EP0737759B1 - Corrosion preventing structure - Google Patents
Corrosion preventing structure Download PDFInfo
- Publication number
- EP0737759B1 EP0737759B1 EP19960302595 EP96302595A EP0737759B1 EP 0737759 B1 EP0737759 B1 EP 0737759B1 EP 19960302595 EP19960302595 EP 19960302595 EP 96302595 A EP96302595 A EP 96302595A EP 0737759 B1 EP0737759 B1 EP 0737759B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating film
- fine particles
- alloy
- type alloy
- corrosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005260 corrosion Methods 0.000 title claims description 51
- 230000007797 corrosion Effects 0.000 title claims description 51
- 238000007747 plating Methods 0.000 claims description 87
- 229910018104 Ni-P Inorganic materials 0.000 claims description 65
- 229910018536 Ni—P Inorganic materials 0.000 claims description 65
- 229910045601 alloy Inorganic materials 0.000 claims description 56
- 239000000956 alloy Substances 0.000 claims description 56
- 239000010419 fine particle Substances 0.000 claims description 39
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 37
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 37
- -1 polytetrafluoroethylene Polymers 0.000 claims description 30
- 229910000838 Al alloy Inorganic materials 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 description 29
- 229910052801 chlorine Inorganic materials 0.000 description 28
- 239000007789 gas Substances 0.000 description 23
- 238000011282 treatment Methods 0.000 description 22
- 239000000047 product Substances 0.000 description 18
- 238000007772 electroless plating Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000002585 base Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910015844 BCl3 Inorganic materials 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001566 austenite Inorganic materials 0.000 description 2
- 238000005536 corrosion prevention Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000003915 cell function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
Definitions
- This invention relates to a corrosion reducing structure and a method of protecting a surface from corrosion.
- the structure and method are particularly, but not exclusively, useful for protecting metallic parts of a vacuum pump used for gas discharging from a semiconductor producing apparatus, especially from a dry etching apparatus.
- austenite type stainless steels typified by SUS304 are used as the anticorrosive material of this kind.
- an oxide film is spontaneously formed on the surfaces thereof and it functions as a passive state coating so that the surfaces are endowed with a corrosion resisting property to a certain extent.
- the corrosion resisting property of aluminium alloys is considerably inferior to that of the passive state coating on stainless steels, the oxide films on the surfaces of aluminium alloy are broken when exposed to a corrosive gas as the exhaust gas to cause corrosion thereon. Therefore, it is necessary to apply a corrosion preventing treatment to the surface of aluminium alloys other than the spontaneously formed oxide film.
- surfaces of aluminium alloys have hitherto been subjected to electroless plating with a Ni-P type alloy or to anodic oxidation treatment (alumite process) as the anticorrosion treatment.
- the plating treatment with a Ni-P type alloy is carried out by applying the electroless plating method which is distinctive from the usual electroplating. On the whole surface of the parts made of an aluminium alloy a Ni-P type alloy such as Ni-P, Ni-W-P or the like is deposited to form a film of 10 to 25 micrometer thickness by this method. Also, the anodic oxidation treatment should be accompanied with the so called sealing treatment for plugging the micropores of oxide film formed by the usual treatment.
- Etching of aluminium alloys is practised by ionisation of a chlorine type gas to form chlorine ions which are crashed against the aluminium film on a silicon substrate.
- the reaction product (AlCl 3 ) is generated in a large amount as a vapour and the vapour deposits in the course of discharging on the sites where the temperature is low and the pressure is high, namely the inner surface of exhaust pump.
- Such a deposited product (AlCl 3 ) sublimates at 178°C under 1 atm and at about 40°C under 0.3 Torr.
- the deposited product (AlCl 3 ) of this kind reacts with atmospheric moisture in the event of pump suspension, leaking or the like to form HCl, namely chlorine ions. Also, chlorine ions may be formed by the reaction with moisture at the time of periodical maintenance or washing elimination.
