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EP0200230A2 - Auf einem Verbundhalbleitersubstrat gebildete logische integrierte Schaltungsvorrichtung - Google Patents

Auf einem Verbundhalbleitersubstrat gebildete logische integrierte Schaltungsvorrichtung Download PDF

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Publication number
EP0200230A2
EP0200230A2 EP86106035A EP86106035A EP0200230A2 EP 0200230 A2 EP0200230 A2 EP 0200230A2 EP 86106035 A EP86106035 A EP 86106035A EP 86106035 A EP86106035 A EP 86106035A EP 0200230 A2 EP0200230 A2 EP 0200230A2
Authority
EP
European Patent Office
Prior art keywords
transistors
transistor
output
channel region
logic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP86106035A
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English (en)
French (fr)
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EP0200230A3 (en
EP0200230B1 (de
Inventor
Hiromitsu Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
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NEC Corp
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Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of EP0200230A2 publication Critical patent/EP0200230A2/de
Publication of EP0200230A3 publication Critical patent/EP0200230A3/en
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Publication of EP0200230B1 publication Critical patent/EP0200230B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/0185—Coupling arrangements; Interface arrangements using field effect transistors only
    • H03K19/018507—Interface arrangements
    • H03K19/018535—Interface arrangements of Schottky barrier type [MESFET]
    • H03K19/018542—Interface arrangements of Schottky barrier type [MESFET] with at least one differential stage
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/09432—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors with coupled sources or source coupled logic
    • H03K19/09436—Source coupled field-effect logic [SCFL]

