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DK387479A - PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS WITH BUILT-IN AREAS AND THIN LEADERS - Google Patents

PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS WITH BUILT-IN AREAS AND THIN LEADERS

Info

Publication number
DK387479A
DK387479A DK387479A DK387479A DK387479A DK 387479 A DK387479 A DK 387479A DK 387479 A DK387479 A DK 387479A DK 387479 A DK387479 A DK 387479A DK 387479 A DK387479 A DK 387479A
Authority
DK
Denmark
Prior art keywords
built
conductors
leaders
areas
procedure
Prior art date
Application number
DK387479A
Other languages
Danish (da)
Other versions
DK152640B (en
DK152640C (en
Inventor
W R Reimann
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DK387479A publication Critical patent/DK387479A/en
Publication of DK152640B publication Critical patent/DK152640B/en
Application granted granted Critical
Publication of DK152640C publication Critical patent/DK152640C/en

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Slender conductors and narrow spaces between them, typically with a width of 0.05 to 0.075 mm, are produced on the outer layer of a printed circuit card with built- up regions such as, for example, through-plated holes or conductors with widths larger than 0.05 to 0.075 mm. Gold 22 is deposited over a copper-clad substrate 10, 16 in a pattern which determines the desired circuit. After this, soldering agents 28 are applied to the built-up regions, and the non-protected copper 16 is removed by etching making use of both the soldering agent 28 and the gold 22 as resist material. An organic resist material is used in place of the soldering agent when the built-up region contains broad conductors, such as power conductors. <IMAGE>
DK387479A 1978-09-18 1979-09-17 PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS WITH BUILT-IN AREAS AND THIN LEADERS DK152640C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94309378A 1978-09-18 1978-09-18
US94309378 1978-09-18

Publications (3)

Publication Number Publication Date
DK387479A true DK387479A (en) 1980-03-19
DK152640B DK152640B (en) 1988-03-28
DK152640C DK152640C (en) 1988-08-15

Family

ID=25479093

Family Applications (1)

Application Number Title Priority Date Filing Date
DK387479A DK152640C (en) 1978-09-18 1979-09-17 PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS WITH BUILT-IN AREAS AND THIN LEADERS

Country Status (2)

Country Link
DK (1) DK152640C (en)
IL (1) IL58029A (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475284A (en) * 1966-04-18 1969-10-28 Friden Inc Manufacture of electric circuit modules
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3986939A (en) * 1975-01-17 1976-10-19 Western Electric Company, Inc. Method for enhancing the bondability of metallized thin film substrates
US4024631A (en) * 1975-11-24 1977-05-24 Xerox Corporation Printed circuit board plating process

Also Published As

Publication number Publication date
DK152640B (en) 1988-03-28
IL58029A0 (en) 1979-12-30
DK152640C (en) 1988-08-15
IL58029A (en) 1982-01-31

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Legal Events

Date Code Title Description
PBP Patent lapsed