ES1010155U - Una placa de circuito impreso. - Google Patents
Una placa de circuito impreso.Info
- Publication number
- ES1010155U ES1010155U ES19898901406U ES8901406U ES1010155U ES 1010155 U ES1010155 U ES 1010155U ES 19898901406 U ES19898901406 U ES 19898901406U ES 8901406 U ES8901406 U ES 8901406U ES 1010155 U ES1010155 U ES 1010155U
- Authority
- ES
- Spain
- Prior art keywords
- translation
- circuit board
- machine
- printed circuit
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
UNA PLACA DE CIRCUITO IMPRESO QUE ESTA PROVISTA DE COMPONENTES (12) CUYOS CONDUCTORES (13A, 13B) SE EXTIENDEN DESDE UNA PRIMERA SUPERFICIE (11) DE LA PLACA A TRAVES DE AGUJEROS (1), EN DONDE LAS PARTES DE EXTREMIDAD (16A, 16B) DE LOS CONDUCTORES QUE SALEN DE LA SEGUNDA SUPERFICIE (14) DE LA PLACA ESTAN CURVADAS HACIA UN LADO SOBRE LA SEGUNDA SUPERFICIE (14) DE LA PLACA, CARACTERIZADA PORQUE LAS PARTES DE EXTREMIDAD (16A, 16B) DE LOS CONDUCTORES ESTAN CURVADOS APROXIMADAMENTE DE MODO PERPENDICULAR A LA DIRECCION LONGITUDINAL DEL COMPONENTE (12) EN DIRECCIONES OPUESTAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8806029U DE8806029U1 (de) | 1988-05-06 | 1988-05-06 | Elektrische Schaltungsplatte mit gedruckten Leitungszügen |
Publications (2)
Publication Number | Publication Date |
---|---|
ES1010155U true ES1010155U (es) | 1989-12-01 |
ES1010155Y ES1010155Y (es) | 1990-05-01 |
Family
ID=6823783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES19898901406U Expired - Lifetime ES1010155Y (es) | 1988-05-06 | 1989-05-03 | Una placa de circuito impreso. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH01162271U (es) |
DE (1) | DE8806029U1 (es) |
ES (1) | ES1010155Y (es) |
FR (1) | FR2631201B3 (es) |
IT (1) | IT216550Z2 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6457789A (en) * | 1987-08-28 | 1989-03-06 | Mitsubishi Electric Corp | Electronic component mounting structure |
JP4825720B2 (ja) * | 2007-04-19 | 2011-11-30 | 矢崎総業株式会社 | プリント配線板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049665B2 (ja) * | 1975-10-23 | 1985-11-02 | 東洋インキ製造株式会社 | 硬化性塗料用組成物 |
JPS6293993A (ja) * | 1985-10-19 | 1987-04-30 | 松下電器産業株式会社 | 電子回路装置とその実装方法 |
JPS6364388A (ja) * | 1986-09-04 | 1988-03-22 | 松下電器産業株式会社 | 回路部品の実装方法 |
-
1988
- 1988-05-06 DE DE8806029U patent/DE8806029U1/de not_active Expired
-
1989
- 1989-05-02 JP JP1989051701U patent/JPH01162271U/ja active Pending
- 1989-05-02 FR FR898905807A patent/FR2631201B3/fr not_active Expired - Lifetime
- 1989-05-03 ES ES19898901406U patent/ES1010155Y/es not_active Expired - Lifetime
- 1989-05-03 IT IT8921001U patent/IT216550Z2/it active
Also Published As
Publication number | Publication date |
---|---|
JPH01162271U (es) | 1989-11-10 |
FR2631201B3 (fr) | 1990-03-09 |
DE8806029U1 (de) | 1988-06-30 |
FR2631201A3 (fr) | 1989-11-10 |
IT8921001V0 (it) | 1989-05-03 |
IT216550Z2 (it) | 1991-09-16 |
ES1010155Y (es) | 1990-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC1K | Transfer of utility model |
Owner name: PHILIPS ELECTRONICS N.V. |
|
FD1K | Utility model lapsed |
Effective date: 20000403 |