EP2383114A4 - Metallfolie mit träger - Google Patents

Metallfolie mit träger

Info

Publication number: EP2383114A4
Authority: EP; European Patent Office
Prior art keywords: support; metal sheet; sheet; metal
Prior art date: 2008-12-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP09834551A

Other languages

English (en)

French (fr)

Other versions

EP2383114B1 (de

EP2383114A1 (de

Inventor

Masayuki Takamori

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

JX Nippon Mining and Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-12-24

Filing date

2009-03-10

Publication date

2013-01-16

2009-03-10 Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp

2011-11-02 Publication of EP2383114A1 publication Critical patent/EP2383114A1/de

2013-01-16 Publication of EP2383114A4 publication Critical patent/EP2383114A4/de

2015-07-08 Application granted granted Critical

2015-07-08 Publication of EP2383114B1 publication Critical patent/EP2383114B1/de

Status Active legal-status Critical Current

2029-03-10 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Laminated Bodies (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Pressure Welding/Diffusion-Bonding (AREA)

EP09834551.5A 2008-12-24 2009-03-10 Metallfolie mit träger Active EP2383114B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2008327457A JP2009143234A (ja)	2008-12-24	2008-12-24	キャリア付金属箔
PCT/JP2009/054482 WO2010073745A1 (ja)	2008-12-24	2009-03-10	キャリア付金属箔

Publications (3)

Publication Number	Publication Date
EP2383114A1 EP2383114A1 (de)	2011-11-02
EP2383114A4 true EP2383114A4 (de)	2013-01-16
EP2383114B1 EP2383114B1 (de)	2015-07-08

Family

ID=40914418

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP09834551.5A Active EP2383114B1 (de)	2008-12-24	2009-03-10	Metallfolie mit träger

Country Status (7)