Definitions

  • the present invention relates to a logic integrated circuit device formed on a compound semiconductor substrate and more particularly, to such a device which is compatible with a silicon emitter-coupled logic integrated circuit device.
  • Gats IC an integrated circuit device formed on a substrate of compound semiconductor, typically of gallium arsenide, (called therefore hereinafter as a “Gats IC”) attains a very high speed operation, and therefore it is desired that a silicon emitter-coupled logic integrated circuit device (Si-ECL IC) which is usually employed in a high speed system is replaced by the Gats IC.
  • Si-ECL IC silicon emitter-coupled logic integrated circuit device
  • the inventor developed a prototype Gats IC, but which satisfied the above three conditions at the sacrifice of a power consumption and a semiconductor chip area. More specifically, some of transistors in the prototype Gats IC were connected in series between power supply terminals. The power supply voltage applied to the IC was -5,2 V, so that each of the series- connected transistors was supplied with a small voltage across its source and drain. Therefore, the threshold voltage thereof had to be designed to be of a shallow value. All the transistors in the prototype Gats IC were fabricated through the same steps, and thus took the same threshold voltage. As a result, the threshold voltage of an output transistor became shallow inevitably. On the other hand, the output transistor should drive to' 50!l load and produce an output signal having the ECL level.
  • the output transistor is required to have a considerably large current ability.
  • its gate width was made large remarkably.
  • an area on a semiconductor chip occupied by the output transistor was made large.
  • the transistor having a large gate width increases its input stray capacitance. For this reason, a plurality of buffer amplifiers were required to drive the output transistor. As a result, a large power was consumed by the buffer amplifiers. The amplifiers also increased the chip area.
  • an object of the present invention is to provide a logic integrated circuit device operating at a very high speed with a small power consumption and a small chip area.
  • Another object of the present invention is to provide a compound semiconductor integrated circuit device that is compatible with a silicon emitter-coupled logic device with a lower power consumption and a smaller chip area.
  • a logic integrated circuit device comprises a compound semiconductor substrate, a plurality of transistors formed on the substrate and constituting a logic circuit, and an output transistor formed on the substrate and driving a load in response to a signal derived from the logic circuit, the output transistor having its threshold voltage larger in absolute value than the transistors constituting the logic circuit.
  • the output transistor has a deeper threshold voltage and hence a large current value with a considerably small gate width. Therefore, the chip area occupied by the output transistor is made small.
  • the input stray capacitance of the output transistor is also decreased, and accordingly only one or no buffer amplifier is required to drive the output transistor. A power consumption is thereby reduced and the chip area is further decreased.
  • a Gats IC 100 has four input terminals 1 to 4, two output terminals 7 and 8, and two power supply terminals 5 and 6.
  • the first input terminal 1 is connected to the gate of a transistor Q 9 via a first input circuit which is composed of a source follower transistor Q 2 , a current source transistor Q 2 , two level shift diodes D 1 and D 2 , and two bias resistors R 1 and R 2 .
  • the second input terminal 2 is connected to the gate of a transistor Q 12 through a second input circuit composed of a source follower transistor Q 3 , a current source transistor Q 4 , a level shift diode D 3 , and bias resistors R 3 and R 4 .
  • the third input terminal 2 is connected via a third input circuit to the gate of a transistor Q 15 .
  • the third input circuit is constituted of a source follower transistor Q 5 , a current source transistor Q 6 , level shift diodes D 4 and D 5 , and bias resistors R 5 and R 6 .
  • the fourth input terminal 4 is connected to the gate of a transistor Q 10 via a fourth input circuit which is composed of a source follower transistor Q 7 , a current source transistor Q 8 , a level shift diode D 6 , and bias resistors R 7 and R 8 .
  • the transistors Q 9 and Q 10 constitutes a differential circuit, and the source connection point thereof is connected to a current source transistor Q 11 .
  • the transistors Q 12 and Q 15 also constitutes a differential cirucit, and a transistor Q 9 operates as a current source thereof.
  • a transistor Q 11 operates as a current source of a differential circuit composed of the transistors Q 13 and Q 14 .
  • the drains of the transistors Q 12 and Q 13 are connected in common to one ends of a load resistor R 10 and further to the gate of a transistor Q1 6 .
  • the drains of the transistors Q 14 and Q 15 are connected in common to one end of a load resistor R 11 and to the gate of a source follower transistor Q 18 .
  • the other ends of the load resistors R10 and R11 are connected via a level adjusting resistor R 9 to the first power supply terminal 5.
  • the source outputs of the transistors Q 16 and Q 18 are fed back through diodes D 7 and D 8 to the gates of the transistors Q 14 and Q 13 , respectively.
  • Transistors Q 17 and Q 19 constitutes a current source.
  • the transistors Q 9 to Q 15 and the resistors R 9 to R 11 thus constitutes a differential type logic circuit which functions as a latch circuit.
  • the outputs of the source follower transistors Q 16 and Q 13 are supplied through the diodes D 7 and D 8 to a first buffer amplifier which is composed of transistors Q 20 to Q 26 , resistors R 12 to R 14 and diodes Dg and D 10 .