- Chlorine ions readily break the passive state films on aluminium alloys and stainless steels inducing corrosion of pit form (pitting corrosion). Once pitting corrosion is induced, the sites act as local cells and corrosion advances acceleratively.
- chlorine ions readily intrude through the micropores (pinholes) existing in the plating films to reach the aluminium substrate where pitting corrosion is induced and, once pitting corrosion is induced in this manner, the local cell function is by far amplified standing on the relevance to the Ni alloy existing in the plating films thereby to intensively advance pitting corrosion so that the corrosion product forces up the plating films to induce exfoliation of the plating films.
- the electroless plating treatment is preferable as a treatment to form the coating films for corrosion prevention in respect of the capability of promoting growth of the film even in the inside of concave areas and holes with a thickness equal to that on the flat portions. Further, the Ni-P alloy per se is not attacked by chlorine ions.
- JP7080876 discloses a mould having a composite film layer 3, which is produced through the uniformly dispersed eutectoid of finely divided polytetrafluoroethylene (PTFE) particle in electroless plating plated through ground layer 2 on the surface 11 of the base of mould base material 1 such as aluminum alloy or the like.
- the base material 1 is buffed, cleansed with ethane and degreased and cleaned with weak alkali so as to form the ground layer 2 for zinc film on the surface 11 of the base.
- PTFE is dispersed in electroless nickel plating solution having hypophosphate as reducer.
- composite film layer 3 is preferably formed by directly immersing the base material 1, on which the ground layer 2 is formed, in the mixed liquid just mentioned above at normal temperature for 10-24 hours.
- a corrosion reducing structure applied to a surface to be protected comprising a first plating film composed of Ni-P type alloy for application to the surface, characterised in that a second plating film comprising fine particles in a Ni-P type alloy is provided on said first plating film.
- a method of protecting a surface against corrosion comprising applying a first plating film composed of Ni-P type alloy to the surface, and characterised by applying a second plating film comprising fine particles in a Ni-P type alloy over said first plating film.
- the surface may, for example, be an aluminium alloy or an iron type material.
- the present invention in one aspect, is featured by and has adopted a scheme that a primary plating film comprising a Ni-P type alloy has been formed on the surfaces of metallic parts and a secondary plating film of Ni-P type alloy containing dispersed and deposited fine particles has been formed on the primary plating film.
- a primary plating film comprising a Ni-P type alloy may be formed at least on the portion of aluminium alloy in the turbomolecular pump used for gas discharging from a semiconductor producing apparatus and a secondary plating film of a Ni-P type alloy prepared by dispersing and deposition of fine particles may be formed on this primary plating film.
- a primary plating film comprising a Ni-P type alloy may be formed on at least aluminium alloy part of a dry pump used for gas discharging from a semiconductor producing apparatus and a secondary plating film of a Ni-P type alloy prepared by dispersing and deposition of fine particles may be formed on this primary plating film.
- a primary plating film comprising a Ni-P type alloy may be formed at least on an inner surface of a piping used for gas feeding of a semiconductor producing apparatus or used for gas discharging from a semiconductor producing apparatus and a secondary plating film of a Ni-P type alloy prepared by dispersing and deposition of fine particles may be formed on this primary plating film.
- a primary plating film comprising a Ni-P type alloy may be formed at least on a moving part of a valve used for gas feeding of a semiconductor producing apparatus or used for gas discharging from a semiconductor producing apparatus and a secondary plating film of Ni-P type alloy prepared by dispersing and deposition of fine particles may be formed on this primary plating film.
- a primary plating film comprising a Ni-P type alloy may be formed at lest on a moving part and a sliding part in a chamber of a semiconductor producing apparatus and a secondary plating film of a Ni-P type alloy prepared by dispersing and deposition of fine particles may be formed on this primary plating film.
- the metallic part may be composed of a material of aluminium alloy type or of iron type.
- polytetrafluoroethylene may be used as the fine particles.
