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TW200722740A - Image defect inspection apparatus, image defect inspection system, and image defect inspection method - Google Patents

Image defect inspection apparatus, image defect inspection system, and image defect inspection method

Info

Publication number
TW200722740A
TW200722740A TW095131901A TW95131901A TW200722740A TW 200722740 A TW200722740 A TW 200722740A TW 095131901 A TW095131901 A TW 095131901A TW 95131901 A TW95131901 A TW 95131901A TW 200722740 A TW200722740 A TW 200722740A
Authority
TW
Taiwan
Prior art keywords
defect inspection
image
image defect
inspection
prescribed
Prior art date
Application number
TW095131901A
Other languages
Chinese (zh)
Other versions
TWI336778B (en
Inventor
Masayuki Kuwabara
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200722740A publication Critical patent/TW200722740A/en
Application granted granted Critical
Publication of TWI336778B publication Critical patent/TWI336778B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

An image defect inspection apparatus in which an inspection image, which is obtained by capturing an image of an object under inspection, is divided into a plurality of inspection sub-images, each of the inspection sub-images is compared with a corresponding reference image that should normally be identical to the inspection sub-image, and detects any portions differing therebetween as a defects, is disclosed. The apparatus comprises: a reference value determining section which determines a reference value for each of a plurality of regions of a prescribed size defined within the object under inspection, based on pixel values of the region of the prescribed size according to a prescribed determining method; and a distribution information determining section which determines distribution information relating to the reference values which are determined for the regions of the prescribed size within a prescribed macro region, wherein the apparatus varies a defect detection condition thereof based on the distribution information.
TW095131901A 2005-11-25 2006-08-30 Image defect inspection apparatus, image defect inspection system, and image defect inspection method TWI336778B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005340248A JP2007149837A (en) 2005-11-25 2005-11-25 Device, system, and method for inspecting image defect

Publications (2)

Publication Number Publication Date
TW200722740A true TW200722740A (en) 2007-06-16
TWI336778B TWI336778B (en) 2011-02-01

Family

ID=38210904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131901A TWI336778B (en) 2005-11-25 2006-08-30 Image defect inspection apparatus, image defect inspection system, and image defect inspection method

Country Status (3)

Country Link
JP (1) JP2007149837A (en)
KR (2) KR20070055406A (en)
TW (1) TWI336778B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413021B (en) * 2009-04-10 2013-10-21 Hon Hai Prec Ind Co Ltd System and method for comparing images
US9462206B2 (en) 2012-02-01 2016-10-04 KLA-Tencor Coporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
TWI657725B (en) * 2014-03-07 2019-04-21 日商大亨股份有限公司 Image inspection device and method
CN114266773A (en) * 2022-03-02 2022-04-01 成都数联云算科技有限公司 Display panel defect positioning method, device, equipment and storage medium
TWI844736B (en) * 2019-09-27 2024-06-11 美商科磊股份有限公司 Equi-probability defect detection

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
WO2010091307A2 (en) * 2009-02-06 2010-08-12 Kla-Tencor Corporation Selecting one or more parameters for inspection of a wafer
JP2013250225A (en) * 2012-06-04 2013-12-12 Toray Eng Co Ltd Visual inspection device and visual inspection method
JP5717711B2 (en) * 2012-12-07 2015-05-13 東京エレクトロン株式会社 Substrate reference image creation method, substrate defect inspection method, substrate reference image creation apparatus, substrate defect inspection unit, program, and computer storage medium
KR101702752B1 (en) * 2015-05-29 2017-02-03 세메스 주식회사 Method of inspecting electronic components
JP6546826B2 (en) * 2015-10-08 2019-07-17 株式会社日立パワーソリューションズ Defect inspection method and apparatus therefor
JP2018128406A (en) * 2017-02-10 2018-08-16 東レエンジニアリング株式会社 Visual inspection device
KR102576277B1 (en) * 2018-05-02 2023-09-08 삼성디스플레이 주식회사 Apparatus and mehtod for detecting defects
TWI840374B (en) * 2019-06-17 2024-05-01 日月光半導體製造股份有限公司 System and method for inspecting defects of semiconductor device
KR102196396B1 (en) * 2019-10-21 2020-12-30 (주)에스비네트워크 A method for detecting surface defects of variable display panel glass
JP7087221B2 (en) 2019-10-30 2022-06-21 Ａｌｉｔｅｃｓ株式会社 Inspection equipment, methods, and programs
US20240027361A1 (en) * 2020-10-30 2024-01-25 Hitachi High-Tech Corporation Defect Inspection Device
TWI746320B (en) * 2020-12-18 2021-11-11 財團法人工業技術研究院 Method and system for generating and updating position distribution graph
TWI790591B (en) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 Wafer processing system and rework method thereof
CN113592853A (en) * 2021-08-16 2021-11-02 南京耘瞳科技有限公司 Method for detecting surface defects of protofilament fibers based on deep learning
CN114171375A (en) * 2021-11-16 2022-03-11 长江存储科技有限责任公司 Wafer photoetching method
CN119228795A (en) * 2024-11-29 2024-12-31 陕西华威科技股份有限公司 A method and system for nondestructive testing of the surface of spindle parts

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3566589B2 (en) * 1998-07-28 2004-09-15 株式会社日立製作所 Defect inspection apparatus and method
JP4233397B2 (en) * 2002-10-01 2009-03-04 株式会社東京精密 Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413021B (en) * 2009-04-10 2013-10-21 Hon Hai Prec Ind Co Ltd System and method for comparing images
US9462206B2 (en) 2012-02-01 2016-10-04 KLA-Tencor Coporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
TWI562094B (en) * 2012-02-01 2016-12-11 Kla Tencor Corp Modules and systems for high speed image prosessing
TWI657725B (en) * 2014-03-07 2019-04-21 日商大亨股份有限公司 Image inspection device and method
TWI844736B (en) * 2019-09-27 2024-06-11 美商科磊股份有限公司 Equi-probability defect detection
CN114266773A (en) * 2022-03-02 2022-04-01 成都数联云算科技有限公司 Display panel defect positioning method, device, equipment and storage medium

Also Published As

Publication number Publication date
TWI336778B (en) 2011-02-01
JP2007149837A (en) 2007-06-14
KR20070055406A (en) 2007-05-30
KR20080073281A (en) 2008-08-08

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees