EP0644558B2 - Câble insulative structure - Google Patents
Câble insulative structure Download PDFInfo
- Publication number
- EP0644558B2 EP0644558B2 EP94402087A EP94402087A EP0644558B2 EP 0644558 B2 EP0644558 B2 EP 0644558B2 EP 94402087 A EP94402087 A EP 94402087A EP 94402087 A EP94402087 A EP 94402087A EP 0644558 B2 EP0644558 B2 EP 0644558B2
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- European Patent Office
- Prior art keywords
- matrix
- une
- semiconductor
- layer
- structure according
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- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000011159 matrix material Substances 0.000 claims description 22
- -1 polyethylene Polymers 0.000 claims description 18
- 239000004698 Polyethylene Substances 0.000 claims description 12
- 229920000573 polyethylene Polymers 0.000 claims description 12
- 229920001577 copolymer Polymers 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000006230 acetylene black Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 14
- 238000012360 testing method Methods 0.000 description 10
- 239000005977 Ethylene Substances 0.000 description 8
- 238000009434 installation Methods 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 238000002955 isolation Methods 0.000 description 7
- 230000002787 reinforcement Effects 0.000 description 7
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 5
- 241001441571 Hiodontidae Species 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
- 239000004703 cross-linked polyethylene Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229920002397 thermoplastic olefin Polymers 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010690 paraffinic oil Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
Definitions
- the present invention relates to a structure insulation for medium, high and very high cables voltage carrying direct or alternating current.
- These cables are generally made up of a conductive core surrounded by an isolation structure which is coaxial to it.
- This structure includes minus a first semiconductor layer placed at the contact of the cable core, itself surrounded by a second electrically insulating layer, in turn covered by a third semiconductor layer.
- Other outer layers are used to protect the cable.
- the insulating layer is usually based high density or low density polyethylene, polyethylene crosslinked, or even terpolymer of ethylenepropylene-diene to the main methylene chain (EPDM).
- Semiconductor layers are generally composed of a polar matrix, most often a copolymer of ethylene and alkyl acrylate, which is charged with carbon black.
- the amount of charge varies depending on the nature of the carbon black used.
- the proportion of filler is generally between 28% and 40%.
- the dielectric strength of such a cable is very linked to the quality of the interface between the semiconductor layer and the insulating layer.
- the slightest roughness in level of this interface can cause strengthening of the electric field and lead to breakdown and the perforation of the insulating layer.
- the matrix of semiconductor layers high voltage cables currently marketed is generally based on a polymer high melt index or melt index of around 17 (A high "melt index” is the sign of the presence of low molar masses, it is measured according to standards ASTM reference D1238 or NFT 51-016), and having a very wide distribution in molar masses. But we found in the insulating layer, near semiconductor layers, the appearance of charges of space whose accumulation leads to deterioration dielectric strength of the insulation up to breakdown.
- Some semiconductor manufacturers use apolar matrices based on a copolymer of ethylene (EPR: thermoplastic ethylene-propylene elastomer, or EPDM: ethylene-propylene-diene terpolymer to main chain methylene), to which they add oils or plasticizers to facilitate obtaining a good surface condition of the layer semiconductor. These oils or plasticizers diffuse in the insulating layer and create at the interface between the semiconductor layer and the insulating layer, where the electric field is the highest, a region lower dielectric strength.
- EPR thermoplastic ethylene-propylene elastomer
- EPDM ethylene-propylene-diene terpolymer to main chain methylene
- the object of the present invention is to provide an insulation structure for medium, high cables, and very high voltage carrying direct current or AC, having dielectric characteristics more stable over time than those known up to present.
- the object of the present invention is a structure insulation for cable comprising at least one first contiguous and coaxial semiconductor layer at the core of the cable, surrounded by a second layer electrically insulating, itself covered by a third semiconductor layer.
- Semiconductor layers consist exclusively of a matrix containing only apolar polymers of molar mass greater than 1000, and a conductive charge.