- the fine particles may be about 1 micrometer or less of the particle diameter.
- the primary and the secondary plating films may be respectively, 8 micrometers or more of the film thickness.
- Ni-P type alloy may be compounded with the fine particles in a ratio of 20 vol% or more by volume ratio or 6 wt% or more by weight ratio.
- the fine particles are of a size such that they fill the holes (micropores) which are present in the primary plating film.
- metallic parts may be firmly protected against intrusion of chlorine ions to the substrate thereof an occurrence of corrosion in a pit form can be prevented or reduced. It is thought that such a phenomenon is due to pinholes having an opening at the surface of the primary plating film being plugged by the fine particles, and that if the pinholes begin to from during growth of the secondary plating film, the pinholes are immediately plugged by the fine particles and growth of the pinholes is disrupted by the fine particles preventing pinholes from straightforwardly piercing toward the metallic parts.
- This corrosion preventing structure has, as shown in Fig. 1, a primary plating film 2 comprising a Ni-P type alloy on the surface of metallic part 1 and is further provided with a Ni-P/PTFE composite plating film as the secondary plating film 3 on the primary plating film 2.
- Ni-P/PTFE composite plating film is formed with not solely a Ni-P alloy but by dispersing and deposition of polytetrafluoroethylene in the form of fine particles (hereinafter termed as "PTFE fine particles") in this Ni-P type alloy.
- Such stratified two layers of plating films 2, 3 can be formed through the following procedures.
- the known treatment of electroless plating with a Ni-P alloy is applied to the surfaces of metallic parts 1 such as rotary wings, fixed wings and other well known as aluminium alloy parts of turbomolecular pumps thereby to form the first layer of a Ni-P alloy (the primary plating film 2).
- this metallic part 1 is dipped in a plating bath having a specified bath composition thereby for forming a Ni-P alloy plating film on the surface of metallic part 1.
- the concentration of P in the Ni-P alloy plating film should be about 8 wt% and the target value of thickness should be at lest 10 micrometer or more. In consideration of the tolerance and scattering, the film thickness may also be set at 8 micrometers or more.
- the tendency of the above mentioned pinhole plugging becomes more prominent as the thickness of deposited Ni-P alloy plating film is increased. That is, the number of pinholes having the opening at the plated surface is decreased by forming a thick plating film and the amount of chlorine ions intruded from the surface of plating to the substrate is reduced to allow improvement of the character of corrosion resistance. Accordingly, by taking also economy into consideration, it is preferable to provide the Ni-P alloy plating film formed as the primary plating film 2 with a thickness of about 20 micrometers.
- the Ni-P/PTFE composite plating film is further formed as the second layer (the secondary plating film 3) on this first layer.
- the Ni-P/PTFE composite plating film should have 10 micrometers of thickness as the target value.
- the film thickness may also be 8 micrometers or more similarly in this case from the same consideration of the tolerance and scattering as above.
- the Ni-P/PTFE composite plating film is formed by using a bath prepared by mixing fine powder of PTFE having about 1 micrometer or less of the particle diameter and a surface active agent in a bath almost the same as that for Ni-P alloy plating treatment and by depositing the plating from the bath in a state of being vigorously stirred. That is, the PTFE fine particles are simultaneously dispersed and deposited in the Ni-P alloy plating film.
- the formulation should be adjusted to regulate the PTFE content in the Ni-P alloy plating film to the level of 20 vol% or above but 40 vol% or lower by volume ratio or 6 wt% or above but 12 wt% or lower by weight ratio.
- the corrosion preventing structure of this example is constructed by forming the primary plating film 2 comprising a Ni-P type alloy on the metallic part 1 and further forming thereon the secondary plating film 3 prepared by dispersing and deposition of PTFE fine particles 4 in the Ni-P type alloy.
