (en) 1994-09-29
CZ224695A3 (en) 1996-01-17
HUT73868A (en) 1996-10-28
CN1046949C (zh) 1999-12-01
HU214671B (hu) 1998-04-28
JPH08507813A (ja) 1996-08-20
CA2158362A1 (en) 1994-09-29
CN1119444A (zh) 1996-03-27
HU9502671D0 (en) 1995-11-28
PL176714B1 (pl) 1999-07-30
JPH08507814A (ja) 1996-08-20

Similar Documents

Publication Publication Date Title
FI954292A0 (fi) Fosforilla muunnettuja epoksihartseja, menetelmä niiden valmistamiseksi ja niiden käyttö
ATE166660T1 (de) Epoxidharzmischungen
DE59502531D1 (de) Epoxidharzmischungen für prepregs und verbundwerkstoffe
HK64096A (en) Epoxy resin compositions
DE59502777D1 (de) Epoxidharzmischungen für prepregs und verbundwerkstoffe
KR970706345A (ko) 멜리민 또는 멜렘-인산 반응 생성물을 난연제로서 포함하는 유리 섬유 강화된 방염성 폴리아미드 수지 조성물(Flameproof, glass fibre-reinforced polyamide resin compound with melamine or melem phosphoric acid reaction products as flame retardants)
RU95121641A (ru) Смеси эпоксидных смол
AU4614497A (en) Epoxy resin mixtures
DE59308001D1 (de) Einkomponentiges reaktionsharzsystem
KR100734199B1 (ko) 에폭시 수지용 경화제, 이의 용도 및 이로 경화된 에폭시수지
ATE179729T1 (de) Epoxidharzmischungen für prepregs und verbundwerkstoffe
US4559398A (en) Curable epoxy resins
ATE307818T1 (de) Flammschutzmittel für polymere enthaltend eine mischung aus zwei verschiedenen arylphosphaten, deren herstellung und deren verwendung
JPH09104804A (ja) 耐炎性エポキシ樹脂成形材料
CN103619994B (zh) 具有阻燃膦酸酯的硬化环氧树脂的制备
CN111094422A (zh) 环氧树脂体系
EP0799848B1 (de) Phosphormodifizierte Epoxidharze aus Epoxidharzen und phosphorhaltigen Verbindungen
US3317473A (en) Curing phenol-benzaldehyde resins with a polyaziridine
RU99108679A (ru) Смеси эпоксидных смол