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DK1216453T3 - Fremgangsmåde ved fremstilling af et chipkort og chipkort tilvejebragt ifølge fremgangsmåden - Google Patents

Fremgangsmåde ved fremstilling af et chipkort og chipkort tilvejebragt ifølge fremgangsmåden

Info

Publication number
DK1216453T3
DK1216453T3 DK00958199T DK00958199T DK1216453T3 DK 1216453 T3 DK1216453 T3 DK 1216453T3 DK 00958199 T DK00958199 T DK 00958199T DK 00958199 T DK00958199 T DK 00958199T DK 1216453 T3 DK1216453 T3 DK 1216453T3
Authority
DK
Denmark
Prior art keywords
contact surfaces
chip card
layers
recesses
chip
Prior art date
Application number
DK00958199T
Other languages
English (en)
Inventor
Dirk Fischer
Lothar Fannasch
Original Assignee
Orga Kartensysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh filed Critical Orga Kartensysteme Gmbh
Application granted granted Critical
Publication of DK1216453T3 publication Critical patent/DK1216453T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
DK00958199T 1999-08-19 2000-08-01 Fremgangsmåde ved fremstilling af et chipkort og chipkort tilvejebragt ifølge fremgangsmåden DK1216453T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19939347A DE19939347C1 (de) 1999-08-19 1999-08-19 Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
PCT/DE2000/002559 WO2001015074A1 (de) 1999-08-19 2000-08-01 Verfahren zur herstellung einer chipkarte und nach dem verfahren hergestellte chipkarte

Publications (1)

Publication Number Publication Date
DK1216453T3 true DK1216453T3 (da) 2004-02-16

Family

ID=7918909

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00958199T DK1216453T3 (da) 1999-08-19 2000-08-01 Fremgangsmåde ved fremstilling af et chipkort og chipkort tilvejebragt ifølge fremgangsmåden

Country Status (8)

Country Link
US (1) US6659355B1 (da)
EP (1) EP1216453B1 (da)
AT (1) ATE252255T1 (da)
AU (1) AU6982200A (da)
DE (2) DE19939347C1 (da)
DK (1) DK1216453T3 (da)
ES (1) ES2208413T3 (da)
WO (1) WO2001015074A1 (da)

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US6817532B2 (en) * 1992-02-12 2004-11-16 Lenscard U.S., Llc Wallet card with built-in light
DE10113476C1 (de) * 2001-03-20 2003-04-17 Giesecke & Devrient Gmbh Datenträger mit eingebetteter Spule und Verfahren zu seiner Herstellung
DE10120254A1 (de) * 2001-04-25 2002-11-07 Infineon Technologies Ag Chipkartenmodul
DE10128579B4 (de) * 2001-06-13 2006-05-11 Infineon Technologies Ag Tragbarer Datenträger mit einer Mehrzahl an Funktionselementen unterschiedlicher Bauhöhe
US7322530B2 (en) * 2001-08-16 2008-01-29 November Aktiengesellschaft Gesellschaft Fur Molekulare Medizin Forgery-proof marking for objects and method for identifying such a marking
DE10308477A1 (de) * 2002-09-30 2004-04-08 Orga Kartensysteme Gmbh Chipkarte
DE10248394A1 (de) * 2002-10-17 2004-05-13 Giesecke & Devrient Gmbh Tragbarer elektronischer Datenträger
DE10248386B4 (de) * 2002-10-17 2006-08-31 Giesecke & Devrient Gmbh Tragbarer elektronischer Datenträger mit integriertem Display
DE10324043B4 (de) * 2003-05-27 2006-08-31 Giesecke & Devrient Gmbh Kartenförmiger elektronischer Datenträger, Funktionsinlett dafür und ihre Herstellungsverfahren
DE10343734A1 (de) * 2003-09-22 2005-04-21 Austria Card Datenträgerkarte mit aufladbarer Batterie
DE102004010715B4 (de) * 2004-03-04 2009-10-01 Infineon Technologies Ag Chipkarte zur kontaktlosen Datenübertragung sowie Verfahren zum Herstellen einer Chipkarte zur kontaktlosen Datenübertragung
DE102004055616B4 (de) * 2004-11-18 2007-02-01 Mühlbauer Ag Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder
US7821794B2 (en) 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
EP1770608B1 (en) * 2005-09-22 2009-07-29 Gemalto Oy Smartcard with transparent rim and a method of producing the same
DE102005058101B4 (de) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
JP4860436B2 (ja) * 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
KR100932286B1 (ko) * 2007-11-16 2009-12-16 주식회사 국민은행 어댑터가 탈부착가능한 ａｍｏｌｅｄ 디스플레이 칩 카드
KR20090050586A (ko) * 2007-11-16 2009-05-20 주식회사 국민은행 Ａｍｏｌｅｄ 디스플레이 칩 카드
FR2944121B1 (fr) * 2009-04-03 2016-06-24 Paragon Identification Carte d'identification de radio frequence(rfid) semi-rigide, le procede de fabrication et la machine permettant sa fabrication
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
DE102010025774A1 (de) * 2010-07-01 2012-01-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Inlays für einen tragbaren Datenträger und Inlay
DE102010052991A1 (de) * 2010-11-30 2012-05-31 Giesecke & Devrient Gmbh Portabler Datenträger
DE102010052984A1 (de) * 2010-11-30 2012-05-31 Giesecke & Devrient Gmbh Portabler Datenträger
DE102011109338B3 (de) * 2011-08-03 2013-01-31 Dietrich Reichwein Vorrichtung zur Speicherung elektromagnetischer Energie
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
GB201208680D0 (en) 2012-05-17 2012-06-27 Origold As Method of manufacturing an electronic card
DE102013020555A1 (de) * 2013-12-09 2015-06-11 Giesecke & Devrient Gmbh Verfahren zum Herstellen eines Modulstreifens
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
US11106961B2 (en) 2019-10-09 2021-08-31 Beauiiful Card Corporation Mini smart card and method of manufacturing the same
CN116080219B (zh) * 2022-08-30 2025-02-11 恒宝股份有限公司 一种识别卡及其卡制作方法
SI26519A (sl) * 2023-05-30 2024-12-31 Cetis, D.D. Ovitek z integriranim čipom

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Also Published As

Publication number Publication date
ES2208413T3 (es) 2004-06-16
AU6982200A (en) 2001-03-19
US6659355B1 (en) 2003-12-09
EP1216453B1 (de) 2003-10-15
DE50004101D1 (de) 2003-11-20
ATE252255T1 (de) 2003-11-15
EP1216453A1 (de) 2002-06-26
WO2001015074A1 (de) 2001-03-01
DE19939347C1 (de) 2001-02-15

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