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EP1696227A3 - Verfahren und Vorrichtung zur Fehlerdetektion bei Wafern - Google Patents

Verfahren und Vorrichtung zur Fehlerdetektion bei Wafern Download PDF

Info

Publication number
EP1696227A3
EP1696227A3 EP06251044A EP06251044A EP1696227A3 EP 1696227 A3 EP1696227 A3 EP 1696227A3 EP 06251044 A EP06251044 A EP 06251044A EP 06251044 A EP06251044 A EP 06251044A EP 1696227 A3 EP1696227 A3 EP 1696227A3
Authority
EP
European Patent Office
Prior art keywords
sub
wafers
wafer
detecting defects
images
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06251044A
Other languages
English (en)
French (fr)
Other versions
EP1696227A2 (de
Inventor
Ran Zaslavsky
Yuval Dorfan
Mark Wagner
Noam Dotan
Tomer Yanir
Erez Sali
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Negevtech Ltd
Original Assignee
Negevtech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Negevtech Ltd filed Critical Negevtech Ltd
Publication of EP1696227A2 publication Critical patent/EP1696227A2/de
Publication of EP1696227A3 publication Critical patent/EP1696227A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
EP06251044A 2005-02-28 2006-02-28 Verfahren und Vorrichtung zur Fehlerdetektion bei Wafern Withdrawn EP1696227A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/069,712 US7813541B2 (en) 2005-02-28 2005-02-28 Method and apparatus for detecting defects in wafers

Publications (2)

Publication Number Publication Date
EP1696227A2 EP1696227A2 (de) 2006-08-30
EP1696227A3 true EP1696227A3 (de) 2010-01-06

Family

ID=36499272

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06251044A Withdrawn EP1696227A3 (de) 2005-02-28 2006-02-28 Verfahren und Vorrichtung zur Fehlerdetektion bei Wafern

Country Status (3)

Country Link
US (1) US7813541B2 (de)
EP (1) EP1696227A3 (de)
IL (1) IL173980A0 (de)

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US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
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US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
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KR101623747B1 (ko) 2008-07-28 2016-05-26 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
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US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
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US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US10192303B2 (en) * 2012-11-12 2019-01-29 Kla Tencor Corporation Method and system for mixed mode wafer inspection
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9008410B2 (en) * 2013-03-13 2015-04-14 Kla-Tencor Corporation Single die inspection on a dark field inspection tool
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
TWI500927B (zh) * 2013-10-14 2015-09-21 Nat Univ Tsing Hua 非接觸式中介層檢測方法與裝置
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US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
JP6779203B2 (ja) 2014-10-27 2020-11-04 ケーエルエー コーポレイション 画像化計測ターゲットの品質推定および改善
JP6637375B2 (ja) * 2016-04-28 2020-01-29 株式会社ニューフレアテクノロジー パターン検査方法及びパターン検査装置
US10504213B2 (en) 2016-11-22 2019-12-10 Kla-Tencor Corporation Wafer noise reduction by image subtraction across layers
KR102724160B1 (ko) * 2016-11-29 2024-11-01 삼성전자주식회사 웨이퍼를 검사하기 위한 검사 장치 및 이를 이용한 웨이퍼의 검사 방법
JP2020012665A (ja) * 2018-07-13 2020-01-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
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CN110736751B (zh) * 2019-11-06 2022-04-19 合肥御微半导体技术有限公司 一种表面缺陷检测方法及装置
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US20060193507A1 (en) 2006-08-31
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US7813541B2 (en) 2010-10-12

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