CN1122285C - Cable insulation structure - Google Patents
Cable insulation structure Download PDFInfo
- Publication number
- CN1122285C CN1122285C CN94113695A CN94113695A CN1122285C CN 1122285 C CN1122285 C CN 1122285C CN 94113695 A CN94113695 A CN 94113695A CN 94113695 A CN94113695 A CN 94113695A CN 1122285 C CN1122285 C CN 1122285C
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- CN
- China
- Prior art keywords
- layer
- matrix
- semiconductor layer
- insulation
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 229920006113 non-polar polymer Polymers 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims abstract description 3
- 238000010292 electrical insulation Methods 0.000 claims abstract 3
- -1 polyethylene Polymers 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 229920000573 polyethylene Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000003431 cross linking reagent Substances 0.000 claims description 2
- 239000006230 acetylene black Substances 0.000 claims 3
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 239000006229 carbon black Substances 0.000 description 16
- 235000019241 carbon black Nutrition 0.000 description 16
- 230000005684 electric field Effects 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 230000002708 enhancing effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 229920002943 EPDM rubber Polymers 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920003020 cross-linked polyethylene Polymers 0.000 description 3
- 239000004703 cross-linked polyethylene Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 241001441571 Hiodontidae Species 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 239000005662 Paraffin oil Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Installation Of Indoor Wiring (AREA)
- Insulating Bodies (AREA)
Abstract
本发明的内容是关于一种电缆绝缘结构，它至少包括第一层即与电缆芯线同轴并相接触的半导体层；它外面包着第二层—电绝缘层；第二层外面包着第三层—半导体层，其特征在于：上述半导体层专门由某种基质组成，该基质含有其组成分子量高于1000的非极性聚合物和导电物质电荷。
The content of the present invention relates to a cable insulation structure, which at least includes a first layer, that is, a semiconductor layer that is coaxial with the cable core and is in contact with it; it is wrapped with a second layer—an electrical insulation layer; the second layer is wrapped with The third layer—semiconductor layer, is characterized in that: the above-mentioned semiconductor layer is exclusively composed of a certain matrix, which contains a non-polar polymer with a molecular weight higher than 1000 and electric charges of a conductive substance.
Description
Involved in the present invention is a kind of insulation system of middle pressure, high pressure and superhigh voltage DC or ac cable.
Usually, these cables all are to be made of conductive cable heart yearn and the outsourcing insulation system coaxial with it.This insulation system generally comprises three-decker at least: ground floor is and the contacted semiconductor layer of cable core; The second layer is the electric insulation layer that wraps in the ground floor outside; The 3rd layer is the semiconductor layer that wraps in second layer outside.Some other surrounding layer is used for protecting cable.
In general, insulating barrier all is with high density or low density polyethylene (LDPE), or crosslinked polyethylene, or the ethylene-propylene-diene terpolymer (EPDM) of band methylene main chain is a main component.
Semiconductor layer all is made of a kind of polarization matrix usually, and modal is ethene and alkyl acrylic salt copolymer, load carbon black.Its loadings is that the character according to used carbon black changes.The loadings ratio is usually between 28% to 40% for acetylene carbon black or oven process carbon black.
The insulation of this class cable (dielectric) intensity is very relevant with the interface quality between the insulating barrier with semiconductor layer.Interface between semiconductor layer and the insulating barrier is even there is a bit coarse injustice all can cause the enhancing of electric field, to such an extent as to insulating barrier takes place to puncture and destroyed.
In order in extrusion process, to obtain level and smooth as far as possible interface, at present normally being about 17 polymer with a kind of high melt index or high-melt index (melt index) as the matrix of the semiconductor layer of the high-tension cable of commodity is main component, (high-melt index represents to exist low-molecular-weight, usually measure according to ASTM D1238 standard or NFT51-O16 standard), polymer has very wide molecular weight distribution.Yet it is found that near the electric charge that has living space in the insulating barrier semiconductor layer occurs, the accumulation of space charge can cause the destruction of insulating barrier insulation property, until the puncture that causes insulating barrier.
Some producer of semiconductor layer uses with the matrix (EPR: ethylene-propylene thermoplastic and high-elastic of ethylene copolymer as main component, or EPDM: the ethylene-propylene-diene terpolymer of methylene main chain), toward wherein adding lubricating oil or plasticizer, so that obtain semiconductor surface attitude preferably easily.Yet these lubricating oil or plasticizer are diffused in the insulating barrier and in the very strong semiconductor layer of electric field and the zone that forms a non-constant of insulation property at the interface of insulating barrier.
Purpose of the present invention is intended to work out a kind of insulation system that is used for carrying pressure, high pressure or the extra-high-tension cable of direct current or alternating current, and its insulation property are than the insulation property of known any insulation system in running are all more stable at present.