  • the transistors Q 20 and Q 21 are connected in a differential form, and the transistor Q 22 is a current source.
  • the resistors R 13 and R 14 are load resistors and R 12 is a level adjusting resistor.
  • the transistors Q 23 to Q 26 and the diodes D 9 and D 10 constitute a level shift circuit.
  • the outputs of the first buffer amplifier are supplied to a second buffer amplifier 9.
  • the second buffer amplifier 9 has the same construction as the first amplifier and therefore is respresented as a block circuit.
  • the outputs of the second buffer amplifier 9 are supplied respectively to source follower transistors Q27 and Q 28 which have their sources connected respectively to the output terminals 7 and 8 and operate as output transistors.
  • the output terminals 7 and 8 are connected respectively to an external power terminal 10 and further to a subsequent stage circuit (not shown).
  • Each of the transistors Q 1 to Q 28 is of an N-channel type and a Schottky junction type field effect transistor.
  • the inventor developed the prototype Gats IC 100, so that he clarified that the IC 100 sacrificed the power consumption and the chip area for the compatibility with an Si-ECL IC and for a high speed operation.
  • the latch circuit including the transistors Q 9 to Q 15 and the buffer amplifiers employed a differential type logic circuit to produce true and complementary signals.
  • condition (2) for the compatibility was thus satisfied.
  • the first power supply terminal 5 was grounded and the second power supply terminal 6 was applied with a V SS potential of -5.2 V.
  • the input terminals 1 and 4 and thoses 2 and 3 where used respectively as a pair of input terminals. Accordingly, one of the terminals 1 and 4 and one of those 2 and 3 were often in an open state.
  • Each of input signals IN 1 to IN 4 took on ECL level in which a high level and a low level were -0.7 V and -1,9 V, respectively.
  • the resistance values of the resistors R 1 , R 3 , R 5 and R 7 were 1,3 k ⁇ , and those of the resistors R 2 , R 4 , R 6 and R 8 were 4.9 K ⁇ , so that the gate biases of the transistors Q 1 , Q 3' Q 5 and Q 7 were designed to be an intermediate level of the high level and the low level of the input signal IN. As a result, the compatibility was also satisfied with respect to the input signal logic level.
  • V DS is a voltage between source and drain
  • V DS(SAT) is a drain-source voltage at a saturation point
  • V GS is a gate-source voltage
  • V T is a threshold voltage.
  • the conductance of the transistor is increased by a large V GS' so that the transistor operates at a high speed.
  • V GS exceeds 0.6 V
  • the Schottky gate is forward biased, so that a gate current flows. Therefore, V GS is designed to be within a range between 0.4 V and 0.6 V.
  • the voltage drop V LS across the resistor R 10 was an amplitude of signals supplied to the transistors Q 14 (or Q 13 ) and Q 20 (ord Q 21 ) and tooks 2 V to obtain a switching operation in these transistors.
  • the voltage drop V R9 across the resistor R 9 required 0.6 V in order that the transistors Q 12 and Q 13 and those Q 14 and Q 15 operated in a differential form. Therefore, the voltage V DSA was under 2.6 V from the equation (2).
  • the respective drain-source voltages of the series- connected three transistors were thereby about 0.8 V.
  • the gate-source voltage V GS of 0.4 to 0.6 V was supplied to each of those three transistors.
  • the threshold voltage V T of the respective transistors took -0.2 to -0.3 V from the relationship (1) and could not be designed to be more deeply than this value. All the transistors in the IC 100 were manufactured by the same steps, and therefore the remaining transistors Q 1 to Q 8 and Q 16 to Q 28 also took their threshold voltage of -0.2 to -0.3 V.
  • Fig. 3 shows the relationship of the drain current I DS to the gate width. Since the threshold voltages V T of the transistors Q 27 and Q 28 were -0.2 V, that relationship is represented by a line 200. The gate width of 450 ⁇ m was recessitated for the current ability of 20 mA.
  • the Gats IC 100 required the considerably large sized output transistors Q 27 and Q 28 , so that the area of a semiconductor chip was enlarged. Since the gate widths of the transistors Q 27 and Q 28 were large, their input stray capacitors were made large remarkably. For this reason, it was impossible that the transistors Q 27 and Q 28 are driven only by the transistors Q 23 and Q 25 at a high speed. Therefore, the second buffer amplifier 9 was inserted between the first amplifier and the output transistors. Buffer amplifiers more than two were often provided. The respective transistors in the buffer amplifier 9 were required to have a relatively large gate width in order to drive a considerably large load capacitance, so that the power consumption of the amplifier was increased. The chip area was further enlarged. As described above, the Gats IC 100 having the compatibility with the Si-ECL IC consumed a large power and required a large chip area.
  • Fig. 2 shows an equivalent circuit of a Gats IC 500 according to an embodiment of the present invention.
  • output transistors are represented by Q 30 and Q 31 and have their threshold voltage that is smaller (or larger in absolute value) than the output transistors Q 27 and Q 28 in Fig. 1. Since the transistors Q 30 and Q 31 have a small threshold voltage, and they produce the same drain currents as the transistor Q 27 and Q 28 with smaller gate width. The transistors Q 30 and Q 31 are thereby manufactured with a small size to reduce the chip area. The input stray capacitances of Q 30 and Q 31 are also made small.