- the components of the matrix have a molecular weight greater than 5000.
- the semiconductor layers contain low molecular weight compounds or additives, like oils or plasticizers, these compounds migrate into the insulating layer. This phenomenon has as a consequence the formation of space charges which will cause electric field strengthening and can later lead to breakdowns.
- This field reinforcement is linked to the amount of loads trained but also their mobility: a quantity of uniformly distributed charges giving no field reinforcement as important as the same amount of localized charges. This migration may occur during implementation or at during cable operation.
- a semiconductor layer of composition according to the invention comprising only high molecular weight compounds, prevents migration of species in the insulating layer and thereby the accumulation of space charges near the interfaces.
- the polymers are chosen from polyethylene, polypropylene, polystyrene, and their copolymers, alloys polymers chosen from polyethylene, polypropylene, polystyrene, and their copolymers, and mixtures of the compounds chosen from polyethylene, polypropylene, polystyrene, their copolymers, and the alloys previously mentioned.
- the polymers are chosen from thermoplastic elastomers polyolefins and their mixtures.
- the present invention has the advantage of stabilizing the dielectric characteristics of the structure isolation by suppressing compound migration of low molar mass. As a result, the quality of the interface between the different layers becomes a parameter less critical.
- the filler is a carbon black containing the less possible impurities.
- the pressure wave test is carried out at using the installation shown in Figure 1. This test assesses the strengthening of the electric field in an isolation structure.
- the installation shown in Figure 1 is consists of a 10 "YAg" laser whose beam is sent on a target 11 corresponding to sample 1 of which each semiconductor constitutes an electrode (+) and (-).
- This beam absorbed at the surface of the electrode 2 (-) decomposes this surface by pyrolysis, and the gases emitted cause a pressure wave to pass through the sample.
- This wave modulates the image charges on the electrodes and gives access to the charge density volume in the sample.
- a photodiode 12 makes it possible to synchronize a detector 13 with laser 10.
- the circuit is electrically powered by a high voltage power supply 14 provided resistance 15.
- the data recorded are transferred to be processed by a computer 16 and represented as a function of time on a graphic recorder 17.
- the laser 10 sends a wave to the target 11 causing space charges to appear and modification of the distribution of the electric field which then is measured by the detector 13.
- a sample similar to that described in example 4 is prepared but by adding to the matrix semiconductor layers, paraffinic oil at a rate of 5% by weight relative to the matrix.
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- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Installation Of Indoor Wiring (AREA)
- Insulating Bodies (AREA)
Description
La présente invention concerne une structure d'isolement pour câble moyenne, haute, et très haute tension transportant du courant continu ou alternatif.The present invention relates to a structure insulation for medium, high and very high cables voltage carrying direct or alternating current.
Ces câbles sont généralement constitués d'une âme conductrice entourée d'une structure d'isolement qui lui est coaxiale. Cette structure comporte au moins une première couche semi-conductrice placée au contact de l'âme du câble, elle-même entourée d'une deuxième couche électriquement isolante, à son tour recouverte par une troisième couche semi-conductrice. D'autres couches extérieures servent à la protection du câble.These cables are generally made up of a conductive core surrounded by an isolation structure which is coaxial to it. This structure includes minus a first semiconductor layer placed at the contact of the cable core, itself surrounded by a second electrically insulating layer, in turn covered by a third semiconductor layer. Other outer layers are used to protect the cable.
La couche isolante est habituellement à base de polyéthylène haute densité ou basse densité, de polyéthylène réticulé, ou bien encore de terpolymère d'éthylènepropylène-diène à chaíne principale méthylène (EPDM).The insulating layer is usually based high density or low density polyethylene, polyethylene crosslinked, or even terpolymer of ethylenepropylene-diene to the main methylene chain (EPDM).
