EP3120379A1 - Abrasive pad and glass substrate abrading method - Google Patents
Abrasive pad and glass substrate abrading methodInfo
- Publication number
- EP3120379A1 EP3120379A1 EP15764427.9A EP15764427A EP3120379A1 EP 3120379 A1 EP3120379 A1 EP 3120379A1 EP 15764427 A EP15764427 A EP 15764427A EP 3120379 A1 EP3120379 A1 EP 3120379A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- abrasive
- abrading
- filler
- abrasive pad
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 85
- 239000002245 particle Substances 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000005498 polishing Methods 0.000 claims abstract description 25
- 239000003082 abrasive agent Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000011230 binding agent Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000011324 bead Substances 0.000 claims description 22
- 239000012530 fluid Substances 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 9
- 229910052604 silicate mineral Inorganic materials 0.000 claims description 3
- 238000005299 abrasion Methods 0.000 description 53
- 239000010410 layer Substances 0.000 description 52
- 238000012360 testing method Methods 0.000 description 26
- 239000002002 slurry Substances 0.000 description 22
- 239000002585 base Substances 0.000 description 15
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- 229910052623 talc Inorganic materials 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Definitions
- the present invention relates to an abrasive pad and a glass substrate abrading method.
- the abrasive article disclosed in, for example, Patent Document 1 is a conventional abrasive pad.
- This abrasive article is configured from an abrasive material provided on one side of a backing member with a rectangular or other shape.
- pointed protruding portions are formed on the base portion of the abrasive layer formed with abrasive material.
- Patent Document 1 Japanese Unexamined Patent Application
- Patent Document 2 U.S. Unexamined Patent Application
- a conceivable measure to extend the useful life of an abrasive article is to increase the height of the protruding portions of the abrasive layer to increase the volume of the abrasive layer.
- increasing the height of the protruding portions may lead to the protruding portions becoming prone to collapsing due to the load during abrading.
- the quantity of abrasive material required to form the protruding portion increases, which has the problem that the cost advantages are reduced.
- Reducing the amount of abrasion of the abrasive layer is also conceivable in order to extend the life of the abrasive article.
- the amount of abrasion of the abrasive layer can conceivably be reduced by, for example, reducing the hardness of the abrasive layer to more easily release uneven load during abrasion.
- the hardness of the abrasive layer is reduced, the amount of abrasion of the object to be abraded is significantly reduced, and it may not be possible to achieve sufficient abrasion.
- One aspect of the present invention relates to an abrasive pad used to abrade the surface of glass substrates, and includes a base material layer, and an abrasive layer provided on one side of the base material layer.
- the abrasive layer includes a plurality of pillar shaped abrading portions arranged separated from each other on the base material layer, the abrading portions are made from abrasive material that includes polishing abrasive particles, a filler, and a binder resin, the polishing abrasive particles include abrasive particles and a glass matrix, and the filler includes a first filler that fractures or drops out when the surface is being abraded, forming approximately spherical crown shaped recesses in the top face of the abrading portions.
- another aspect of the present invention is a glass substrate abrading method using the above abrasive pad, that includes: securing a second surface side of the base material layer on a surface plate and bringing the abrasive layer into contact with an object to be abraded; and relatively rubbing the abrasive pad and the object to be abraded while introducing grinding fluid between the object to be abraded and the abrasive layer.
- FIG. 1 is a perspective view illustrating an abrasive pad according to an embodiment of the present invention.
- FIG. 2 is an enlarged perspective view illustrating the main parts of the abrasive pad illustrated in FIG. 1.
- FIG. 3 is an enlarged side view illustrating the main parts of the abrasive pad illustrated in FIG. 1.
- FIGS. 4A to 4E are perspective views illustrating modified examples of an abrading portion.
- FIGS. 5 A and 5B are side views illustrating abrading methods of an object to be abraded using the abrasive pad illustrated in FIG. 1.
- FIGS. 6A-6D illustrate the results of observation of the abrading portion top face of samples of abrasive pads produced in the working examples and comparative examples, after the abrasion test, using a scanning electron microscope (SEM).
