ES327380A1 - Procedimiento para la obtencion de composiciones organicas iniciadoras para catalizar depositos no electroliticos de metales. - Google Patents
Procedimiento para la obtencion de composiciones organicas iniciadoras para catalizar depositos no electroliticos de metales.Info
- Publication number
- ES327380A1 ES327380A1 ES0327380A ES327380A ES327380A1 ES 327380 A1 ES327380 A1 ES 327380A1 ES 0327380 A ES0327380 A ES 0327380A ES 327380 A ES327380 A ES 327380A ES 327380 A1 ES327380 A1 ES 327380A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- metals
- machine
- obtaining
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46058565A | 1965-06-01 | 1965-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES327380A1 true ES327380A1 (es) | 1967-07-16 |
Family
ID=23829306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES0327380A Expired ES327380A1 (es) | 1965-06-01 | 1966-05-31 | Procedimiento para la obtencion de composiciones organicas iniciadoras para catalizar depositos no electroliticos de metales. |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT280725B (xx) |
BE (1) | BE681865A (xx) |
DE (1) | DE1521445C3 (xx) |
DK (1) | DK132801C (xx) |
ES (1) | ES327380A1 (xx) |
GB (1) | GB1154152A (xx) |
NL (1) | NL151444B (xx) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3148280A1 (de) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
DK153572C (da) * | 1982-02-18 | 1988-12-19 | Platonec Aps | Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf |
DE3407114A1 (de) * | 1984-02-28 | 1985-09-05 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von leiterplatten |
DE3424065A1 (de) * | 1984-06-29 | 1986-01-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
US5250105A (en) * | 1991-02-08 | 1993-10-05 | Eid-Empresa De Investigacao E Desenvolvimento De Electronica S.A. | Selective process for printing circuit board manufacturing |
US7981508B1 (en) | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
US8110254B1 (en) | 2006-09-12 | 2012-02-07 | Sri International | Flexible circuit chemistry |
US7989029B1 (en) | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
CZ309595B6 (cs) * | 2022-03-18 | 2023-05-03 | Ego 93 S.R.O. | Aktivační roztok a způsob jeho přípravy |
-
1966
- 1966-05-26 DE DE1966P0039535 patent/DE1521445C3/de not_active Expired
- 1966-05-31 ES ES0327380A patent/ES327380A1/es not_active Expired
- 1966-05-31 DK DK279966A patent/DK132801C/da active
- 1966-05-31 BE BE681865D patent/BE681865A/xx unknown
- 1966-06-01 GB GB2442766A patent/GB1154152A/en not_active Expired
- 1966-06-01 NL NL6607558A patent/NL151444B/xx not_active IP Right Cessation
- 1966-06-01 AT AT519666A patent/AT280725B/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AT280725B (de) | 1970-04-27 |
DE1521445A1 (de) | 1970-10-08 |
DK132801B (da) | 1976-02-09 |
DK132801C (da) | 1976-07-12 |
GB1154152A (en) | 1969-06-04 |
NL6607558A (xx) | 1966-12-02 |
DE1521445C3 (de) | 1979-11-29 |
NL151444B (nl) | 1976-11-15 |
BE681865A (xx) | 1966-10-31 |
DE1521445B2 (de) | 1976-12-30 |
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