  • the transistors Q 30 and Q 31 are driven by the first buffer amplifier composed of the transistors Q 20 to Q 26 , the diodes D 9 and D 10 and the resistors R 12 to R 14 .
  • the second buffer amplifier 9 is thereby unnecessitated.
  • the first to fourth input circuit for the first to fourth input signals IN 1 to IN 4 and the differential type logic circuit as a latch circuit are the same as those in Fig. 1.
  • the like reference characters are employed. Accordingly, for the compatibility with the Si-ECL IC and the high speed operation, the threshold voltages of the transistors Q 1 to Q 28 are -0.2 to -0.3 V, and the resistance values of the resistors R 1 , R 3 , R 5 and R 7 are 1.3k ⁇ , the values of the resistors R 2 , R 4 , R 6 and R 8 being 4.9K ⁇ .
  • the first power supply terminal 5 is grounded and the terminal 6 is applied with -5.2 V.
  • the transistors Q 1 to Q 2S' Q 30 and Q 31 are N-channel type Schottky junction field effect transistors.
  • the threshold voltages of the output transistors Q 30 and Q 31 are designed to be -0.65 V. Therefore, the characteristic of the drain current to the gate width in the transistors Q 30 and Q 31 is represented by a line 300 in Fig. 3.
  • the transistors Q 30 and Q 31 have their current ability of 20 mA with their gate widths of 170 pm. As a result, the sizes of the transistors Q30 and Q 31 is reduced to about one third of the transistors Q 27 and Q 28'
  • the input stray capacitance of a transistor also depends on its threshold voltage. However, the increase in the input stray capacitance caused by the increase in threshold voltage is suppressed below 20 % in this embodiment. As a result, the second buffer amplifier 9 shown in Fig. 1 is deleted. This result in the further decrease in the chip area and a remarkable reduction of a power consumption.
  • the semiconductor chip area of the Gats IC 500 is reduced by 30 to 40 % as compared to that of the Gats IC 100. The power consumption is also decreased similarly.
  • the present invention provides a Gats IC having compatibility with an Si-ECL IC without increasing a power consumption and a chip area.
  • the threshold voltages of the output transistors Q 30 and Q 31 are favourably designed to be within a range between 0.6 V and 0.9 V.
  • Fig. 4 to Fig. 8 show manufacturing steps of the output transistor Q 30 (Q31) and the logic section transistor Q 9 (Q 1 to Q 8 and Q 10 to Q 26 ).
  • a semi-insulating gallium arsenide substrate 50 is prepared, and a main surface thereof is covered selectively with a photoresist film 51.
  • Si + ions are implanted into an exposed portion of the substrate 50 by ion implantation technique to form a channel region 52 of the output transistor Q 30 (Q 31 ).
  • the photoresist film 51 is then removed, and a new photoresist film 53 is formed to cover selectively the surface of the substrate 50, as shown in fig. 5.
  • Si + ions are implanted to the selective portion of the substrate 50 to form a channel region 54 of the transistor Q 9 (Q 1 to Q 8 and Q 10 to Q 26 ).
  • the ion energy is 40 Kev
  • the dose amount is 5 to 6 x 10 cm .
  • the ion energy and the dose amount for the channel region 54 are 40 KeV and 4 x 10 12 cm -3 , respectively.
  • the channel region 52 presents '-0.6 to -0.9 V threshold voltage to the output transistors Q 30 and Q 31
  • the channel region 54 presents a threshold voltage below -0.3 V to the transistor Q 1 to Q 26 .
  • the photoresist film 53 is removed, and a high melting point metal such as a tungsten silicide is deposited over the surface of the substrate 50 by the sputtering method.
  • the high melting point metal is subjected to the selective dry etching, so that Schottky gate electrode 55 and 56 are formed as shown in Fig. 6.
  • the gate width of the gate 55 is designed to present the above-mentioned current ability.
  • an insulating film 57 such as silicon dioxide is deposited over the gate electrodes 55 and 56 and the surface of the substrate 50.
  • the film 57 is selectively removed, so that only on the side surfaces of the gate electrodes 55 and 56 the silicon dioxide 57 is left, as shown in Fig. 7.
  • high carrier concentration layers 58 to 61 operating as source and drain regions are formed on the channel layers 52 and 54 by the chemical vapor deposition method.
  • the side surface insulating films 57 separates the gate electrodes 55 and 56 from the layers 58 to 61. Since the high carrier concentration layers 58 to 61 is formed on the surfaces of the channel regions 52 and 54, the so-called short channel effect is suppressed remarkably.
  • the layers 58 to 61 present a high gm. in this embodiment, the value of gm is above 300 mS/mm.
  • Ohmic electodes 62 to 65 are thereafter formed, which operate as source and drain electrodes and are made of An/Ge-Ni.
  • an insulating film 66 made of silicon dioxide is formed over the entire surface, and contact holes are formed in the film 66.
  • Interconnection wiring layers 67 to 70 are then formed to construct the circuit shown in Fig. 2,
  • the dose amount is changed to obtain the output transistors Q 30 and Q 31 having the deep threshold voltage, and therefore the increase in cost is suppressed in a minimum value. It is possible that the ion energy is changed. That is, the carrier concentration of the channel regions of the output transistors Q 30 and Q 31 is increased to make the threshold values therof deep.
  • the transistors in the Gats IC may be of a P-channel type, and output transistors of a source-grounded type may be employed.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Logic Circuits (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Amplifiers (AREA)
EP86106035A 1985-05-02 1986-05-02 Auf einem Verbundhalbleitersubstrat gebildete logische integrierte Schaltungsvorrichtung Expired - Lifetime EP0200230B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94905/85 1985-05-02
JP9490585 1985-05-02