- SEM scanning electron microscope
- FIG. 1 is a perspective view illustrating an abrasive pad according to an embodiment of the present invention.
- FIG. 2 is an enlarged perspective view illustrating the main parts of the abrasive pad illustrated in FIG. 1
- FIG. 3 is an enlarged side view thereof.
- an abrasive pad 1 includes a base material layer 11 that is a support member for the pad, and an abrasive layer 12 provided on one side of the base material layer 11.
- the abrasive layer 12 includes a plurality of pillar shaped abrading portions 15 arranged separated from each other on the base material layer 11.
- the abrasive pad 1 has a disk shape with, for example, a diameter of from 30 mm to 1,500 mm.
- the shape of the abrasive pad according to the present invention is not limited to this, and the shape can be changed as appropriate in accordance with the abrading conditions, the abrading device, and so on.
- the base material layer 11 for example, is configured with a thickness of around 1 mm so that the abrasive pad 1 has a certain amount of strength and flexibility. Also, the base material layer is configured from, for example, a base material 13 and an adhesive layer 14.
- the base material 13 can be configured from, for example, polymer film, paper, vulcanized fiber, nonwoven fabric, woven fabric, and so on. Of these, preferably polymer film is used, and the polymer film can be, for example, polyethylene terephthalate film, polyester film, copolyester film, polyimide film, polyamide film, and so on.
- the adhesive layer 14 is a layer that joins the base material 13 and the abrading portions 15 to provide an integrated abrasive pad.
- the adhesive layer 14 can be formed from, for example, hot melt adhesive, thermosetting adhesive, or the like.
- the hot melt adhesive can be, for example, a hot melt adhesive that includes a thermoplastic resin such as ethylene acrylic acid copolymer (EAA), ethylene vinyl acetate copolymer (EVA), and so on.
- EAA ethylene acrylic acid copolymer
- EVA ethylene vinyl acetate copolymer
- the thermosetting adhesive can be, for example, a thermosetting adhesive that includes a thermosetting resin such as epoxy resin, phenol resin, urea resin, and so on and a curing agent.
- the abrading portions 15 are arranged on the base material layer 11 separated from each other, and are configured from abrasive materials including polishing abrasive particles, filler, and binder resin.
- the polishing abrasive particles include abrasive particles and a glass matrix that are dispersed within the abrading portions 15 and retained by the binder resin. Also, in the polishing abrasive particles, the abrasive particles are retained dispersed within the glass matrix.
- the average particle size of the polishing abrasive particles may be, for example, 10 ⁇ or more, and preferably 25 ⁇ or more. Also, the average particle size of the polishing abrasive particles may be, for example, 200 ⁇ or less, and preferably 100 ⁇ or less. In this patent specification, the average particle size of the polishing abrasive particles indicates the median diameter measured using a laser diffraction / scattering type particle size distribution measuring device LA-920 (manufactured by Horiba Ltd. (Kyoto City, Kyoto-fu)).
- the quantity of polishing abrasive particles in the abrasive material may be, for example, 0.5 mass or more, preferably 1 mass % or more, and more preferably 2 mass or more of the total mass of the abrasive material. Also, the quantity of polishing abrasive particles in the abrasive material may be, for example, 60 mass % or less, preferably 30 mass % or less, and more preferably 10 mass % or less of the total mass of the abrasive material.
- the abrasive particles may be, for example, diamond abrasive particles, aluminum oxide particles, cerium oxide particles, cubic boron nitride (cBN) particles, and so on, and of these preferably diamond abrasive particles are used.
- the average particle size of the abrasive particles is, for example,
- the average particle size of the abrasive particles is, for example, 100 ⁇ or less, and preferably 50 ⁇ or less.
- the average particle size of the abrasive particles indicates the median diameter measured using a laser diffraction / scattering type particle size distribution measuring device LA-920 (manufactured by Horiba Ltd. (Kyoto City, Kyoto-fu)).
- the quantity of abrasive particles in the polishing abrasive particles relative to the total volume of the polishing abrasive particles may be, for example, 20 vol or more, and preferably 30 vol % or more.
- the quantity of abrasive particles in the polishing abrasive particles relative to the total volume of the polishing abrasive particles may be, for example, 80 vol % or less, and preferably 70 vol % or less.
- the quantity of glass matrix in the polishing abrasive particles relative to the total volume of the polishing abrasive particles may be, for example, 20 vol or more, and preferably 30 vol % or more.
- the quantity of glass matrix in the polishing abrasive particles relative to the total volume of the polishing abrasive particles may be, for example, 80 vol % or less, and preferably 70 vol % or less.
- the binder resin is formed from a binder precursor.
- the binder precursor contains a resin in an uncured or unpolymerized state, and when the abrading portions 15 are fabricated, the resin in the binder precursor is polymerized or cured, forming the binder resin.
- the binder precursor may be, for example, a photocurable resin or a thermosetting resin, and of these, preferably a photocurable resin is used.
- an acrylic resin or the like can be used as the
- thermosetting resin for example an epoxy resin, phenol resin, or the like can be used as the thermosetting resin.
- the filler is used to control the rate of erosion of the abrading portions 15.
- the abrasive material includes a filler (hereafter referred to as the "first filler") that fractures or drops off when abrading the surface of the glass substrates and forms substantially spherical crown shaped recesses in the top face 16 of the abrading portions 15.
- the filler in other words, the substantially spherical filler
- the substantially spherical filler capable of forming the substantially spherical crown shaped recesses due to fracture or dropping off
- the wear of the abrading portions 15 is reduced, and by forming recesses in the top face 16 that contacts the object to be abraded, the contact area between the object to be abraded and the abrading portions 15 is reduced, so an effective load on the portion being abraded is applied and sufficient abrasion capability is ensured.
- the first filler is selected from glass balloons and glass beads, from the viewpoint of exhibiting the above effect more significantly. If the first filler is glass balloons or glass beads, when abrading the surface of glass substrates, effective fracture or dropping out occurs on the top face 16 of the abrading portions 15, and substantially spherical crown shaped recesses are effectively formed.
- Glass balloons are hollow particles made from glass, and fine glass hollow powder may also be used.
- glass balloons with a compressive strength of 1 or more can be preferably used as the glass balloons.
- Glass balloons having this compressive strength do not easily fracture during the process of manufacturing the abrasive pads, so it is possible to more reliably obtain the effect as described above.
- the true density of the glass balloons may be, for example, 0.1 g/cm 3 or more, and preferably 0.2 g/cm 3 or more.
- the true density of the glass balloons may be, for example, 1 g/cm 3 or less, and preferably 0.6 g/cm 3 or less.
- the average particle size of the glass balloons is, for example, from
- the average particle size of the glass balloons indicates the median diameter measured by laser diffraction / scattering type particle size distribution measuring device Partica LA-950 V2 (manufactured by Horiba Ltd. (Kyoto City, Kyoto-fu)).
- the median diameter of the glass balloon is the particle diameter at which, when the glass balloons are divided into two according to particle diameter, the glass balloons having a smaller particle diameter and the glass balloons having a larger diameter have equal volume.
- the average particle size of the glass balloons is 40 ⁇ or more, and more preferably 50 ⁇ or more. If the average particle size of the glass balloons is 40 ⁇ or more, the ratio G of the amount of wear of the abrading portions A (cm 3 ) to the amount of abrasion of the object to be abraded B (cm 3 ) (the G ratio, B/A) is significantly increased, and it is possible to obtain an abrasive pad that can exhibit good abrasion capability over a long period of time. Also, the average particle size of the glass balloons may be 70 ⁇ or less, and preferably 65 ⁇ or less.
- Glass beads are solid particles made from glass, and the average particle size of glass beads is, for example, from 5 to 100 ⁇ .
- the average particle size of the glass beads indicates the median diameter measured by laser diffraction / scattering type particle size distribution measuring device Partica LA-950 V2 (manufactured by Horiba Ltd. (Kyoto City, Kyoto-fu)).