- the surface of secondary plating film 3 is covered by PTFE of the amount of 20 to 40 vol% by volume ratio after the growth thereof. Accordingly, the surface of secondary plating film exhibits good water repellency so that substances such as AlCl 3 , Cl gases, chlorine ions and the like come to be adsorbed by the surface of secondary plating film 3 only with difficulty and reaching and intrusion of chlorine ions to the substrate of metallic part can be prevented also in this respect.
- the effect of preventing intrusion of chlorine ions mentioned above cannot be sufficiently exhibited if the content of PTFE in the secondary plating film 3 is low.
- the protection against intrusion of chlorine ions is lowered in the event of the PTFE content of about 5 to 15 vol% by volume ratio (1.5 to 5 wt% by weight ratio), though protection against intrusion of chlorine ions does not become inefficacious.
- the PTFE content is required to be 20 vol% or more but 40 vol% or less by volume ratio, or 6 wt% or more but 12 wt% or less by weight ratio as mentioned above.
- the corrosion preventing structure of this invention is favourable as a measure for corrosion prevention of aluminium alloys by may further be applied to, for example, a corrosion preventing structure of metallic parts constituted with an iron type material.
- the corrosion preventing structure of this example can be applied to, for example, the following metallic parts. As a matter of course, it can be applied to other metallic parts.
- PTFE is used as the fine particles in this Example, there is no need of restriction thereto and any of fine particles can be applied as a replacement of PTFE provided that it can exhibit functions and effects similar to those of PTFE, that is, plugging of pinholes, inhibitio of growth thereof and the like.
- PTFE fluorinated graphite, ceramics and the like may be referred to, for examples.
- the corrosion preventing structure is set up by forming a primary plating film composed of a Ni-P type alloy on the surface of metallic parts and further forming a secondary plating film prepared by dispersing and deposition of fine particles in a Ni-P type alloy thereon. Therefore, from the viewpoints of under mentioned (A) and (B), it is possible securely to prevent intrusion and reaching of chlorine ions to the substrate of metallic parts so that pitting corrosion never occurs proving that is a favourable corrosion preventing structure for metallic parts which will extend the life of metallic parts.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7110311A JP2936129B2 (ja) | 1995-04-12 | 1995-04-12 | 防食構造 |
| JP110311/95 | 1995-04-12 | ||
| JP11031195 | 1995-04-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0737759A1 EP0737759A1 (en) | 1996-10-16 |
| EP0737759B1 true EP0737759B1 (en) | 2001-11-28 |
Family
ID=14532501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19960302595 Expired - Lifetime EP0737759B1 (en) | 1995-04-12 | 1996-04-12 | Corrosion preventing structure |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0737759B1 (ja) |
| JP (1) | JP2936129B2 (ja) |
| DE (1) | DE69617307T2 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7985418B2 (en) | 2004-11-01 | 2011-07-26 | Genzyme Corporation | Aliphatic amine polymer salts for tableting |
| US8986669B2 (en) | 2005-09-02 | 2015-03-24 | Genzyme Corporation | Method for removing phosphate and polymer used therefore |
| US9579343B2 (en) | 1999-10-19 | 2017-02-28 | Genzyme Corporation | Direct compression polymer tablet core |
