KR101377820B1 - 캐리어 부착 금속박 - Google Patents
캐리어 부착 금속박 Download PDFInfo
- Publication number
- KR101377820B1 KR101377820B1 KR1020117012611A KR20117012611A KR101377820B1 KR 101377820 B1 KR101377820 B1 KR 101377820B1 KR 1020117012611 A KR1020117012611 A KR 1020117012611A KR 20117012611 A KR20117012611 A KR 20117012611A KR 101377820 B1 KR101377820 B1 KR 101377820B1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier
- foil
- metal foil
- copper
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011888 foil Substances 0.000 title claims abstract description 144
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 113
- 239000002184 metal Substances 0.000 title claims abstract description 113
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 126
- 239000011889 copper foil Substances 0.000 claims abstract description 103
- 238000000034 method Methods 0.000 claims description 35
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 19
- 238000005304 joining Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 22
- 229910052782 aluminium Inorganic materials 0.000 description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 17
- 238000007788 roughening Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 10
- 239000011162 core material Substances 0.000 description 9
- 238000003475 lamination Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
도 2 는 구리박, 프리프레그, 코어재, 구리박을 순서대로 중첩시켜, 캐리어 A 의 광택면 (S 면) 과 금속박 B 의 광택면 (S 면) 을 서로 부착시킴과 함께, 캐리어 A 의 가장자리부의 일부가 금속박 B 로부터 비어져 나오는 구조를 구비한 본 발명의 캐리어 부착 금속박의 개념 설명도이다.
도 3 은 본 발명의 캐리어 A 와 금속박 B 의 접합부를 나타내는 설명도이다.
도 4 는 캐리어 A 의 가장자리부의 일부가 금속박 B 로부터 비어져 나오는 구조를 구비하고, 또한 캐리어 A 의 광택면 (S 면) 과 금속박 B 의 광택면 (S 면) 을 서로 부착시킨 모습을 나타내는 설명도이다.
도 5 는 금속박, 프리프레그, 코어재, 금속박을 순서대로 중첩시키고, 또한 캐리어 A 및 금속박 B 의 광택면을 서로 접합시킨 캐리어 부착 구리박을 사용하여 핫프레스함으로써 최외층의 금속박층을 형성하는 모습을 나타내는 설명도이다.
Claims (8)
- 구리박 혹은 구리 합금박인 캐리어 A 와 금속박 B 가 교대로 중첩되는 적층체로서, 캐리어 A 및 금속박 B 가 각각 광택면 (S 면) 을 갖고, 각각 광택면이 서로 마주보도록 적층되어 있으며, 또한 캐리어 A 와 금속박 B 를 기계적으로 박리할 수 있게 초음파 접합되어 있는 캐리어 부착 금속박으로서, 상기 기계적으로 박리할 수 있게 초음파 접합되어 있는 접합부가 간격을 두고 복수 지점 존재하는 것을 특징으로 하는 캐리어 부착 금속박.
- 제 1 항에 있어서,
캐리어 A 및 금속박 B 가 직사각형인 것을 특징으로 하는 캐리어 부착 금속박. - 제 1 항 또는 제 2 항에 있어서,
금속박 B 가, 구리박 또는 구리 합금박인 것을 특징으로 하는 캐리어 부착 금속박. - 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008327457A JP2009143234A (ja) | 2008-12-24 | 2008-12-24 | キャリア付金属箔 |
JPJP-P-2008-327457 | 2008-12-24 | ||
PCT/JP2009/054482 WO2010073745A1 (ja) | 2008-12-24 | 2009-03-10 | キャリア付金属箔 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137030828A Division KR20130133099A (ko) | 2008-12-24 | 2009-03-10 | 캐리어 부착 금속박 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110081340A KR20110081340A (ko) | 2011-07-13 |
KR101377820B1 true KR101377820B1 (ko) | 2014-03-25 |
Family
ID=40914418
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137030828A Withdrawn KR20130133099A (ko) | 2008-12-24 | 2009-03-10 | 캐리어 부착 금속박 |
KR1020117012611A Active KR101377820B1 (ko) | 2008-12-24 | 2009-03-10 | 캐리어 부착 금속박 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137030828A Withdrawn KR20130133099A (ko) | 2008-12-24 | 2009-03-10 | 캐리어 부착 금속박 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9992874B2 (ko) |
EP (1) | EP2383114B1 (ko) |
JP (3) | JP2009143234A (ko) |
KR (2) | KR20130133099A (ko) |
CN (1) | CN102264541B (ko) |
SG (1) | SG171728A1 (ko) |
WO (1) | WO2010073745A1 (ko) |
Families Citing this family (9)
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JP2009143234A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
JP4579347B1 (ja) * | 2009-12-22 | 2010-11-10 | Jx日鉱日石金属株式会社 | 積層体の製造方及び積層体 |
SG173615A1 (en) * | 2009-12-22 | 2011-09-29 | Jx Nippon Mining & Metals Corp | Method for producing laminate, and laminate |
JP5697892B2 (ja) * | 2010-05-11 | 2015-04-08 | Jx日鉱日石金属株式会社 | 銅箔積層体及び積層板の製造方法 |
US11299619B2 (en) | 2011-07-01 | 2022-04-12 | The Boeing Company | Composite structure having an inorganic coating adhered thereto and method of making same |
JP5190553B1 (ja) | 2012-03-06 | 2013-04-24 | フリージア・マクロス株式会社 | キャリア付き金属箔 |
JP6125418B2 (ja) * | 2013-12-18 | 2017-05-10 | アズビル株式会社 | 粒子検出装置及び粒子の検出方法 |
WO2016143117A1 (ja) * | 2015-03-12 | 2016-09-15 | 三井金属鉱業株式会社 | キャリア付き金属箔及び配線基板の製造方法 |
JP6246857B2 (ja) * | 2016-05-24 | 2017-12-13 | Jx金属株式会社 | ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法 |
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-
2008
- 2008-12-24 JP JP2008327457A patent/JP2009143234A/ja active Pending
-
2009
- 2009-03-10 KR KR1020137030828A patent/KR20130133099A/ko not_active Withdrawn
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- 2009-03-10 KR KR1020117012611A patent/KR101377820B1/ko active Active
- 2009-03-10 CN CN200980152435.5A patent/CN102264541B/zh active Active
- 2009-03-10 SG SG2011034899A patent/SG171728A1/en unknown
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001068804A (ja) * | 1999-08-31 | 2001-03-16 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
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Publication number | Publication date |
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JP2009143234A (ja) | 2009-07-02 |
EP2383114A1 (en) | 2011-11-02 |
CN102264541A (zh) | 2011-11-30 |
EP2383114A4 (en) | 2013-01-16 |
CN102264541B (zh) | 2014-08-13 |
WO2010073745A1 (ja) | 2010-07-01 |
EP2383114B1 (en) | 2015-07-08 |
JP5378415B2 (ja) | 2013-12-25 |
KR20130133099A (ko) | 2013-12-05 |
SG171728A1 (en) | 2011-07-28 |
KR20110081340A (ko) | 2011-07-13 |
JPWO2010073745A1 (ja) | 2012-06-14 |
JP5723927B2 (ja) | 2015-05-27 |
US20110244255A1 (en) | 2011-10-06 |
US9992874B2 (en) | 2018-06-05 |
JP2013252704A (ja) | 2013-12-19 |
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