- the median diameter of the glass beads refers the particle diameter at which, when the glass beads are divided into two according to particle diameter, the glass beads having a smaller particle diameter and the glass beads having a larger diameter have equal volume.
- the average particle size of the glass beads is 5 ⁇ or more, and more preferably 10 ⁇ or more. If the average particle size of the glass beads is 10 ⁇ or more, the ratio G of the amount of wear of the abrading portions A (cm 3 ) to the amount of abrasion of the object to be abraded B (cm 3 ), (the G ratio, B/A) is significantly increased, and it is possible to obtain an abrasive pad that can exhibit good abrasion capability over a long period of time. Also, the average particle size of the glass beads may be 100 ⁇ or less, and preferably 50 ⁇ or less.
- the true density of the glass beads may be, for example, 1.5 g/cm or more, and preferably 2 g/cm 3 or more. Also, the true density of the glass beads may be, for example, 4 g/cm 3 or less, and preferably 3.5 g/cm 3 or less.
- the abrasive material may include a commonly known filler (hereafter referred to as "second filler").
- Examples of the second filler include, for example: metal carbonates
- silica glass fibers, and the like
- silicates talc, clay (montmorillonite), feldspar, mica, calcium silicate, calcium metasilicate, sodium aluminosilicate, sodium silicate, lithium silicate, potassium silicate, and the like
- metal sulfates calcium sulfate, barium sulfate, sodium sulfate, aluminum sodium sulfate, aluminum sulfate, and the like
- gypsum vermiculite, wood flour, aluminum trihydrate, carbon black, metal oxides (calcium oxide (lime), aluminum oxide, tin oxide (e.g.
- thermoplastic particles polycarbonate, polyetherimide, polyester, polyethylene, polysulfone, polystyrene, acrylonitrile -butadiene- styrene block copolymer, polypropylene, acetal polymers, polyurethanes, nylon particles); thermosetting particles (phenolic bubbles, phenolic beads, polyurethane foam particles, and the like); and the like.
- halide salts can be used as the second filler.
- halide salts include sodium chloride, potassium cryolite, sodium cryolite, ammonium cryolite, potassium tetrafluoroborate, sodium tetrafluoroborate, silicon fluorides, potassium chloride, and magnesium chloride.
- a metal filler can be used, for example, tin, lead, bismuth, cobalt, antimony, cadmium, iron, and titanium.
- sulfur, organic sulfur compounds, graphite, and metal sulfides can be used.
- the quantity of filler in the abrasive material is 10 vol % or more, and more preferably is 20 vol % or more relative to the total volume of the abrasive material. If the quantity of the filler is 10 vol % or more, structural changes of the abrading portions 15 due to curing shrinkage of the binder resin are sufficiently minimized. Also, preferably the quantity of filler in the abrasive material is 70 vol % or less, and more preferably is 50 vol % or less relative to the total volume of the abrasive material. If the quantity of filler exceeds 70 vol , it may be difficult to form the abrading portions 15.
- the first filler can be used on its own as the filler, or the first filler and the second filler can be used in combination.
- the quantity of the first filler relative to the total quantity of filler in the abrasive material may be, for example, 10 vol % or more, preferably 20 vol % or more, and more preferably 30 vol % or more.
- the quantities of first filler and second filler can be adjusted as appropriate in accordance with the ratio of both the desired quantity of wear of the abrading portions 15 per unit time and the quantity of abrasion of the object to be abraded per unit time (the G ratio) or the like.
- the first filler when the first filler is selected from glass balloons and glass beads, when the content of the first filler is large, both the quantity of wear of the abrading portions 15 per unit time and the quantity of abrasion of the object to be abraded per unit time tend to become small, but the rate of reduction of wear is larger, so the ratio of the two (the G ratio) tends to increase.
- the quantity of abrasion of the object to be abraded per unit of quantity of the abrading portion increases, but the abrading time to achieve a specific quantity of abrasion tends to increase.