| US9585911B2 (en) | 2005-09-15 | 2017-03-07 | Genzyme Corporation | Sachet formulation for amine polymers |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5667775A (en) | 1993-08-11 | 1997-09-16 | Geltex Pharmaceuticals, Inc. | Phosphate-binding polymers for oral administration |
| DE19860526A1 (de) | 1998-12-30 | 2000-07-06 | Basf Ag | Wärmeüberträger mit verringerter Neigung, Ablagerungen zu bilden und Verfahren zu deren Herstellung |
| US6444083B1 (en) * | 1999-06-30 | 2002-09-03 | Lam Research Corporation | Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
| DE10016215A1 (de) | 2000-03-31 | 2001-10-04 | Basf Ag | Verfahren zur Beschichtung von Apparaten und Apparateteilen für den chemischen Anlagenbau |
| DE10241947A1 (de) * | 2001-09-14 | 2003-04-03 | Magna Steyr Powertrain Ag & Co | Verfahren zur Oberflächenbehandlung eines Maschinenelementes und Maschinenelement |
| JP4294589B2 (ja) * | 2002-09-11 | 2009-07-15 | エスペック株式会社 | 無電解メッキ液、及びこれを用いた無電解メッキ方法及び無電解メッキ被処理物 |
| JP4234038B2 (ja) * | 2004-03-03 | 2009-03-04 | 株式会社椿本チエイン | 防食性チェーン |
| JP4709731B2 (ja) * | 2006-11-17 | 2011-06-22 | 三菱重工業株式会社 | 耐食性めっき層形成方法および回転機械 |
| DE102007002111A1 (de) | 2007-01-15 | 2008-07-17 | Futurecarbon Gmbh | Beschichtungsbad zum Beschichten eines Bauteils, beschichtetes Bauteil sowie Verfahren zu dessen Herstellung |
| JP5385512B2 (ja) * | 2007-06-08 | 2014-01-08 | 株式会社ニッキ | ガス燃料用レギュレータ |
| JP2009275535A (ja) * | 2008-05-13 | 2009-11-26 | Nikki Co Ltd | 気体燃料用インジェクタ |
| US20110027576A1 (en) * | 2009-07-28 | 2011-02-03 | General Electric Company | Sealing of pinholes in electroless metal coatings |
| JP2011075221A (ja) * | 2009-09-30 | 2011-04-14 | Daikin Industries Ltd | 冷凍装置および冷凍装置におけるシール材の注入方法 |
| JP6382493B2 (ja) * | 2013-08-12 | 2018-08-29 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| TWI569931B (zh) * | 2014-11-06 | 2017-02-11 | Sdi Corp | Stapler and its gutter structure |
| MA41202A (fr) | 2014-12-18 | 2017-10-24 | Genzyme Corp | Copolymères polydiallymine réticulé pour le traitement du diabète de type 2 |
| IT201900003463A1 (it) * | 2019-03-11 | 2020-09-11 | Nuovo Pignone Tecnologie Srl | Componente di turbomacchine avente un rivestimento metallico |
| CN112226749A (zh) * | 2020-10-14 | 2021-01-15 | 扬州市景杨表面工程有限公司 | 一种汽车差速器调整片ptfe复合镀层加工方法 |
-
1995
- 1995-04-12 JP JP7110311A patent/JP2936129B2/ja not_active Expired - Lifetime
-
1996
- 1996-04-12 DE DE1996617307 patent/DE69617307T2/de not_active Expired - Fee Related
- 1996-04-12 EP EP19960302595 patent/EP0737759B1/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9579343B2 (en) | 1999-10-19 | 2017-02-28 | Genzyme Corporation | Direct compression polymer tablet core |
| US7985418B2 (en) | 2004-11-01 | 2011-07-26 | Genzyme Corporation | Aliphatic amine polymer salts for tableting |
| US8808738B2 (en) | 2004-11-01 | 2014-08-19 | Genzyme Corporation | Aliphatic amine polymer salts for tableting |
| US9555056B2 (en) | 2004-11-01 | 2017-01-31 | Genzyme Corporation | Aliphatic amine polymer salts for tableting |
| US8986669B2 (en) | 2005-09-02 | 2015-03-24 | Genzyme Corporation | Method for removing phosphate and polymer used therefore |
| US9585911B2 (en) | 2005-09-15 | 2017-03-07 | Genzyme Corporation | Sachet formulation for amine polymers |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69617307D1 (de) | 2002-01-10 |
| DE69617307T2 (de) | 2002-05-08 |
| JP2936129B2 (ja) | 1999-08-23 |
| JPH08283955A (ja) | 1996-10-29 |
| EP0737759A1 (en) | 1996-10-16 |
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