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ES222691A1 - Mejoras introducidas en los sistemas de electrodos de capa de bloqueo - Google Patents

Mejoras introducidas en los sistemas de electrodos de capa de bloqueo

Info

Publication number
ES222691A1
ES222691A1 ES0222691A ES222691A ES222691A1 ES 222691 A1 ES222691 A1 ES 222691A1 ES 0222691 A ES0222691 A ES 0222691A ES 222691 A ES222691 A ES 222691A ES 222691 A1 ES222691 A1 ES 222691A1
Authority
ES
Spain
Prior art keywords
support plate
semi
conductive device
germanium
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0222691A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES222691A1 publication Critical patent/ES222691A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

Mejoras introducidas en los sistemas de electrodos de capas de bloqueo que comprende un cuerpo semiconductor de germanio o silicio soldado a una placa de soporte, más en particular un diodo a cristal o un transistor, caracterizadas por el hecho de que la placa de soporte consiste de uno de los metales de transición no radioactivos de la sexta columna del sistema periódico, es decir, cromo, molibdeno o tungsteno.
ES0222691A 1954-07-01 1955-06-28 Mejoras introducidas en los sistemas de electrodos de capa de bloqueo Expired ES222691A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL188893 1954-07-01

Publications (1)

Publication Number Publication Date
ES222691A1 true ES222691A1 (es) 1956-01-01

Family

ID=19750670

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0222691A Expired ES222691A1 (es) 1954-07-01 1955-06-28 Mejoras introducidas en los sistemas de electrodos de capa de bloqueo

Country Status (8)

Country Link
US (1) US2971251A (es)
BE (1) BE539442A (es)
CH (1) CH333704A (es)
DE (2) DE1242298B (es)
ES (1) ES222691A1 (es)
FR (1) FR1126817A (es)
GB (1) GB772583A (es)
NL (1) NL107577C (es)

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DE1665969B1 (de) * 1967-06-15 1972-01-20 Siemens Ag Dichte Durchfuehrung eines oder mehrerer elektrischer und/oder Waermeleiter durch einen Isolierkoerper
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NL136384B (es) * 1943-05-01 1900-01-01
US2441603A (en) * 1943-07-28 1948-05-18 Bell Telephone Labor Inc Electrical translating materials and method of making them
US2391456A (en) * 1944-01-29 1945-12-25 Mallory & Co Inc P R Spark plug electrode
US2555001A (en) * 1947-02-04 1951-05-29 Bell Telephone Labor Inc Bonded article and method of bonding
US2567970A (en) * 1947-12-24 1951-09-18 Bell Telephone Labor Inc Semiconductor comprising silicon and method of making it
US2525565A (en) * 1948-07-12 1950-10-10 Eitel Mccullough Inc Filamentary cathode for electron tubes
US2690409A (en) * 1949-07-08 1954-09-28 Thompson Prod Inc Binary coating of refractory metals
NL107577C (es) * 1954-07-01
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices

Also Published As

Publication number Publication date
CH333704A (de) 1958-10-31
US2971251A (en) 1961-02-14
FR1126817A (fr) 1956-12-03
GB772583A (en) 1957-04-17
BE539442A (es)
NL107577C (es)
DE1242298B (de) 1967-06-15
DE1212639B (de) 1966-03-17

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