- the quantity of abrasion of the object to be abraded per unit time is increased by increasing the quantity of filler, but at the same time the quantity of wear of the abrading portions 15 per unit time tends to increase.
- the abrasive pad 1 by adjusting the proportions of the first filler and the second filler so that it is possible to achieve the desired quantity of wear of the abrading portions 15 per unit time and the quantity of abrasion of the object to be abraded per unit time, in other words, in order to achieve the desired abrasion ratio (G ratio) and abrasion time.
- the abrasive layer 12 is configured having a plurality of pillar shaped abrading portions 15.
- the abrading portion 15 has a top face 16, and the abrading surface of the abrasive pad is formed by each of the top faces 16 of the plurality of abrading portions 15.
- the abrading portions 15 are arranged in a matrix shape on the base material layer 11 such that the density is from 3 to 7 per 1 cm 2 , for example.
- Each abrading portion 15 has an approximately cuboid shape and an approximately square shape in plan view.
- the area of the top face 16 of the abrading portion 15 may be, for example, 4 mm 2 or more, and preferably 5 mm 2 or more. Also, the area of the top face 16 is, for example, 100 mm 2 or less, and preferably 50 mm 2 or less. In the abrading portion 15 having the top face 16 within this ideal range of area, it is possible to more significantly obtain the effect of reducing the quantity of wear due to the recesses formed by the first filler having an average particle size within the above ideal range.
- the height of the abrading portions 15 there is no particular limitation on the height of the abrading portions 15, but it can be 20% or more, or it can be 30% or more of the length of the short side on the bottom surface of the abrading portion 15. Also, there is no particular limitation on the upper limit to the height of the abrading portions 15, but in order to ensure sufficient strength in the sliding direction of the abrading portions 15, preferably the upper limit is 270% or less, and the height may be 150% or less.
- the height of the abrading portions 15 can be, for example, 0.01 mm or more, or can be 1 mm or more. Also, the height of the abrading portion may be 10 mm or less, or it may be 7 mm or less.
- the three-dimensional shape of the abrading portions 15 should be a pillar shape having a top face.
- FIGS. 4A to 4E are perspective views illustrating modified examples of the abrading portions 15.
- the abrading portion 15a which is one of the modified examples has an approximately triangular pillar shape, and the top face 16a thereof has an approximately triangular shape.
- the abrading portion 15b which is one of the modified examples has an approximately hexagonal pillar shape, and the top face 16b thereof has an approximately hexagonal shape.
- the abrading portion 15c which is one of the modified examples has an approximately circular pillar shape, and the top face 16c thereof has an approximately circular shape.
- the abrading portion 15d which is one of the modified examples has an approximately rectangular parallelepiped pillar shape, and the top face 16d thereof has an approximately rectangular shape.
- the abrading portion 15e which is one of the modified examples has an approximately square frustum of a pyramid shape, and the top face 16e thereof has an approximately square shape.
- the abrasive layer 12 may have one of these modified examples as the abrading portions 15, and may have a plurality of these modified examples.
- the three-dimensional shape of the abrading portions 15 can be selected as appropriate in accordance with the form of abrading.
- Adjacent abrading portions 15 are partitioned from each other by grooves 17 provided at predetermined intervals on the base material layer 11.
- the width of the groove 17 is, for example, appropriately selected from within a range of about 0.5 mm to 5 mm. If the width of the groove 17 is too narrow, there is a possibility that the flexibility of the abrasive pad 1 will be reduced.
- the bottom face of the groove is may formed on the based material layer 11 and the abrading portion 15 may be settled independently each other on the base material layer 11. As the abrading portion 15 is settled independently each other on the base material layer 11, the abrasive pad which has not only the rigid abrading portion 15 but also has a flexible performance as whole is gotten.
- Transfer methods for example, can be used as the method of forming the abrasive layer 12 having the abrading portions 15 as described above.