Country	Link
US (1)	US9992874B2 (de)
EP (1)	EP2383114B1 (de)
JP (3)	JP2009143234A (de)
KR (2)	KR101377820B1 (de)
CN (1)	CN102264541B (de)
SG (1)	SG171728A1 (de)
WO (1)	WO2010073745A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2009143234A (ja) *	2008-12-24	2009-07-02	Nippon Mining & Metals Co Ltd	キャリア付金属箔
EP2589488A1 (de) *	2009-12-22	2013-05-08	JX Nippon Mining & Metals Corporation	Rechteckig laminierter Körper
JP4579347B1 (ja) *	2009-12-22	2010-11-10	Ｊｘ日鉱日石金属株式会社	積層体の製造方及び積層体
JP5697892B2 (ja) *	2010-05-11	2015-04-08	Jx日鉱日石金属株式会社	銅箔積層体及び積層板の製造方法
US11299619B2 (en)	2011-07-01	2022-04-12	The Boeing Company	Composite structure having an inorganic coating adhered thereto and method of making same
JP5190553B1 (ja)	2012-03-06	2013-04-24	フリージア・マクロス株式会社	キャリア付き金属箔
JP6125418B2 (ja) *	2013-12-18	2017-05-10	アズビル株式会社	粒子検出装置及び粒子の検出方法
WO2016143117A1 (ja) *	2015-03-12	2016-09-15	三井金属鉱業株式会社	キャリア付き金属箔及び配線基板の製造方法
JP6246857B2 (ja) *	2016-05-24	2017-12-13	Ｊｘ金属株式会社	ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5942314A (en) *	1997-04-17	1999-08-24	Mitsui Mining & Smelting Co., Ltd.	Ultrasonic welding of copper foil
JP2007186797A (ja) *	2007-02-15	2007-07-26	Furukawa Circuit Foil Kk	キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5222380B2 (de) *	1973-05-30	1977-06-17
US4591087A (en) *	1984-03-07	1986-05-27	Kulicke And Soffa Industries Inc.	Apparatus for making rolling spot bonds
US5153050A (en)	1991-08-27	1992-10-06	Johnston James A	Component of printed circuit boards
US5685970A (en)	1992-07-01	1997-11-11	Gould Electronics Inc.	Method and apparatus for sequentially metalized polymeric films and products made thereby
JP3192507B2 (ja) *	1992-12-18	2001-07-30	三菱電機株式会社	樹脂シール中空型半導体装置の製造方法
JPH06252554A (ja) *	1993-02-26	1994-09-09	Hitachi Chem Co Ltd	多層印刷配線板の製造方法
JPH08157621A (ja)	1994-12-08	1996-06-18	Japan Gore Tex Inc	プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム
JPH11277562A (ja)	1998-03-31	1999-10-12	Hitachi Chem Co Ltd	銅張積層板製造用キャリア板
DE69919822T2 (de) *	1998-12-10	2005-09-15	Ultex Corp.	Ultraschallschwingungsschweissverfahren
JP3370624B2 (ja) *	1999-08-24	2003-01-27	三井金属鉱業株式会社	キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板
JP2001068804A (ja) *	1999-08-31	2001-03-16	Mitsui Mining & Smelting Co Ltd	キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP3676152B2 (ja)	1999-11-11	2005-07-27	三井金属鉱業株式会社	キャリア箔付電解銅箔及びその製造方法
JP3258308B2 (ja)	2000-02-03	2002-02-18	株式会社日鉱マテリアルズ	レーザー穴開け性に優れた銅箔及びその製造方法
KR100811586B1 (ko)	2000-02-14	2008-03-10	가부시키가이샤 가네카	폴리이미드와 도체층을 포함하는 적층체, 이의 제조방법 및 이를 사용한 다층 배선판
US20020182432A1 (en)	2000-04-05	2002-12-05	Masaru Sakamoto	Laser hole drilling copper foil
JP3628585B2 (ja)	2000-04-05	2005-03-16	株式会社日鉱マテリアルズ	銅張り積層板及び銅張り積層板のレーザーによる穴開け方法
JP2002134877A (ja) *	2000-10-10	2002-05-10	Morton Internatl Inc	薄膜物質の取付および加工方法
JP2003051673A (ja)	2001-08-06	2003-02-21	Mitsui Mining & Smelting Co Ltd	プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4006618B2 (ja)	2001-09-26	2007-11-14	日鉱金属株式会社	キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
JP4298943B2 (ja)	2001-10-18	2009-07-22	日鉱金属株式会社	銅箔表面処理剤
JP4379854B2 (ja)	2001-10-30	2009-12-09	日鉱金属株式会社	表面処理銅箔
CN1301046C (zh)	2002-05-13	2007-02-14	三井金属鉱业株式会社	膜上芯片用软性印刷线路板
JP3731006B2 (ja)	2002-06-27	2006-01-05	古河サーキットフォイル株式会社	プリント配線板用銅箔複合品
JP3811680B2 (ja) *	2003-01-29	2006-08-23	富士通株式会社	配線基板の製造方法
US20040253473A1 (en) *	2003-06-13	2004-12-16	Michael Weekes	Metal foil composite structure for producing clad laminate
US20050158574A1 (en)	2003-11-11	2005-07-21	Furukawa Circuit Foil Co., Ltd.	Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4087369B2 (ja)	2003-11-11	2008-05-21	古河サーキットフォイル株式会社	キャリア付き極薄銅箔、およびプリント配線板
KR100852863B1 (ko)	2004-02-17	2008-08-18	닛코킨조쿠 가부시키가이샤	흑화 처리 면 또는 층을 가지는 동박
US20060068184A1 (en)	2004-09-29	2006-03-30	Ube Industries, Ltd.	Polyimide film and polyimide composite sheet
EP1895024A4 (de)	2005-06-23	2009-12-23	Nippon Mining Co	Kupferfolie für leiterplatte
GB0515584D0 (en)	2005-07-28	2005-09-07	Glaxo Group Ltd	Medicament dispenser
WO2007145164A1 (ja)	2006-06-12	2007-12-21	Nippon Mining & Metals Co., Ltd.	粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
KR20090080978A (ko)	2006-11-29	2009-07-27	닛코 킨조쿠 가부시키가이샤	2 층 구리 피복 적층판
CN101573477B (zh)	2006-12-28	2011-01-19	日矿金属株式会社	用于铜箔的表面处理的辊装置
US7976687B2 (en)	2006-12-28	2011-07-12	Jx Nippon Mining & Metals Corporation	Roll unit dipped in surface treatment liquid
KR20120034750A (ko)	2007-03-20	2012-04-12	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	무접착제 플렉시블 라미네이트 및 그 제조 방법
US8642893B2 (en)	2007-09-28	2014-02-04	Jx Nippon Mining & Metals Corporation	Copper foil for printed circuit and copper-clad laminate
KR101136774B1 (ko)	2007-10-18	2012-04-19	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	금속 피복 폴리이미드 복합체 및 그 복합체의 제조 방법 그리고 전자 회로 기판의 제조 방법
JP4477098B2 (ja)	2007-10-18	2010-06-09	日鉱金属株式会社	金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置
KR101199816B1 (ko)	2007-12-27	2012-11-12	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	2 층 동장 적층판의 제조 방법 및 2 층 동장 적층판
KR20100095658A (ko)	2008-02-04	2010-08-31	닛코 킨조쿠 가부시키가이샤	무접착제 플렉시블 라미네이트
US8375577B2 (en) *	2008-06-04	2013-02-19	National Semiconductor Corporation	Method of making foil based semiconductor package
WO2009154066A1 (ja)	2008-06-17	2009-12-23	日鉱金属株式会社	印刷回路基板用銅箔及び印刷回路基板用銅張積層板
JP2009143234A (ja) *	2008-12-24	2009-07-02	Nippon Mining & Metals Co Ltd	キャリア付金属箔

