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DK132801C - Fremgangsmade til at gore isolerende substrater katalytiske overfor modtagelse af stromlost afsat metal og podningsmiddel til anvendelse ved fremgangsmaden - Google Patents

Fremgangsmade til at gore isolerende substrater katalytiske overfor modtagelse af stromlost afsat metal og podningsmiddel til anvendelse ved fremgangsmaden

Info

Publication number
DK132801C
DK132801C DK279966A DK279966A DK132801C DK 132801 C DK132801 C DK 132801C DK 279966 A DK279966 A DK 279966A DK 279966 A DK279966 A DK 279966A DK 132801 C DK132801 C DK 132801C
Authority
DK
Denmark
Prior art keywords
procedure
deposited metal
insulating substrates
transfer receiving
seeding material
Prior art date
Application number
DK279966A
Other languages
Danish (da)
English (en)
Other versions
DK132801B (da
Inventor
F W Schveble
E J Leech
J Polichette
P A Brown
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK132801B publication Critical patent/DK132801B/da
Application granted granted Critical
Publication of DK132801C publication Critical patent/DK132801C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
DK279966A 1965-06-01 1966-05-31 Fremgangsmade til at gore isolerende substrater katalytiske overfor modtagelse af stromlost afsat metal og podningsmiddel til anvendelse ved fremgangsmaden DK132801C (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46058565A 1965-06-01 1965-06-01

Publications (2)

Publication Number Publication Date
DK132801B DK132801B (da) 1976-02-09
DK132801C true DK132801C (da) 1976-07-12

Family

ID=23829306

Family Applications (1)

Application Number Title Priority Date Filing Date
DK279966A DK132801C (da) 1965-06-01 1966-05-31 Fremgangsmade til at gore isolerende substrater katalytiske overfor modtagelse af stromlost afsat metal og podningsmiddel til anvendelse ved fremgangsmaden

Country Status (7)

Country Link
AT (1) AT280725B (xx)
BE (1) BE681865A (xx)
DE (1) DE1521445C3 (xx)
DK (1) DK132801C (xx)
ES (1) ES327380A1 (xx)
GB (1) GB1154152A (xx)
NL (1) NL151444B (xx)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3424065A1 (de) * 1984-06-29 1986-01-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US5250105A (en) * 1991-02-08 1993-10-05 Eid-Empresa De Investigacao E Desenvolvimento De Electronica S.A. Selective process for printing circuit board manufacturing
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
CZ309595B6 (cs) * 2022-03-18 2023-05-03 Ego 93 S.R.O. Aktivační roztok a způsob jeho přípravy

Also Published As

Publication number Publication date
AT280725B (de) 1970-04-27
DE1521445A1 (de) 1970-10-08
DK132801B (da) 1976-02-09
GB1154152A (en) 1969-06-04
NL6607558A (xx) 1966-12-02
DE1521445C3 (de) 1979-11-29
ES327380A1 (es) 1967-07-16
NL151444B (nl) 1976-11-15
BE681865A (xx) 1966-10-31
DE1521445B2 (de) 1976-12-30

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