Les couches semi-conductrices sont en général composées d'une matrice polaire, le plus souvent un copolymère d'éthylène et d'acrylate d'alkyl, qui est chargée par du noir de carbone. La quantité de charge varie suivant la nature du noir de carbone utilisé. Pour un noir d'acétylène ou un noir au four, la proportion de charge est généralement comprise entre 28% et 40%.Semiconductor layers are generally composed of a polar matrix, most often a copolymer of ethylene and alkyl acrylate, which is charged with carbon black. The amount of charge varies depending on the nature of the carbon black used. For a black acetylene or a black oven, the proportion of filler is generally between 28% and 40%.
La rigidité diélectrique d'un tel câble est très liée à la qualité de l'interface entre la couche semi-conductrice et la couche isolante. La moindre aspérité au niveau de cette interface peut provoquer un renforcement du champ électrique et conduire au claquage et à la perforation de la couche isolante.The dielectric strength of such a cable is very linked to the quality of the interface between the semiconductor layer and the insulating layer. The slightest roughness in level of this interface can cause strengthening of the electric field and lead to breakdown and the perforation of the insulating layer.
Pour obtenir lors de l'extrusion une interface aussi lisse que possible, la matrice des couches semi-conductrices des câbles haute tension actuellement commercialisés est généralement à base d'un polymère d'indice de fluidité ou "melt index" élevé de l'ordre de 17 (Un "melt index" élevé est le signe de la présence de faibles masses molaires, il est mesuré suivant les normes ASTM référence D1238 ou NFT 51-016), et possédant une distribution très large en masses molaires. Mais on a constaté dans la couche isolante, à proximité des couches semi-conductrices, l'apparition de charges d'espace dont l'accumulation entraine une détérioration de la tenue diélectrique de l'isolant pouvant aller jusqu'au claquage.To obtain an interface during extrusion as smooth as possible, the matrix of semiconductor layers high voltage cables currently marketed is generally based on a polymer high melt index or melt index of around 17 (A high "melt index" is the sign of the presence of low molar masses, it is measured according to standards ASTM reference D1238 or NFT 51-016), and having a very wide distribution in molar masses. But we found in the insulating layer, near semiconductor layers, the appearance of charges of space whose accumulation leads to deterioration dielectric strength of the insulation up to breakdown.
Certains fabricants de semi-conducteurs utilisent des matrices apolaires à base d'un copolymère de l'éthylène (EPR: élastomère thermoplastique d'éthylène-propylène, ou EPDM: terpolymère d'éthylène-propylène-diène à chaíne principale méthylène), auxquelles ils ajoutent des huiles ou des plastifiants pour faciliter l'obtention d'un bon état de surface de la couche semi-conductrice. Or ces huiles ou plastifiants diffusent dans la couche isolante et créent au niveau de l'interface entre la couche semi-conductrice et la couche isolante, où le champ électrique est le plus élevé, une région de plus faible rigidité diélectrique.Some semiconductor manufacturers use apolar matrices based on a copolymer of ethylene (EPR: thermoplastic ethylene-propylene elastomer, or EPDM: ethylene-propylene-diene terpolymer to main chain methylene), to which they add oils or plasticizers to facilitate obtaining a good surface condition of the layer semiconductor. These oils or plasticizers diffuse in the insulating layer and create at the interface between the semiconductor layer and the insulating layer, where the electric field is the highest, a region lower dielectric strength.
La présente invention a pour but de procurer une structure d'isolement pour câble moyenne, haute, et très haute tension transportant du courant continu ou alternatif, présentant des caractéristiques diélectriques plus stables au cours du temps que celles connues jusqu'à présent.The object of the present invention is to provide an insulation structure for medium, high cables, and very high voltage carrying direct current or AC, having dielectric characteristics more stable over time than those known up to present.
