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FI20115628L - Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi - Google Patents

Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20115628L
FI20115628L FI20115628A FI20115628A FI20115628L FI 20115628 L FI20115628 L FI 20115628L FI 20115628 A FI20115628 A FI 20115628A FI 20115628 A FI20115628 A FI 20115628A FI 20115628 L FI20115628 L FI 20115628L
Authority
FI
Finland
Prior art keywords
preparation
polymer composition
new polymer
bisphenofluorenes
biphenols
Prior art date
Application number
FI20115628A
Other languages
English (en)
Swedish (sv)
Other versions
FI20115628A0 (fi
Inventor
Jyri Paulasaari
Original Assignee
Silecs Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silecs Oy filed Critical Silecs Oy
Priority to FI20115628A priority Critical patent/FI20115628L/fi
Publication of FI20115628A0 publication Critical patent/FI20115628A0/fi
Priority to US13/489,515 priority patent/US8952121B2/en
Publication of FI20115628L publication Critical patent/FI20115628L/fi

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/02Condensation polymers of aldehydes or ketones with phenols only of ketones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/29Compounds containing one or more carbon-to-nitrogen double bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/16Condensation polymers of aldehydes or ketones with phenols only of ketones with phenols
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/314Condensed aromatic systems, e.g. perylene, anthracene or pyrene
    • C08G2261/3142Condensed aromatic systems, e.g. perylene, anthracene or pyrene fluorene-based, e.g. fluorene, indenofluorene, or spirobifluorene
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Formation Of Insulating Films (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
FI20115628A 2011-06-20 2011-06-20 Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi FI20115628L (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20115628A FI20115628L (fi) 2011-06-20 2011-06-20 Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi
US13/489,515 US8952121B2 (en) 2011-06-20 2012-06-06 Polymer composition and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20115628A FI20115628L (fi) 2011-06-20 2011-06-20 Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi

Publications (2)

Publication Number Publication Date
FI20115628A0 FI20115628A0 (fi) 2011-06-20
FI20115628L true FI20115628L (fi) 2012-12-21

Family

ID=44206838

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20115628A FI20115628L (fi) 2011-06-20 2011-06-20 Uusi polymeerikoostumus ja menetelmä sen valmistamiseksi

Country Status (2)

Country Link
US (1) US8952121B2 (fi)
FI (1) FI20115628L (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556773B2 (ja) * 2010-09-10 2014-07-23 信越化学工業株式会社 ナフタレン誘導体及びその製造方法、レジスト下層膜材料、レジスト下層膜形成方法及びパターン形成方法
KR101432605B1 (ko) * 2010-12-16 2014-08-21 제일모직주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
US9244353B2 (en) * 2012-08-10 2016-01-26 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition
KR102066229B1 (ko) * 2013-03-26 2020-01-15 주식회사 동진쎄미켐 레지스트 하층막 조성물 및 이를 이용한 패턴 형성 방법
KR20150079199A (ko) * 2013-12-31 2015-07-08 제일모직주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
US9274426B2 (en) * 2014-04-29 2016-03-01 Az Electronic Materials (Luxembourg) S.A.R.L. Antireflective coating compositions and processes thereof
KR101747229B1 (ko) * 2014-07-15 2017-06-14 삼성에스디아이 주식회사 하드마스크 조성물 및 상기 하드마스크 조성물을 사용하는 패턴형성방법
JP2019086545A (ja) 2017-11-01 2019-06-06 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH アリルオキシ誘導体、これを用いたレジスト下層膜形成組成物、ならびにこれを用いたレジスト下層膜および半導体デバイスの製造方法
EP3729196A1 (en) 2017-12-20 2020-10-28 Merck Patent GmbH An ethynyl derived composite, a composition comprising thereof, a method for manufacturing a coating by it, and a method for manufacturing a device comprising the coating
KR102716551B1 (ko) * 2019-04-26 2024-10-15 메르크 파텐트 게엠베하 경화막의 제조방법 및 이의 용도

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618566A (en) * 1984-10-31 1986-10-21 Ecoplastics Limited Fluorene containing compounds and negative photoresist compositions therefrom
US5034296A (en) * 1989-04-03 1991-07-23 Xerox Corporation Photoconductive imaging members with fluorene polyester hole transporting layers
US20040106758A1 (en) * 2001-04-09 2004-06-03 Shouji Nishiguchi Curable polyvinylbenzyl compound and process for producing the same
US7514379B2 (en) * 2001-04-09 2009-04-07 Showa Highpolymer Co., Ltd. Curable polyvinyl benzyl compound and process for producing the same
US7303855B2 (en) * 2003-10-03 2007-12-04 Shin-Etsu Chemical Co., Ltd. Photoresist undercoat-forming material and patterning process
TW200517469A (en) * 2003-10-30 2005-06-01 Nissan Chemical Ind Ltd Charge-transporting compound, charge-transporting material, charge-transporting varnish, charge-transporting thin film, and organic electroluminescent device
KR100874655B1 (ko) 2007-07-20 2008-12-17 금호석유화학 주식회사 스핀 온 카본 하드마스크용 축중합체 및 이의 제조방법과축중합체를 포함하는 스핀 온 카본 하드마스크 조성물 및이를 이용한 반도체 소자의 패턴 형성 방법
JP2010100770A (ja) * 2008-10-27 2010-05-06 Mitsubishi Gas Chemical Co Inc 熱可塑性樹脂の製造方法、ポリエステル樹脂及びポリカーボネート樹脂、ならびにそれらの用途
US8410243B2 (en) * 2008-12-17 2013-04-02 The Governors Of The University Of Alberta Aromatic ether-containing fluorene monomers, processes for their preparation and polymerization thereof
JP5951286B2 (ja) * 2012-03-01 2016-07-13 大阪ガスケミカル株式会社 フルオレン骨格を有する熱可塑性(メタ)アクリル樹脂

Also Published As

Publication number Publication date
FI20115628A0 (fi) 2011-06-20
US20120322010A1 (en) 2012-12-20
US8952121B2 (en) 2015-02-10

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