Publications (3)

Publication Number Publication Date
EP0200230A2 true EP0200230A2 (de) 1986-11-05
EP0200230A3 EP0200230A3 (en) 1987-04-08
EP0200230B1 EP0200230B1 (de) 1991-09-04

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EP86106035A Expired - Lifetime EP0200230B1 (de) 1985-05-02 1986-05-02 Auf einem Verbundhalbleitersubstrat gebildete logische integrierte Schaltungsvorrichtung

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Country Link
US (1) US4743957A (de)
EP (1) EP0200230B1 (de)
JP (1) JPS62283718A (de)
DE (1) DE3681193D1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0237094A1 (de) * 1986-02-18 1987-09-16 Laboratoires D'electronique Philips Vordiffundierte Gatterfeld-Halbleitervorrichtung für speziell hergestellte Schaltungen
EP0417335A1 (de) * 1989-09-11 1991-03-20 Siemens Aktiengesellschaft Schaltungsanordnung zur Wandlung von Signalen mit TTL-Pegel in Signale mit CML-Pegel oder ECL-Pegel

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4831284A (en) * 1988-03-22 1989-05-16 International Business Machines Corporation Two level differential current switch MESFET logic
FR2648971B1 (fr) * 1989-06-23 1991-09-06 Thomson Composants Microondes Circuit d'interface de sortie entre deux circuits numeriques de natures differentes
DE4006504A1 (de) * 1990-03-02 1991-09-05 Telefunken Electronic Gmbh Schaltungsanordnung fuer opto-schmitt-trigger
JPH03270319A (ja) * 1990-03-19 1991-12-02 Fujitsu Ltd レベル変換回路
JPH0454724A (ja) * 1990-06-22 1992-02-21 Sumitomo Electric Ind Ltd 論理回路
JPH07226667A (ja) * 1993-06-22 1995-08-22 Nec Corp 入力回路
JPH11145397A (ja) * 1997-11-11 1999-05-28 Mitsubishi Electric Corp 半導体集積回路装置
JP2002370363A (ja) * 2001-06-15 2002-12-24 Canon Inc インクジェット記録ヘッド用基板、インクジェット記録ヘッド、インクジェット記録装置
CN111404537B (zh) * 2020-03-05 2023-09-26 中科亿海微电子科技（苏州）有限公司 一种用于fpga的过压输入i/o缓冲器电路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028556A (en) * 1974-03-12 1977-06-07 Thomson-Csf High-speed, low consumption integrated logic circuit
EP0085569A2 (de) * 1982-02-01 1983-08-10 Sperry Corporation Galliumarsenide logische Schaltung

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JPS5066146A (de) * 1973-10-12 1975-06-04
US4410815A (en) * 1981-09-24 1983-10-18 Sperry Corporation Gallium arsenide to emitter coupled logic level converter
US4496856A (en) * 1982-07-21 1985-01-29 Sperry Corporation GaAs to ECL level converter
US4494016A (en) * 1982-07-26 1985-01-15 Sperry Corporation High performance MESFET transistor for VLSI implementation
JPS59117328A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 論理回路
JPH0773207B2 (ja) * 1984-05-11 1995-08-02 セイコーエプソン株式会社 出力回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028556A (en) * 1974-03-12 1977-06-07 Thomson-Csf High-speed, low consumption integrated logic circuit
EP0085569A2 (de) * 1982-02-01 1983-08-10 Sperry Corporation Galliumarsenide logische Schaltung

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
E. Hölzler, H. Holzwarth "Pulstechnik - Band II, Anwendungen und Systeme", Springer Verlag, Berlin, Heidelberg, New York 1976, pages 155-156 *
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. SC-19, no. 5, October 1984, pages 710-715, New York, US; S. SHIMIZU et al.: "A 1 GHz 50 mW GaAs Dual Modulus Divider IC" *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0237094A1 (de) * 1986-02-18 1987-09-16 Laboratoires D'electronique Philips Vordiffundierte Gatterfeld-Halbleitervorrichtung für speziell hergestellte Schaltungen
EP0417335A1 (de) * 1989-09-11 1991-03-20 Siemens Aktiengesellschaft Schaltungsanordnung zur Wandlung von Signalen mit TTL-Pegel in Signale mit CML-Pegel oder ECL-Pegel
US5105106A (en) * 1989-09-11 1992-04-14 Siemens Aktiengesellschaft Circuit configuration for converting TTL-level signals into CML or ECL-level signals

Also Published As

Publication number Publication date
EP0200230A3 (en) 1987-04-08
DE3681193D1 (de) 1991-10-10
US4743957A (en) 1988-05-10
EP0200230B1 (de) 1991-09-04
JPS62283718A (ja) 1987-12-09

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