This cable insulation structure that the present invention introduced is made up of three-decker at least: ground floor is to contact with cable core and coaxial semiconductor layer; The second layer is the electric insulation layer that wraps in the ground floor outside; The 3rd layer is the semiconductor layer that wraps in second layer outside.Semiconductor layer is made up of the matrix that contains non-polar polymer specially, and the molecular weight of this polymers compositions also contains conductive material (electric charge) greater than 1000.
The molecular weight of matrix components preferably can surpass 5000.
If semiconductor layer contains low-molecular-weight compound or additive, resemble lubricating oil or plasticizer etc., these compounds can move in insulating barrier, and the result of this phenomenon has formed space charge, this will cause the enhancing of electric field, thereby might cause later puncture.The enhancing of electric field is relevant with the quantity of electric charge of formation, but also depends on simultaneously the mobility of electric charge: the electric charge of equal number can't resemble when evenly distributing and concentrate the reinforcement that causes electric field distributing.This transport phenomena can produce in the transmission of electricity process of using cable or cable voluntarily.
Only include the high-molecular weight compounds composition in the semiconductor layer constituent of the present invention, this can be avoided the migration of electric charge in insulating barrier to reach the accumulation of the near interface space charge that causes therefrom.
According to first kind of embodiment, matrix is selected from following material: polyethylene, polypropylene, polystyrene and their copolymer, alloyed polymer (from polyethylene, polypropylene, polystyrene and their copolymer, choosing), mixture of compound (, selecting in their copolymer) and blending copolymer above-mentioned from polyethylene, polypropylene, polystyrene.
According to second kind of embodiment of the present invention, the matrix thing is chosen out from polylefin thermoplatic elastomer and composition thereof.
The selection that constitutes the polymer of matrix has determined the quality of itself and interfacial dielectric layer and the mechanical property of the semiconductor layer that makes, and need not to use additive.
Superiority of the present invention is to make the insulation property of insulation system to be stablized, and has also solved the migration problem of low-molecular-weight constituent simultaneously.So just make the interface quality between the different layerings find no fault with.The carbon black that is loaded requires pure as much as possible.People can use the oven process carbon black or use a kind of " KETJEN " carbon black, but preferably select more pure acetylene carbon black for use.
In some cases, also include crosslinking agent in the matrix in addition.Behind the material extrusion molding, people can carry out crosslinking Treatment so that improve its thermal deformation behavior to it.The requirement of this thermal deformation behavior is strict especially for the cable of carrying alternating current.
Other characteristics of the present invention and superiority thereof will show in the following description to embodiment.These embodiments are typical and also not exclusive, have with reference to accompanying drawing simultaneously.Have among the figure:
What Fig. 1 represented is the total block diagram of shock wave experimental provision.
Fig. 2 describes the insulation system sample top view of using for surge test.
Fig. 3 is described to be the profile of sample among Fig. 2.
Surge test will be carried out by means of the device of describing among Fig. 1.This test can calculate the enhancing of electric field in the insulation system.
The sample 1 that is used for the insulation system of surge test is to represent with the top view of Fig. 2, and represents with profile in Fig. 3.On the circular surface of 20mm diameter A, can see some laminations:
-ground floor is a semiconductor layer 2, and thickness B is 0.5mm.
-the second layer is an electric insulation layer 3, and thickness C is 0.8mm.
-Di is a semiconductor layer 4 for three layers, and thickness is identical with layer 2.
Device among Fig. 1 comprises " YAg " (yttrium-aluminium-garnet) laser 10, and its light beam is mapped on the target 11 of counter sample 1, and each semiconductor layer in the sample 1 all forms positive pole (+) and negative pole (-).This light beam is absorbed by (-) utmost point 2 surfaces, makes this surperficial pyrolysis, and the gas that is exhaled in the pyrolysis produces pressure (impact) ripple and passes sample.The indication of volume charge density in picture intelligence electric charge on this pressure wave modulator electrode and the sampling.
Photodiode 12 can make detector 13 and laser 10 synchronous.Circuit is by high voltage source 14 power supplies that resistor 15 is housed.The data of noting are converted, for 16 (processors) that use a computer are handled and reflected on a chart recorder 17 along with the variation of time in running.Laser 10 is transmitted into light wave on the target (target) 11, causes the appearance of space charge and changes Electric Field Distribution, and this electric field can be measured by detector 13.
Embodiment 1
Produce the sample of the similar insulation system of the sample introduced with Fig. 2 according to prior art, it comprises:
Ground floor is a semiconductor layer, it is made of the polarity matrix that with ethene-alkyl acrylic salt copolymer is main component, its " melt index (MI) " value is 8, and the content of its ester is 20%, and the acetylene carbon black filler that is loaded is that 66 parts of carbon blacks are than 100 parts of stroma ground substances with the weight ratio of matrix.
