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EP3120379A4 - Patin abrasif et procédé d'abrasion de substrat de verre - Google Patents

Patin abrasif et procédé d'abrasion de substrat de verre Download PDF

Info

Publication number
EP3120379A4
EP3120379A4 EP15764427.9A EP15764427A EP3120379A4 EP 3120379 A4 EP3120379 A4 EP 3120379A4 EP 15764427 A EP15764427 A EP 15764427A EP 3120379 A4 EP3120379 A4 EP 3120379A4
Authority
EP
European Patent Office
Prior art keywords
glass substrate
abrasive pad
abrading method
substrate abrading
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15764427.9A
Other languages
German (de)
English (en)
Other versions
EP3120379A1 (fr
Inventor
Yoko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP3120379A1 publication Critical patent/EP3120379A1/fr
Publication of EP3120379A4 publication Critical patent/EP3120379A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Surface Treatment Of Glass (AREA)
EP15764427.9A 2014-03-19 2015-03-17 Patin abrasif et procédé d'abrasion de substrat de verre Withdrawn EP3120379A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014056538A JP6452295B2 (ja) 2014-03-19 2014-03-19 研磨パッド及びガラス基板の研磨方法
PCT/US2015/020859 WO2015142774A1 (fr) 2014-03-19 2015-03-17 Patin abrasif et procédé d'abrasion de substrat de verre

Publications (2)

Publication Number Publication Date
EP3120379A1 EP3120379A1 (fr) 2017-01-25
EP3120379A4 true EP3120379A4 (fr) 2017-11-01

Family

ID=54145183

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15764427.9A Withdrawn EP3120379A4 (fr) 2014-03-19 2015-03-17 Patin abrasif et procédé d'abrasion de substrat de verre

Country Status (6)

Country Link
US (1) US20170066099A1 (fr)
EP (1) EP3120379A4 (fr)
JP (1) JP6452295B2 (fr)
KR (1) KR20160135269A (fr)
CN (1) CN106104766A (fr)
WO (1) WO2015142774A1 (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6033886B2 (ja) 2011-12-30 2016-11-30 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 成形研磨粒子および同粒子を形成する方法
PL2797716T3 (pl) 2011-12-30 2021-07-05 Saint-Gobain Ceramics & Plastics, Inc. Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania
WO2013106602A1 (fr) 2012-01-10 2013-07-18 Saint-Gobain Ceramics & Plastics, Inc. Particules abrasives ayant des formes particulières et procédés de mise en forme de telles particules
CA2987793C (fr) 2012-01-10 2019-11-05 Saint-Gobain Ceramics & Plastics, Inc. Particules abrasives dotees de formes complexes et leur procede de formation
EP3834988B1 (fr) 2012-05-23 2023-11-08 Saint-Gobain Ceramics & Plastics Inc. Particules abrasives mises en forme et leurs procédés de formation
EP2866977B8 (fr) 2012-06-29 2023-01-18 Saint-Gobain Ceramics & Plastics, Inc. Particules abrasives ayant des formes particulières et procédés de formation de telles particules
KR101736085B1 (ko) 2012-10-15 2017-05-16 생-고뱅 어브레이시브즈, 인코포레이티드 특정한 형태들을 가진 연마 입자들 및 이러한 입자들을 형성하는 방법들
CN105073343B (zh) 2013-03-29 2017-11-03 圣戈班磨料磨具有限公司 具有特定形状的磨粒、形成这种粒子的方法及其用途
CN105764653B (zh) 2013-09-30 2020-09-11 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
EP3089851B1 (fr) 2013-12-31 2019-02-06 Saint-Gobain Abrasives, Inc. Article abrasif comprenant des particules abrasives façonnées
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
MX394114B (es) 2014-04-14 2025-03-24 Saint Gobain Ceramics Articulo abrasivo que incluye particulas abrasivas conformadas.
KR101884178B1 (ko) 2014-04-14 2018-08-02 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마 입자들을 포함하는 연마 물품
WO2015184355A1 (fr) 2014-05-30 2015-12-03 Saint-Gobain Abrasives, Inc. Procédé d'utilisation d'un article abrasif comprenant des particules abrasives mises en forme
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
EP3277459B1 (fr) 2015-03-31 2023-08-16 Saint-Gobain Abrasives, Inc. Articles abrasifs fixes et procédés pour les former
CN115781499A (zh) 2015-06-11 2023-03-14 圣戈本陶瓷及塑料股份有限公司 包括经成形研磨颗粒的研磨制品
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
JP6309161B2 (ja) 2016-03-25 2018-04-11 バンドー化学株式会社 研磨材
PL3455321T3 (pl) 2016-05-10 2022-12-12 Saint-Gobain Ceramics&Plastics, Inc. Sposób formowania cząstek ściernych
WO2017197002A1 (fr) 2016-05-10 2017-11-16 Saint-Gobain Ceramics & Plastics, Inc. Particules abrasives et leurs procédés de formation
CN105773458B (zh) * 2016-05-16 2017-08-29 衢州学院 一种高固含量纳米球状二氧化硅抛光薄膜及其制备方法
US11230653B2 (en) 2016-09-29 2022-01-25 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10865148B2 (en) 2017-06-21 2020-12-15 Saint-Gobain Ceramics & Plastics, Inc. Particulate materials and methods of forming same
USD859767S1 (en) * 2017-07-07 2019-09-10 Inland Diamond Products Company Flexible abrasive pad
USD873517S1 (en) * 2017-07-21 2020-01-21 3M Innovative Properties Company Floor scrubbing pad
USD866892S1 (en) * 2017-07-28 2019-11-12 3M Innovative Properties Company Scouring pad
KR102608901B1 (ko) 2018-12-24 2023-12-01 삼성전자주식회사 웨이퍼 그라인딩 휠
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
JP3224896U (ja) * 2019-11-13 2020-01-30 バンドー化学株式会社 研磨パッド
JP2021098250A (ja) * 2019-12-20 2021-07-01 スリーエム イノベイティブ プロパティズ カンパニー 研磨シート及び研磨方法
US11926019B2 (en) 2019-12-27 2024-03-12 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
CN114846112A (zh) 2019-12-27 2022-08-02 圣戈本陶瓷及塑料股份有限公司 磨料制品及其形成方法
CN113211336B (zh) * 2021-03-31 2022-03-08 安徽禾臣新材料有限公司 一种电子显示屏边角抛光用抛光垫及其生产方法
CN114043380B (zh) * 2021-11-18 2022-11-29 北京烁科精微电子装备有限公司 一种研磨垫及具有其的研磨装置
WO2023225356A1 (fr) * 2022-05-20 2023-11-23 3M Innovative Properties Company Ensemble abrasif à segments abrasifs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5078753A (en) * 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
EP1094918A1 (fr) * 1998-02-19 2001-05-02 Minnesota Mining And Manufacturing Company Article abrasif et procede de meulage de verre
WO2011058969A1 (fr) * 2009-11-10 2011-05-19 昭和電工株式会社 Procédé de fabrication d'un substrat de verre destiné à un support d'enregistrement magnétique
WO2012138705A2 (fr) * 2011-04-05 2012-10-11 Universal Photonics, Inc. Tampon de polissage auto-conditionnant et son procédé de fabrication