L'objet de la présente invention est une structure d'isolement pour câble comportant au moins une première couche semi-conductrice contigüe et coaxiale à l'âme du câble, entourée d'une deuxième couche électriquement isolante, elle-même recouverte par une troisième couche semi-conductrice. Les couches semi-conductrices sont composées exclusivement d'une matrice ne comportant que des polymères apolaires de masse molaire supérieure à 1000, et d'une charge conductrice.The object of the present invention is a structure insulation for cable comprising at least one first contiguous and coaxial semiconductor layer at the core of the cable, surrounded by a second layer electrically insulating, itself covered by a third semiconductor layer. Semiconductor layers consist exclusively of a matrix containing only apolar polymers of molar mass greater than 1000, and a conductive charge.
De préférence, les composants de la matrice ont une masse moléculaire supérieure à 5000.Preferably, the components of the matrix have a molecular weight greater than 5000.
Si les couches semi-conductrices contiennent des composés de faibles masses molaires ou des additifs, comme des huiles ou des plastifiants, ces composés migrent dans la couche isolante. Ce phénomène a pour conséquence la formation de charges d'espaces qui vont provoquer des renforcement de champ électrique et peuvent conduire ultérieurement à des claquages. Ce renforcement de champ est lié à la quantité de charges formées mais également à leur mobilité: une quantité de charges uniformément réparties ne donnant pas de renforcement de champ aussi important que la même quantité de charges localisées. Cette migration peut se produire au cours de la mise en oeuvre ou au cours du fonctionnement du câble.If the semiconductor layers contain low molecular weight compounds or additives, like oils or plasticizers, these compounds migrate into the insulating layer. This phenomenon has as a consequence the formation of space charges which will cause electric field strengthening and can later lead to breakdowns. This field reinforcement is linked to the amount of loads trained but also their mobility: a quantity of uniformly distributed charges giving no field reinforcement as important as the same amount of localized charges. This migration may occur during implementation or at during cable operation.
L'emploi d'une couche semi-conductrice de composition selon l'invention ne comportant que des composés de masse molaire élevée, empêche la migration d'espèces dans la couche isolante et par là même l'accumulation de charges d'espace à proximité des interfaces.The use of a semiconductor layer of composition according to the invention comprising only high molecular weight compounds, prevents migration of species in the insulating layer and thereby the accumulation of space charges near the interfaces.
Selon une première variante de réalisation, les polymères sont choisis parmi le polyéthylène, le polypropylène, le polystyrène, et leurs copolymères, les alliages de polymères choisis parmi le polyéthylène, le polypropylène, le polystyrène, et leurs copolymères, et les mélanges des composés choisis parmi le polyéthylène, le polypropylène, le polystyrène, leurs copolymères, et les alliages précédemment cités.According to a first alternative embodiment, the polymers are chosen from polyethylene, polypropylene, polystyrene, and their copolymers, alloys polymers chosen from polyethylene, polypropylene, polystyrene, and their copolymers, and mixtures of the compounds chosen from polyethylene, polypropylene, polystyrene, their copolymers, and the alloys previously mentioned.
Selon une deuxième variante de réalisation, les polymères sont choisis parmi les élastomères thermoplastiques polyoléfiniques et leurs mélanges.According to a second variant embodiment, the polymers are chosen from thermoplastic elastomers polyolefins and their mixtures.
Du choix des polymères constituants la matrice dépendra la qualité de son interface avec la couche isolante et les propriétés mécaniques de la couche semi-conductrice obtenue, sans nécessiter le recours à des additifs.From the choice of polymers constituting the matrix will depend on the quality of its interface with the layer insulating and mechanical properties of the layer semiconductor obtained, without requiring the use of additives.
La présente invention a pour avantage de stabiliser les caractéristiques diélectriques de la structure d'isolement en supprimant la migration des composés de faible masse molaire. En conséquence, la qualité de l'interface entre les différentes couches devient un paramètre moins critique.The present invention has the advantage of stabilizing the dielectric characteristics of the structure isolation by suppressing compound migration of low molar mass. As a result, the quality of the interface between the different layers becomes a parameter less critical.