- a transfer mold with a three-dimensional shape corresponding to the abrading portions 15, for example, is produced, and the transfer mold is filled with a slurry that includes the polishing abrasive particles, the filler, and the binder precursor as precursors of the abrasive material that forms the abrading portions 15.
- a film that will form the base material layer 11 is laminated onto the transfer mold filled with the slurry.
- the slurry is cured through photoirradiation or the like, and when the film is peeled from the transfer mold, an abrasive pad 1 having the abrasive layer 12 formed on the base material layer 11 is obtained.
- an adhesive layer made from adhesive is provided on the surface of the film that will become the base material layer 11 on the side where the abrading portions 15 are formed, and after the film is peeled from the transfer mold, the adhesive layer is cured so that the film and the abrading portions 15 can be firmly bonded.
- FIGS. 5A and 5B illustrate methods of abrading a glass substrate using the abrasive pad 1.
- FIG. 5A illustrates an example of one-sided abrading, illustrating the abrading method for abrading one side of the object to be abraded (glass substrate) PI.
- the abrasive pad 1 is fixed to a surface of a grinder (surface plate) 22 via an elastic body layer 21.
- the grinder 22 is rotated while introducing a grinding fluid between the object to be abraded PI and the abrasive pad 1, and the surface of the object to be abraded PI is abraded while applying a load.
- a retainer 23 that holds the object to be abraded PI may also be rotated in the same direction as the grinder 22 or in an opposite direction thereof.
- FIG. 5B illustrates an example of two-sided abrading, illustrating the abrading method for abrading both sides of the object to be abraded (glass substrate) P2 at the same time.
- the respective abrasive pads 1 are secured to the surface of top and bottom grinders 24 with an elastic body layer 21 interposed between each abrasive pad 1 and grinder 24, and the object to be abraded P2 that is held by a retainer 25 is set between the grinders 24.
- the grinders 24 are rotated while supplying grinding fluid between the object to be abraded P2 and the abrasive pads 1, and both surfaces of the object to be abraded p2 are abraded while a load is applied. At this time, rotation of the grinders 24 in mutually opposite directions is preferred.
- attachment of the abrasive pads 1 to the grinders 22 and 24 can be done using, for example, a pressure sensitive type adhesive.
- a pressure sensitive type adhesive examples include latex crepe, rosin, polyacrylate ester, acrylic polymers, polybutyl acrylate, polyacrylate esters, vinyl ethers (e.g. polyvinyl n-butyl ether), alkyd adhesives, rubber adhesives (e.g. natural rubber, synthetic rubber, and chlorinated rubber), and mixtures thereof.
- the elastic body layer (flexible layer) 21 can be used as the elastic body layer (flexible layer) 21.
- the elastic body layer 21 may also be provided in advance on a second surface side (opposite surface side of the abrasive layer 12) of the base material layer 11 in the abrasive pad 1.
- the flexible layer 21 does not necessarily have to be provided, and the abrasive pad 1 may be directly attached to the grinders 22 and 24.
- grinding fluids include water-based solutions containing one or more types of the following: amines, mineral oil, kerosene, mineral spirits, water-soluble emulsions, polyethyleneimine, ethylene glycol,
- the grinding fluid may also contain corrosion inhibitors, bactericides, stabilizers, surfactants, emulsifiers, or the like.
- the method of manufacturing the abrasive pad can be determined by providing the first filler in a blending proportion determined based on the quantity of wear of the abrading portions per unit time and the quantity of abrasion of the object to be abraded per unit time. Also, in one aspect of the present invention, the life of the abrasive pad can be extended by the method of replacing the filler of the abrasive pad with the first filler as described above.
- abrasive pad samples were produced by a method that includes the following processes (1) through (6).
- the curable diamond slurry in the above process (1) includes polishing abrasive particles, filler, and binder precursor, and the composition thereof was as described in the item "Slurry composition” in Table 1 below. Also, primer N200 (a mixed solution that includes 1 to 5 mass each of polymethylene
- polyphenylene isocyanate and chlorinated rubber manufactured by Sumitomo 3M Limited, Shinagawa-ku, Tokyo
- the curable diamond slurry was cured by ultraviolet light irradiation in process (3).