2008
- 2008-12-24 JP JP2008327457A patent/JP2009143234A/ja active Pending
2009
- 2009-03-10 WO PCT/JP2009/054482 patent/WO2010073745A1/ja active Application Filing
- 2009-03-10 JP JP2010543934A patent/JP5378415B2/ja active Active
- 2009-03-10 SG SG2011034899A patent/SG171728A1/en unknown
- 2009-03-10 CN CN200980152435.5A patent/CN102264541B/zh active Active
- 2009-03-10 KR KR1020117012611A patent/KR101377820B1/ko active Active
- 2009-03-10 US US13/132,766 patent/US9992874B2/en active Active
- 2009-03-10 EP EP09834551.5A patent/EP2383114B1/de active Active
- 2009-03-10 KR KR1020137030828A patent/KR20130133099A/ko not_active Withdrawn
2013
- 2013-07-01 JP JP2013138004A patent/JP5723927B2/ja active Active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5942314A (en) *	1997-04-17	1999-08-24	Mitsui Mining & Smelting Co., Ltd.	Ultrasonic welding of copper foil
JP2007186797A (ja) *	2007-02-15	2007-07-26	Furukawa Circuit Foil Kk	キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010073745A1 *

Also Published As

Publication number	Publication date
JP2009143234A (ja)	2009-07-02
JP5723927B2 (ja)	2015-05-27
JPWO2010073745A1 (ja)	2012-06-14
WO2010073745A1 (ja)	2010-07-01
CN102264541A (zh)	2011-11-30
KR20130133099A (ko)	2013-12-05
EP2383114B1 (de)	2015-07-08
JP2013252704A (ja)	2013-12-19
JP5378415B2 (ja)	2013-12-25
EP2383114A1 (de)	2011-11-02
US20110244255A1 (en)	2011-10-06
KR101377820B1 (ko)	2014-03-25
US9992874B2 (en)	2018-06-05
CN102264541B (zh)	2014-08-13
SG171728A1 (en)	2011-07-28
KR20110081340A (ko)	2011-07-13