La charge est un noir de carbone contenant le moins possible d'impuretés. On peut utiliser un noir au four ou un noir "KETJEN", mais on choisira de préférence, un noir d'acétylène qui est beaucoup plus pur.The filler is a carbon black containing the less possible impurities. We can use a black oven or a black "KETJEN", but we will preferably choose, an acetylene black which is much purer.
D'autres caractéristiques et avantages de la présente invention apparaitront à la lecture des exemples suivants, donnés bien entendu à titre illustratif et non limitatif, et en référence au dessin annexé dans lequel:
- la figure 1 montre le schéma général de l'installation d'essai de l'onde de pression,
- la figure 2 représente une vue de dessus de l'échantillon de la structure d'isolement pour l'essai de l'onde de pression,
- la figure 3 une coupe schématique de l'échantillon de la figure 2.
- Figure 1 shows the general diagram of the pressure wave test facility,
- FIG. 2 represents a top view of the sample of the insulation structure for testing the pressure wave,
- Figure 3 a schematic section of the sample of Figure 2.
L'essai de l'onde de pression est effectué à l'aide de l'installation représentée sur la figure 1. Ce test permet d'évaluer le renforcement du champ électrique dans une structure d'isolement.The pressure wave test is carried out at using the installation shown in Figure 1. This test assesses the strengthening of the electric field in an isolation structure.
Un échantillon 1 de la structure d'isolement pour l'essai de l'onde de pression est représenté vue de dessus sur la figure 2 et en coupe sur la figure 3. Sur une surface circulaire de diamètre A 20mm, on trouve superposées:
- une
première couche 2 semi-conductrice d'épaisseur B 0,5mm, - une
deuxième couche 3 électriquement isolante d'épaisseur C 0,8mm, - une troisième couche 4 semi-conductrice identique
à la
couche 2.
- a
first semiconductor layer 2 of thickness B 0.5 mm, - a second electrically insulating
layer 3 of thickness C 0.8 mm, - a third semiconductor layer 4 identical to
layer 2.
L'installation représentée sur la figure 1, se
compose d'un laser 10 "YAg" dont le faisceau est envoyé
sur une cible 11 correspondant à l'échantillon 1
dont chaque semiconducteur constitue une électrode
(+) et (-). Ce faisceau absorbé en surface de l'électrode
2 (-) décompose cette surface par pyrolyse, et les gaz
émis provoquent une onde de pression qui traverse
l'échantillon. Cette onde module les charges-images
sur les électrodes et donne accès à la densité de charge
volumique dans l'échantillon.The installation shown in Figure 1, is
consists of a 10 "YAg" laser whose beam is sent
on a
Une photodiode 12 permet de synchroniser un
détecteur 13 au laser 10. Le circuit est alimenté électriquement
par une alimentation haute tension 14 munie
d'une résistance 15. Les données enregistrées sont
transférées pour être traitées par un ordinateur 16 et représentées
en fonction du temps sur un enregisteur graphique
17. Le laser 10 envoie une onde sur la cible 11
provoquant l'apparition de charges d'espace et la modification
de la répartition du champ électrique qui alors
est mesurée par le détecteur 13.A
On réalise un échantillon de la structure d'isolement selon l'art antérieur, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice polaire à base d'un copolymère d'éthylène et d'acrylate d'alkyl dont le "melt index" a pour valeur 8 et dont la teneur en ester est de 20%, à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice,
- une deuxième couche électriquement isolante composée d'un élastomère thermoplastique oléfinique,
- une troisième couche semi-conductnce identique à la première couche.
- a first semiconductor layer composed of a polar matrix based on a copolymer of ethylene and alkyl acrylate whose "melt index" has the value 8 and whose ester content is 20%, at which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix,
- a second electrically insulating layer composed of an olefinic thermoplastic elastomer,
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde
de pression à l'aide de l'installation représentée sur
la figure 1. On constate l'apparition dans des proportions
importantes de chargés négatives à la cathode 2.