The electric insulation layer of the second layer, it is made of the olefin hydrocarbons thermoplasticity elastomer.
The 3rd layer is that its structure of semiconductor layer is formed identical with ground floor.
This sample carries out surge test by means of the device among Fig. 1.The result is near the negative electrical charge that has occurred the vast scale scope negative pole 2.The enhancing of electric field surpasses 20%, and the several hrs electric charge still falls into and stays in the matrix thing after voltage interruption.
According to the similar insulation system sample of sample that prior art for preparing and Fig. 2 are introduced, it comprises:
Ground floor is a semiconductor layer, it is made of the polarization matrix thing that with ethene-alkyl acrylic salt copolymer is main component, its copolymer " melt index (MI) " value is 8, and the content of its ester is 20%, and the acetylene carbon black that is loaded is that 66 parts of carbon blacks are than 100 parts of matrix things with the weight ratio of matrix thing.
The electric insulation layer of the second layer is made of processes for chemically crosslinked polyethylene (PRC).
The 3rd layer is that its structure of semiconductor layer is formed identical with ground floor.
This sample carries out surge test by means of the device among Fig. 1.A large amount of negative electrical charges has appearred in the result near negative pole 2, and still falls in behind interrupt voltage several hours and stay in the insulating barrier matrix.The enhancing of electric field surpasses 20%.
The sample of the insulation system of the present invention that the sample that making and Fig. 2 are introduced is similar, it comprises:
Ground floor is a semiconductor layer, and it is made up of nonpolar matrix, and toward wherein adding acetylene carbon black, weight ratio is that 66 parts of carbon blacks are than 100 parts of matrix things; Contain 20% polyethylene (PE) in the matrix thing, its " melt index (MI) " value is 2, and its molecular weight is 10
3-10
7Between, and with 1.1 * 10
6Be the center; Other 80% is ethylene-propylene copolymer, wherein contains weight and is about " MOONEY " viscosity of 50% (according to the NFT43005 canonical measure) and is about 40, and molecular weight is 10
310
7Between, (with 1.2 * 10
5Be the center) ethene.
The second layer is an electric insulation layer, is made of processes for chemically crosslinked polyethylene (PRC).
The 3rd layer is that its formation of semiconductor layer is identical with ground floor.
This sample carries out the surge test test by means of the device among Fig. 1.The enhancing of electric field after voltage interruption, no longer includes in the dielectric substrate to fall into and stays electric charge to exist in 10%.
Embodiment 4
Produce the similar insulation system sample of being introduced with Fig. 2 of the present invention of sample, it comprises:
Ground floor is a semiconductor layer, and it is made up of non-polarised matrix, and toward wherein adding acetylene carbon black, its weight ratio is that 66 parts of carbon blacks are than 100 parts of matrix; Contain 20% polyethylene (PE) in the matrix, its " melt index (MI) " value is 2, and its molecular weight is with 1.1 * 10
6Be the center; In addition 80% be ethylene-propylene copolymer, wherein contain weight and be about 50% ethene, its " MOONEY " viscosity (according to the NFT43005 standard) is about 40, its molecular weight is 10
3-10
7Between, and with 1.2 * 10
5Be the center.
The second layer is an electric insulation layer, is made of the olefin hydrocarbons thermoplasticity elastomer.
The 3rd layer is semiconductor layer, and its formation is identical with ground floor.
This sample carries out surge test by means of the device among Fig. 1.Its electric field strengthens in 10%, after the voltage interruption, no longer includes in the insulation material to fall into and stays electric charge to exist.
Embodiment 5 comparative examples
Describe similar sample among preparation and the embodiment 4, but will be the paraffin oil of matrix thing 5% toward adding weight in the semiconductor layer matrix.
This sample carries out the surge test test by means of the device among Fig. 1.The electric field enhancing is 140% in this case.
Certainly, the present invention is not limited to several embodiments described above, but do not depart from can have under the situation about the invention is intended to many can be by the enforcement modification that the technical staff accepted.Particularly, people can adopt the scheme in the alternative above-mentioned description of all efficient ways in being suitable for scope of the present invention.