- the abrading portions were cured by oven curing at 90°C for 36 hours. Also, in process (6), the EAA was melted by heating to 130°C for two hours, and the abrading portions and the PET film were joined by cooling to room
- a glass substrate was prepared as the object to be abraded by processing to a 150 mm diameter.
- Grinding fluid 5% aqueous solution of alkaline water soluble grinding fluid
- Rate of dropping grinding fluid 42 cc/minute
- Test duration 20 minutes x 4 times
- G ratio Total quantity of abrasion of the glass substrate (cm 3 ) / total quantity of wear of the abrading portions (cm 3 ).
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 1, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Glass balloons 1 (3MTM Glass Bubbles S22 (Sumitomo 3M Limited, Shinagawa-ku, Tokyo)) with average an particle size of 35 ⁇ , compressive strength of 2.8 MPa, true density of 0.22, and relative permittivity of 1.4 (indicated in the table as "GB1") were used as the filler.
- the results of the abrasion tests are as listed in Table 2.
- Abrasive pad samples were produced the same as for Working Example 1 except that instead of glass balloons 1, glass balloons 2 to 5 (indicated as “GB2", “GB3”, “GB4", “GB5" in the table) were used as the filler, and abrasion tests were carried out on the abrasive pad samples obtained.
- the compound amount of the glass balloons was adjusted so that the content of filler in the abrading portions (volume %) was the same as for Working Example 1.
- the results of the abrasion tests are as listed in Table 2.
- Abrasive pad samples were produced the same as for Working Example 1 except that the following glass beads 1 (indicated as "GDI" in the table) were used instead of the glass balloons 1 as the filler, and abrasion tests were carried out on the abrasive pads obtained.
- the compound amount of the glass beads was adjusted so that the content of filler in the abrading portions (volume %) was the same as for Working Example 1.
- the results of the abrasion tests are as listed in Table 2.
- Comparative Example 1 Comparative Example 1. Also, the G ratio of Working Examples 2 through 6 which had a predetermined average particle size was increased compared with Comparative Example 1, so it can be seen that more efficient abrasion work is enabled.
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 3, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Glass balloons 5 (GB5) and wollastonite (Wl) were used as the filler.
- the compound amount of the filler was adjusted so that the content of filler (GB5 and Wl) in the abrading portions (volume %) was the same in all Working Examples 7 through 11.
- the compound amount of the glass balloons 5 expressed as the quantity of glass balloons 5 as a percentage of the total volume of the filler was adjusted to 25 vol % (Working Example 7), 35 vol % (Working Example 8), 50 vol % (Working Example 9), 75 vol % (Working Example 10), and 100 vol % (Working Example 11).
- the results of the abrasion tests are as listed in Table 4.
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 3, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Wollastonite (Wl) was used as the filler.
- the compound amount of the filler was adjusted so that the content of filler in the abrading portions (volume %) was the same as for Working Examples 7 through 11.
- the results of the abrasion tests are as listed in Table 4.
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 5, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Glass balloons 4 (GB4) and wollastonite (Wl) were used as the filler.
- the compound amount of the filler was adjusted so that the content of filler (GB4 and Wl) in the abrading portions (volume %) was the same in all Working Examples 12 through 16.
- the compound amount of the glass balloons 4 expressed as the quantity of glass balloons 4 as a percentage of the total volume of the filler was adjusted to 25 vol % (Working Example 12), 45 vol (Working Example 13), 50 vol % (Working Example 14), 75 vol % (Working Example 15), and 100 vol % (Working Example 16).
- the results of the abrasion tests are as listed in Table 6.
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 7, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Glass balloons 2 (GB2) and wollastonite (Wl) were used as the filler.
- the compound amount of the filler was adjusted so that the content of filler (GB2 and Wl) in the abrading portions (volume %) was the same in all Working Examples 17 through 20.