Le renforcement du champ est alors supérieur à 20% et
les charges restent piégées dans le matériau plusieurs
heures après la coupure de la tension.This sample is then subjected to the wave test
pressure using the installation shown on
Figure 1. We see the appearance in proportions
significant negative charges at
On réalise un échantillon de la structure d'isolement selon l'art antérieur, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée d'une matrice polaire à base d'un copolymère d'éthylène et d'acrylate d'alkyl dont le "melt index" a pour valeur 8 et dont la teneur en ester est de 20%, à laquelle est ajoutée une charge de noir d'acétylène dans une proportion de 66 parts en poids par rapport à 100 parts de la matrice,
- une deuxième couche électriquement isolante composée d'un polyéthylène réticulé chimiquement (PRC),
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of a polar matrix based on a copolymer of ethylene and alkyl acrylate whose "melt index" has the value 8 and whose ester content is 20%, at which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix,
- a second electrically insulating layer composed of a chemically crosslinked polyethylene (PRC),
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde
de pression à l'aide de l'installation représentée sur
la figure 1. On constate l'apparition dans des propor-tions
importantes de charges négatives à proximité de
la cathode 2 et qui restent piégées dans la matrice de
la couche isolante après coupure de la tension. Le renforcement
du champ est supérieur à 20%. This sample is then subjected to the wave test
pressure using the installation shown on
Figure 1. We see the appearance in proportions
significant negative charges near
On réalise un échantillon de la structure d'isolement selon l'invention, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée
d'une matrice apolaire à laquelle est ajoutée une
charge de noir d'acétylène dans une proportion de
66 parts en poids par rapport à 100 parts de la matrice;
la matrice contient d'une part 20% de polyéthylène
(PE) dont le "melt index" a pour
valeur 2 et dont la masse molaire est comprise entre 103 et 107 et centrée sur 1.1.106, et d'autre part 80% d'un copolymère d'éthylène et de propylène contenant environ 50% en poids d'éthylène dont la viscosité "MOONEY" (mesurée selon la norme NFT 43005) est de l'ordre de 40 et dont la masse molaire est comprise entre 103 et 107 et centrée sur 1,2.105, - une deuxième couche électriquement isolante composée d'un polyéthylène réticulé chimiquement (PRC),
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of an apolar matrix to which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix; the matrix contains on the one hand 20% of polyethylene (PE) whose "melt index" has the
value 2 and whose molar mass is between 10 3 and 10 7 and centered on 1.1.10 6 , and on the other hand 80% of a copolymer of ethylene and propylene containing approximately 50% by weight of ethylene whose viscosity "MOONEY" (measured according to standard NFT 43005) is of the order of 40 and whose molar mass is between 10 3 and 10 7 and centered on 1.2.10 5 , - a second electrically insulating layer composed of a chemically crosslinked polyethylene (PRC),
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ électrique est inférieur à 10%, et après coupure de la tension il ne subsiste pas de charges piégées dans le matériau isolant.This sample is then subjected to the wave test pressure using the installation shown on Figure 1. The reinforcement of the electric field is less at 10%, and after switching off the voltage it does not remain no charges trapped in the insulating material.
On réalise un échantillon de la structure d'isolement selon l'invention, analogue à l'échantillon représenté sur la figure 2, comportant:
- une première couche semi-conductrice composée
d'une matrice apolaire à laquelle est ajoutée une
charge de noir d'acétylène dans une proportion de
66 parts en poids par rapport à 100 parts de la matrice;
la matrice contient d'une part 20% de polyéthylène
(PE) dont le "melt index" a pour
valeur 2 et dont la masse molaire est centrée sur 1,1.106, et d'autre part 80% d'un copolymère d'éthylène et de propylène contenant environ 50% en poids d'éthylène dont la viscosité "MOONEY" (selon la norme NFT 43005) est de l'ordre de 40 et dont la masse molaire est comprise entre 103 et 107 et centrée sur 1,2.105, - une deuxième couche électriquement isolante composée d'un élastomère thermoplastique oléfinique,
- une troisième couche semi-conductrice identique à la première couche.