Publication	Publication Date	Title
EP2383113A4 (de)	2013-01-16	Metallfolie mit träger
EP2441420A4 (de)	2013-05-22	Wasserabsorbierende platte
EP2130867A4 (de)	2011-11-30	Abdichtungfolie
DE602007004978D1 (de)	2010-04-08	Blech-polymer-laminat
EP2752505A4 (de)	2015-07-01	Kupferfolie mit einem träger
EP2398939A4 (de)	2014-09-03	Mikroarray mit mikrokanälen
EP2067616A4 (de)	2011-08-17	Dekorfolie
EP2383114A4 (de)	2013-01-16	Metallfolie mit träger
FR2896673B1 (fr)	2008-04-11	Boitier avec support intermediaire pivotant
EP2508581A4 (de)	2014-10-08	Klebefolie
EP2463234A4 (de)	2015-02-18	Platte aus gedehntem graphit
DK2429912T3 (da)	2014-10-06	Metalpladebeholder
FR2931515B1 (fr)	2014-07-18	Turbomachine avec diffuseur
EP2250859A4 (de)	2014-02-26	Suszeptor mit gewellter basis
BRPI0920901A2 (pt)	2015-12-29	folha de montagem de produtos.
FR2934133B1 (fr)	2012-11-30	Table avec allonge
ITMI20060107U1 (it)	2007-09-25	Complesso di fogli
FI8004U1 (fi)	2008-09-11	Lakana
FI8072U1 (fi)	2008-10-30	Kirjearkki
FIU20080079U0 (fi)	2008-02-27	Sovitelevy
UA17311S (uk)	2008-09-10	Листовий матеріал
UA18384S (uk)	2009-02-25	Рекламний аркуш
UA17115S (uk)	2008-08-11	Рекламний аркуш
UA17684S (uk)	2008-10-27	Рекламний аркуш
UA17523S (uk)	2008-10-10	Рекламний аркуш

Legal Events

Date	Code	Title	Description
2011-09-30	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2011-11-02	17P	Request for examination filed	Effective date: 20110524
2011-11-02	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
2012-04-04	DAX	Request for extension of the european patent (deleted)
2013-01-16	A4	Supplementary search report drawn up and despatched	Effective date: 20121217
2013-01-16	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/02 20060101AFI20121211BHEP Ipc: H05K 3/46 20060101ALN20121211BHEP
2014-01-15	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/02 20060101AFI20131209BHEP Ipc: H05K 3/46 20060101ALN20131209BHEP
2014-05-16	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2014-06-11	INTG	Intention to grant announced	Effective date: 20140516
2014-11-12	17Q	First examination report despatched	Effective date: 20141013
2014-12-11	REG	Reference to a national code	Ref country code: DE Ref legal event code: R079 Ref document number: 602009032162 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: B32B0015200000 Ipc: H05K0003020000
2015-01-13	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2015-01-14	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/46 20060101ALN20141211BHEP Ipc: H05K 3/02 20060101AFI20141211BHEP
2015-01-28	INTG	Intention to grant announced	Effective date: 20150113
2015-05-18	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2015-06-05	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2015-07-08	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
2015-07-08	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2015-07-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: REF Ref document number: 736246 Country of ref document: AT Kind code of ref document: T Effective date: 20150715 Ref country code: CH Ref legal event code: EP
2015-08-12	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D
2015-08-20	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602009032162 Country of ref document: DE
2015-11-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: MK05 Ref document number: 736246 Country of ref document: AT Kind code of ref document: T Effective date: 20150708
2015-12-16	REG	Reference to a national code	Ref country code: NL Ref legal event code: MP Effective date: 20150708
2015-12-28	REG	Reference to a national code	Ref country code: LT Ref legal event code: MG4D
2016-01-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20151009 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20151008 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2016-02-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20151108 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20151109
2016-04-11	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602009032162 Country of ref document: DE
2016-04-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2016-05-13	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2016-05-13	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2016-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2016-06-15	26N	No opposition filed	Effective date: 20160411
2016-08-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160331
2016-10-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160310 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2016-10-31	REG	Reference to a national code	Ref country code: CH Ref legal event code: PL
2016-11-23	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20160310
2016-12-28	REG	Reference to a national code	Ref country code: IE Ref legal event code: MM4A
2016-12-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2016-12-30	REG	Reference to a national code	Ref country code: FR Ref legal event code: ST Effective date: 20161130
2017-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160310 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160331 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160310 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160331 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160331
2017-06-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2017-08-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2018-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20090310
2018-06-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160331 Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2018-07-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150708
2024-04-30	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20240130 Year of fee payment: 16