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EP3120379A4 - Abrasive pad and glass substrate abrading method - Google Patents

Abrasive pad and glass substrate abrading method Download PDF

Info

Publication number
EP3120379A4
EP3120379A4 EP15764427.9A EP15764427A EP3120379A4 EP 3120379 A4 EP3120379 A4 EP 3120379A4 EP 15764427 A EP15764427 A EP 15764427A EP 3120379 A4 EP3120379 A4 EP 3120379A4
Authority
EP
European Patent Office
Prior art keywords
glass substrate
abrasive pad
abrading method
substrate abrading
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15764427.9A
Other languages
German (de)
French (fr)
Other versions
EP3120379A1 (en
Inventor
Yoko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP3120379A1 publication Critical patent/EP3120379A1/en
Publication of EP3120379A4 publication Critical patent/EP3120379A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Surface Treatment Of Glass (AREA)
EP15764427.9A 2014-03-19 2015-03-17 Abrasive pad and glass substrate abrading method Withdrawn EP3120379A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014056538A JP6452295B2 (en) 2014-03-19 2014-03-19 Polishing pad and glass substrate polishing method
PCT/US2015/020859 WO2015142774A1 (en) 2014-03-19 2015-03-17 Abrasive pad and glass substrate abrading method

Publications (2)

Publication Number Publication Date
EP3120379A1 EP3120379A1 (en) 2017-01-25
EP3120379A4 true EP3120379A4 (en) 2017-11-01

Family

ID=54145183

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15764427.9A Withdrawn EP3120379A4 (en) 2014-03-19 2015-03-17 Abrasive pad and glass substrate abrading method

Country Status (6)

Country Link
US (1) US20170066099A1 (en)
EP (1) EP3120379A4 (en)
JP (1) JP6452295B2 (en)
KR (1) KR20160135269A (en)
CN (1) CN106104766A (en)
WO (1) WO2015142774A1 (en)

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Publication number Priority date Publication date Assignee Title
JP6033886B2 (en) 2011-12-30 2016-11-30 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド Shaped abrasive particles and method for forming the same
EP3851248B1 (en) 2011-12-30 2024-04-03 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
CA3056658C (en) 2012-01-10 2023-07-04 Doruk O. Yener Abrasive particles having complex shapes and methods of forming same
US8840696B2 (en) 2012-01-10 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
KR101996215B1 (en) 2012-05-23 2019-07-05 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Shaped abrasive particles and methods of forming same
IN2015DN00343A (en) 2012-06-29 2015-06-12 Saint Gobain Ceramics
MX2015004594A (en) 2012-10-15 2015-07-23 Saint Gobain Abrasives Inc Abrasive particles having particular shapes and methods of forming such particles.
JP6155384B2 (en) 2013-03-29 2017-06-28 サンーゴバン アブレイシブズ，インコーポレイティド Abrasive particles having a particular shape and method for forming such particles
WO2015048768A1 (en) 2013-09-30 2015-04-02 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and methods of forming same
CA2934938C (en) 2013-12-31 2019-04-30 Saint-Gobain Abrasives, Inc. Abrasive article including shaped abrasive particles
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
PT3131706T (en) 2014-04-14 2024-03-05 Saint Gobain Ceram And Plastics Inc Abrasive article including shaped abrasive particles
JP6484647B2 (en) 2014-04-14 2019-03-13 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド Abrasive articles containing shaped abrasive particles
WO2015184355A1 (en) 2014-05-30 2015-12-03 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
TWI634200B (en) 2015-03-31 2018-09-01 聖高拜磨料有限公司 Fixed abrasive article and method of forming same
EP3277459B1 (en) 2015-03-31 2023-08-16 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
CN107864637B (en) 2015-06-11 2022-11-22 圣戈本陶瓷及塑料股份有限公司 Abrasive articles comprising shaped abrasive particles
JP6754519B2 (en) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 Polishing method
JP6309161B2 (en) 2016-03-25 2018-04-11 バンドー化学株式会社 Abrasive
WO2017197006A1 (en) 2016-05-10 2017-11-16 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles and methods of forming same
CN109462993A (en) 2016-05-10 2019-03-12 圣戈本陶瓷及塑料股份有限公司 Abrasive grain and forming method thereof
CN105773458B (en) * 2016-05-16 2017-08-29 衢州学院 A kind of high solids content nanometer spherical silicon dioxide polishing film and preparation method thereof
US11230653B2 (en) 2016-09-29 2022-01-25 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
WO2018236989A1 (en) 2017-06-21 2018-12-27 Saint-Gobain Ceramics & Plastics, Inc. PARTICULATE MATERIALS AND METHODS OF FORMATION THEREOF
USD859767S1 (en) * 2017-07-07 2019-09-10 Inland Diamond Products Company Flexible abrasive pad
USD873517S1 (en) * 2017-07-21 2020-01-21 3M Innovative Properties Company Floor scrubbing pad
USD866892S1 (en) * 2017-07-28 2019-11-12 3M Innovative Properties Company Scouring pad
KR102608901B1 (en) * 2018-12-24 2023-12-01 삼성전자주식회사 Wafer Grinding Wheel
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
JP3224896U (en) * 2019-11-13 2020-01-30 バンドー化学株式会社 Polishing pad
JP2021098250A (en) * 2019-12-20 2021-07-01 スリーエム イノベイティブ プロパティズ カンパニー Polishing sheet and polishing method
EP4081369A4 (en) 2019-12-27 2024-04-10 Saint-Gobain Ceramics & Plastics Inc. Abrasive articles and methods of forming same
WO2021133876A1 (en) 2019-12-27 2021-07-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
CN113211336B (en) * 2021-03-31 2022-03-08 安徽禾臣新材料有限公司 Polishing pad for polishing corners of electronic display screen and production method thereof
CN114043380B (en) * 2021-11-18 2022-11-29 北京烁科精微电子装备有限公司 Grinding pad and grinding device with same
WO2023225356A1 (en) * 2022-05-20 2023-11-23 3M Innovative Properties Company Abrasive assembly with abrasive segments

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EP1094918A1 (en) * 1998-02-19 2001-05-02 Minnesota Mining And Manufacturing Company Abrasive article and method for grinding glass
WO2011058969A1 (en) * 2009-11-10 2011-05-19 昭和電工株式会社 Method for manufacturing glass substrate for use in magnetic recording medium
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TWI544064B (en) * 2010-09-03 2016-08-01 聖高拜磨料有限公司 Bonded abrasive article and method of forming
JP6188286B2 (en) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad and glass, ceramics, and metal material polishing method

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5078753A (en) * 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
EP1094918A1 (en) * 1998-02-19 2001-05-02 Minnesota Mining And Manufacturing Company Abrasive article and method for grinding glass
WO2011058969A1 (en) * 2009-11-10 2011-05-19 昭和電工株式会社 Method for manufacturing glass substrate for use in magnetic recording medium
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same

Non-Patent Citations (1)

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Title
See also references of WO2015142774A1 *

Also Published As

Publication number Publication date
EP3120379A1 (en) 2017-01-25
KR20160135269A (en) 2016-11-25
US20170066099A1 (en) 2017-03-09
JP2015178155A (en) 2015-10-08
JP6452295B2 (en) 2019-01-16
CN106104766A (en) 2016-11-09
WO2015142774A1 (en) 2015-09-24

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