- a first semiconductor layer composed of an apolar matrix to which is added a charge of acetylene black in a proportion of 66 parts by weight relative to 100 parts of the matrix; the matrix contains on the one hand 20% of polyethylene (PE) whose "melt index" has the
value 2 and whose molar mass is centered on 1.1 × 10 6 , and on the other hand 80% of a copolymer of ethylene and propylene containing about 50% by weight of ethylene whose viscosity "MOONEY" (according to standard NFT 43005) is of the order of 40 and whose molar mass is between 10 3 and 10 7 and centered on 1 , 2.10 5 , - a second electrically insulating layer composed of an olefinic thermoplastic elastomer,
- a third semiconductor layer identical to the first layer.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ électrique est inférieur à 10%, et après coupure de la tension il ne subsiste pas de charges piégées dans le matériau isolant.This sample is then subjected to the wave test pressure using the installation shown on Figure 1. The reinforcement of the electric field is less at 10%, and after switching off the voltage it does not remain no charges trapped in the insulating material.
Un échantillon analogue à celui décrit dans l'exemple 4 est préparé mais en ajoutant à la matrice des couches semi-conductrices, une huile paraffinique à raison de 5% en poids par rapport à la matrice.A sample similar to that described in example 4 is prepared but by adding to the matrix semiconductor layers, paraffinic oil at a rate of 5% by weight relative to the matrix.
Cet échantillon est alors soumis à l'essai d'onde de pression à l'aide de l'installation représentée sur la figure 1. Le renforcement du champ dans ce cas est de 140%.This sample is then subjected to the wave test pressure using the installation shown on Figure 1. The reinforcement of the field in this case is 140%.
Claims (5)
- Cable insulation structure including at least a semiconductor first layer contiguous and coaxial with the cable core surrounded by an electrically insulating second layer covered with a semiconductor third layer, characterised in that said semiconductor layers comprise exclusively a matrix including only apolar polymers whose components have a molecular weight greater than 1 000 and a conductive charge.
- Structure according to claim 1 wherein the components of said matrix have a molecular weight greater than 5 000.
- Structure according to claim 1 or claim 2 wherein said matrix is selected from polyethylene, polypropylene, polystyrene and their copolymers, alloys of polymers chosen from polyethylene, polypropylene, polystyrene and their copolymers, and mixtures of the aforementioned substances.
- Structure according to claim 1 or claim 2 wherein said matrix is chosen from polyolefin thermoplastic elastomers and mixtures thereof.
- Structure according to any one of the preceding claims wherein said charge is acetylene black.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311234 | 1993-09-21 | ||
FR9311234A FR2710447B1 (en) | 1993-09-21 | 1993-09-21 | Isolation structure for cable. |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0644558A1 EP0644558A1 (en) | 1995-03-22 |
EP0644558B1 EP0644558B1 (en) | 1999-06-02 |
EP0644558B2 true EP0644558B2 (en) | 2003-05-28 |
Family
ID=9451076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94402087A Expired - Lifetime EP0644558B2 (en) | 1993-09-21 | 1994-09-20 | Câble insulative structure |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0644558B2 (en) |
JP (1) | JP3658018B2 (en) |
KR (1) | KR100323179B1 (en) |
CN (1) | CN1122285C (en) |
DE (1) | DE69418804T3 (en) |