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JPS63234037A (ja) * 1987-02-26 1988-09-29 ミネソタ　マイニング　アンド　マニユフアクチユアリング　カンパニー 研摩剤物品およびその製造方法
US6458018B1 (en) * 1999-04-23 2002-10-01 3M Innovative Properties Company Abrasive article suitable for abrading glass and glass ceramic workpieces
US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6394888B1 (en) * 1999-05-28 2002-05-28 Saint-Gobain Abrasive Technology Company Abrasive tools for grinding electronic components
JP2001225273A (ja) * 2000-02-15 2001-08-21 Xebec Technology Co Ltd 研磨研削材
KR100733948B1 (ko) * 2000-04-28 2007-07-02 쓰리엠 이노베이티브 프로퍼티즈 캄파니 유리 연삭을 위한 연마 제품 및 방법
US8545583B2 (en) * 2000-11-17 2013-10-01 Wayne O. Duescher Method of forming a flexible abrasive sheet article
JP4530611B2 (ja) * 2002-12-06 2010-08-25 株式会社ノリタケカンパニーリミテド レジノイド研削砥石
US6951504B2 (en) * 2003-03-20 2005-10-04 3M Innovative Properties Company Abrasive article with agglomerates and method of use
US8002612B2 (en) * 2004-04-08 2011-08-23 3M Innovative Properties Company Attachment system for a sanding tool
US7618306B2 (en) * 2005-09-22 2009-11-17 3M Innovative Properties Company Conformable abrasive articles and methods of making and using the same
US8142891B2 (en) * 2008-12-17 2012-03-27 3M Innovative Properties Company Dish-shaped abrasive particles with a recessed surface
US8142532B2 (en) * 2008-12-17 2012-03-27 3M Innovative Properties Company Shaped abrasive particles with an opening
TWI544064B (zh) * 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5078753A (en) * 1990-10-09 1992-01-07 Minnesota Mining And Manufacturing Company Coated abrasive containing erodable agglomerates
EP1094918A1 (fr) * 1998-02-19 2001-05-02 Minnesota Mining And Manufacturing Company Article abrasif et procede de meulage de verre
WO2011058969A1 (fr) * 2009-11-10 2011-05-19 昭和電工株式会社 Procédé de fabrication d'un substrat de verre destiné à un support d'enregistrement magnétique
WO2012138705A2 (fr) * 2011-04-05 2012-10-11 Universal Photonics, Inc. Tampon de polissage auto-conditionnant et son procédé de fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015142774A1 *

Also Published As

Publication number Publication date
US20170066099A1 (en) 2017-03-09
CN106104766A (zh) 2016-11-09
EP3120379A1 (fr) 2017-01-25
JP2015178155A (ja) 2015-10-08
KR20160135269A (ko) 2016-11-25
WO2015142774A1 (fr) 2015-09-24
JP6452295B2 (ja) 2019-01-16

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