- the compound amount of the glass balloons 2 expressed as the quantity of glass balloons 2 as a percentage of the total volume of the filler was adjusted to 25 vol % (Working Example 17), 50 vol % (Working Example 18), 75 vol % (Working Example 19), and 100 vol % (Working Example 20).
- the results of the abrasion tests are as listed in Table 8.
- Abrasive pad samples were produced by the above method using the curable diamond slurry with the slurry composition shown in Table 7, and the abrasive pad samples obtained were subjected to abrasion tests by the method as described above.
- Wollastonite (Wl) was used as the filler.
- the compound amount of the filler was adjusted so that the content of filler in the abrading portions (volume %) was the same as for Working Examples 17 through 20.
- the results of the abrasion tests are as listed in Table 8.
- FIGS. 6A to 6D illustrate the results of observation using a scanning electron microscope (SEM) of the abrading portion top face of samples of abrasive pad produced in the working examples and comparative example, after the abrasion test.
- FIG. 6A illustrates the results for the abrasive pad sample of Working Example 4
- FIG. 6B illustrates the results for the abrasive pad sample of Working Example 5
- FIG. 6C illustrates the results for the abrasive pad sample of Working Example 6
- FIG. 6D illustrates the results for the abrasive pad sample of Comparative Example 1.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2014056538A JP6452295B2 (en) | 2014-03-19 | 2014-03-19 | Polishing pad and glass substrate polishing method |
PCT/US2015/020859 WO2015142774A1 (en) | 2014-03-19 | 2015-03-17 | Abrasive pad and glass substrate abrading method |
Publications (2)
Publication Number | Publication Date |
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EP3120379A1 true EP3120379A1 (en) | 2017-01-25 |
EP3120379A4 EP3120379A4 (en) | 2017-11-01 |
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EP15764427.9A Withdrawn EP3120379A4 (en) | 2014-03-19 | 2015-03-17 | Abrasive pad and glass substrate abrading method |
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US (1) | US20170066099A1 (en) |
EP (1) | EP3120379A4 (en) |
JP (1) | JP6452295B2 (en) |
KR (1) | KR20160135269A (en) |
CN (1) | CN106104766A (en) |
WO (1) | WO2015142774A1 (en) |
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PL2797716T3 (en) | 2011-12-30 | 2021-07-05 | Saint-Gobain Ceramics & Plastics, Inc. | Composite shaped abrasive particles and method of forming same |
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KR101736085B1 (en) | 2012-10-15 | 2017-05-16 | 생-고뱅 어브레이시브즈, 인코포레이티드 | Abrasive particles having particular shapes and methods of forming such particles |
CN105073343B (en) | 2013-03-29 | 2017-11-03 | 圣戈班磨料磨具有限公司 | Abrasive particle with given shape, the method for forming this particle and application thereof |
CN105764653B (en) | 2013-09-30 | 2020-09-11 | 圣戈本陶瓷及塑料股份有限公司 | Shaped abrasive particles and methods of forming the same |
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KR101884178B1 (en) | 2014-04-14 | 2018-08-02 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | Abrasive article including shaped abrasive particles |
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-
2014
- 2014-03-19 JP JP2014056538A patent/JP6452295B2/en not_active Expired - Fee Related
-
2015
- 2015-03-17 US US15/123,444 patent/US20170066099A1/en not_active Abandoned
- 2015-03-17 EP EP15764427.9A patent/EP3120379A4/en not_active Withdrawn
- 2015-03-17 WO PCT/US2015/020859 patent/WO2015142774A1/en active Application Filing
- 2015-03-17 CN CN201580014499.4A patent/CN106104766A/en active Pending
- 2015-03-17 KR KR1020167028467A patent/KR20160135269A/en not_active Withdrawn
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US20170066099A1 (en) | 2017-03-09 |
CN106104766A (en) | 2016-11-09 |
JP2015178155A (en) | 2015-10-08 |
KR20160135269A (en) | 2016-11-25 |
EP3120379A4 (en) | 2017-11-01 |
WO2015142774A1 (en) | 2015-09-24 |
JP6452295B2 (en) | 2019-01-16 |
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