DK (1) | DK0644558T4 (en) |
FR (1) | FR2710447B1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004178867A (en) * | 2002-11-25 | 2004-06-24 | Mitsubishi Cable Ind Ltd | Power cable |
EP1634913B1 (en) | 2004-09-10 | 2008-10-29 | Borealis Technology Oy | Semiconductive polymer composition |
JP4866545B2 (en) * | 2004-12-03 | 2012-02-01 | 株式会社フジクラ | Cable and twisted cable |
CH698074B1 (en) * | 2005-11-11 | 2009-05-15 | Studer Ag Draht & Kabelwerk | Multi-conductor cable for transmitting rectangular extending alternating currents. |
EP2711934B1 (en) * | 2012-09-25 | 2018-07-11 | Nexans | Silicone multilayer insulation for electric cable |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115798A (en) † | 1978-03-01 | 1979-09-08 | Fujikura Ltd | Semiconductive composition for power cable |
JPS5562610A (en) † | 1978-10-31 | 1980-05-12 | Dainichi Nippon Cables Ltd | Power cable |
JPS57199108A (en) † | 1981-06-01 | 1982-12-07 | Showa Electric Wire & Cable Co | Crosslinked polyethylene insulated power cable |
WO1993004486A1 (en) † | 1991-08-15 | 1993-03-04 | Exxon Chemical Patents Inc. | Electrical devices having polymeric insulating or semiconducting members |
EP0389611B1 (en) † | 1988-09-30 | 1997-06-04 | Exxon Chemical Patents Inc. | Linear ethylene interpolymer blends of interpolymers having narrow molecular weight and composition distributions |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57126004A (en) * | 1981-01-30 | 1982-08-05 | Nippon Unicar Co Ltd | Semiconductive polyolefin composition and cable using same |
JP3081218B2 (en) * | 1990-06-22 | 2000-08-28 | 財団法人電力中央研究所 | Method for improving semiconductive layer interface of polyolefin insulated cable |
JP4056009B2 (en) * | 2000-01-31 | 2008-03-05 | 東芝テック株式会社 | Inline type pump |
-
1993
- 1993-09-21 FR FR9311234A patent/FR2710447B1/en not_active Expired - Lifetime
-
1994
- 1994-09-17 KR KR1019940023808A patent/KR100323179B1/en not_active IP Right Cessation
- 1994-09-20 EP EP94402087A patent/EP0644558B2/en not_active Expired - Lifetime
- 1994-09-20 DK DK94402087T patent/DK0644558T4/en active
- 1994-09-20 JP JP22505494A patent/JP3658018B2/en not_active Expired - Fee Related
- 1994-09-20 DE DE69418804T patent/DE69418804T3/en not_active Expired - Lifetime
- 1994-09-21 CN CN94113695A patent/CN1122285C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115798A (en) † | 1978-03-01 | 1979-09-08 | Fujikura Ltd | Semiconductive composition for power cable |
JPS5562610A (en) † | 1978-10-31 | 1980-05-12 | Dainichi Nippon Cables Ltd | Power cable |
JPS57199108A (en) † | 1981-06-01 | 1982-12-07 | Showa Electric Wire & Cable Co | Crosslinked polyethylene insulated power cable |
EP0389611B1 (en) † | 1988-09-30 | 1997-06-04 | Exxon Chemical Patents Inc. | Linear ethylene interpolymer blends of interpolymers having narrow molecular weight and composition distributions |
WO1993004486A1 (en) † | 1991-08-15 | 1993-03-04 | Exxon Chemical Patents Inc. | Electrical devices having polymeric insulating or semiconducting members |
Also Published As
Publication number | Publication date |
---|---|
KR100323179B1 (en) | 2002-06-27 |
KR950009752A (en) | 1995-04-24 |
CN1108789A (en) | 1995-09-20 |
DE69418804T2 (en) | 1999-12-09 |
EP0644558B1 (en) | 1999-06-02 |
DK0644558T4 (en) | 2003-09-22 |
CN1122285C (en) | 2003-09-24 |
DE69418804T3 (en) | 2004-04-01 |
FR2710447A1 (en) | 1995-03-31 |
FR2710447B1 (en) | 1995-11-10 |
JPH07169324A (en) | 1995-07-04 |
DK0644558T3 (en) | 1999-12-13 |
JP3658018B2 (en) | 2005-06-08 |
DE69418804D1 (en) | 1999-07-08 |
EP0644558A1 (en) | 1995-03-22 |
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