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9311234 | 1993-09-21 | ||
| FR9311234A FR2710447B1 (en) | 1993-09-21 | 1993-09-21 | Isolation structure for cable. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1108789A CN1108789A (en) | 1995-09-20 |
| CN1122285C true CN1122285C (en) | 2003-09-24 |
Family
ID=9451076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94113695A Expired - Fee Related CN1122285C (en) | 1993-09-21 | 1994-09-21 | Cable insulation structure |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0644558B2 (en) |
| JP (1) | JP3658018B2 (en) |
| KR (1) | KR100323179B1 (en) |
| CN (1) | CN1122285C (en) |
| DE (1) | DE69418804T3 (en) |
| DK (1) | DK0644558T4 (en) |
| FR (1) | FR2710447B1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004178867A (en) * | 2002-11-25 | 2004-06-24 | Mitsubishi Cable Ind Ltd | Power cable |
| EP1634913B1 (en) | 2004-09-10 | 2008-10-29 | Borealis Technology Oy | Semiconductive polymer composition |
| JP4866545B2 (en) * | 2004-12-03 | 2012-02-01 | 株式会社フジクラ | Cable and twisted cable |
| CH698074B1 (en) * | 2005-11-11 | 2009-05-15 | Studer Ag Draht & Kabelwerk | Multi-conductor cable for transmitting rectangular extending alternating currents. |
| EP2711934B1 (en) * | 2012-09-25 | 2018-07-11 | Nexans | Silicone multilayer insulation for electric cable |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612139A (en) * | 1981-01-30 | 1986-09-16 | Nippon Unicar Co. Limited | Semi-conductive polyolefin compositions and cables covered with same |
| JP4056009B2 (en) * | 2000-01-31 | 2008-03-05 | 東芝テック株式会社 | Inline type pump |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54115798A (en) † | 1978-03-01 | 1979-09-08 | Fujikura Ltd | Semiconductive composition for power cable |
| JPS5562610A (en) † | 1978-10-31 | 1980-05-12 | Dainichi Nippon Cables Ltd | Power cable |
| JPS57199108A (en) † | 1981-06-01 | 1982-12-07 | Showa Electric Wire & Cable Co | Crosslinked polyethylene insulated power cable |
| BR8907103A (en) † | 1988-09-30 | 1991-02-05 | Exxon Chemical Patents Inc | MIXTURES OF LINEAR ETHYLENE INTERPOLYMERS OF INTERPOLYMERS HAVING NARROW DISTRIBUTIONS OF MOLECULAR WEIGHT AND COMPOSITION |
| JP3081218B2 (en) * | 1990-06-22 | 2000-08-28 | 財団法人電力中央研究所 | Method for improving semiconductive layer interface of polyolefin insulated cable |
| US5246783A (en) † | 1991-08-15 | 1993-09-21 | Exxon Chemical Patents Inc. | Electrical devices comprising polymeric insulating or semiconducting members |
-
1993
- 1993-09-21 FR FR9311234A patent/FR2710447B1/en not_active Expired - Lifetime
-
1994
- 1994-09-17 KR KR1019940023808A patent/KR100323179B1/en not_active IP Right Cessation
- 1994-09-20 EP EP94402087A patent/EP0644558B2/en not_active Expired - Lifetime
- 1994-09-20 DK DK94402087T patent/DK0644558T4/en active
- 1994-09-20 JP JP22505494A patent/JP3658018B2/en not_active Expired - Fee Related
- 1994-09-20 DE DE69418804T patent/DE69418804T3/en not_active Expired - Lifetime
- 1994-09-21 CN CN94113695A patent/CN1122285C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612139A (en) * | 1981-01-30 | 1986-09-16 | Nippon Unicar Co. Limited | Semi-conductive polyolefin compositions and cables covered with same |
| JP4056009B2 (en) * | 2000-01-31 | 2008-03-05 | 東芝テック株式会社 | Inline type pump |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0644558B2 (en) | 2003-05-28 |
| KR100323179B1 (en) | 2002-06-27 |
| KR950009752A (en) | 1995-04-24 |
| CN1108789A (en) | 1995-09-20 |
| DE69418804T2 (en) | 1999-12-09 |
| EP0644558B1 (en) | 1999-06-02 |
| DK0644558T4 (en) | 2003-09-22 |
| DE69418804T3 (en) | 2004-04-01 |
| FR2710447A1 (en) | 1995-03-31 |
| FR2710447B1 (en) | 1995-11-10 |
| JPH07169324A (en) | 1995-07-04 |
| DK0644558T3 (en) | 1999-12-13 |
| JP3658018B2 (en) | 2005-06-08 |
| DE69418804D1 (en) | 1999-07-08 |
| EP0644558A1 (en) | 1995-03-22 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: ARCA KUMBUM CABLE FRANCE CO., LTD. Free format text: FORMER OWNER: ALCATEL CABLE Effective date: 20010712 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20010712 Applicant after: Alcatel Cable Applicant before: Alcatel Cable |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NIKE SARY FRANCH CO., LTD. Free format text: FORMER OWNER: ARCA KUMBUM CABLE FRANCE CO., LTD. Effective date: 20080808 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080808 Address after: France Patentee after: Nike, Texas, France, Limited by Share Ltd Address before: The French plug DEX. Patentee before: Alcatel Cable |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030924 Termination date: 20120921 |