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DE69839006D1 - Leiterplatte mit durchkontaktierungen - Google Patents

Leiterplatte mit durchkontaktierungen

Info

Publication number
DE69839006D1
DE69839006D1 DE69839006T DE69839006T DE69839006D1 DE 69839006 D1 DE69839006 D1 DE 69839006D1 DE 69839006 T DE69839006 T DE 69839006T DE 69839006 T DE69839006 T DE 69839006T DE 69839006 D1 DE69839006 D1 DE 69839006D1
Authority
DE
Germany
Prior art keywords
contact
conductor plate
conductor
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69839006T
Other languages
English (en)
Other versions
DE69839006T2 (de
Inventor
Michio Horiuchi
Toshiaki Suyama
Masakuni Tokita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Application granted granted Critical
Publication of DE69839006D1 publication Critical patent/DE69839006D1/de
Publication of DE69839006T2 publication Critical patent/DE69839006T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09836—Oblique hole, via or bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69839006T 1997-04-16 1998-04-16 Leiterplatte mit durchkontaktierungen Expired - Lifetime DE69839006T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9868197 1997-04-16
JP09868197A JP3629348B2 (ja) 1997-04-16 1997-04-16 配線基板
PCT/JP1998/001746 WO1998047326A1 (en) 1997-04-16 1998-04-16 Wiring board having vias

Publications (2)

Publication Number Publication Date
DE69839006D1 true DE69839006D1 (de) 2008-03-06
DE69839006T2 DE69839006T2 (de) 2009-01-08

Family

ID=14226262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69839006T Expired - Lifetime DE69839006T2 (de) 1997-04-16 1998-04-16 Leiterplatte mit durchkontaktierungen

Country Status (6)

Country Link
US (1) US6271483B1 (de)
EP (1) EP0926931B1 (de)
JP (1) JP3629348B2 (de)
KR (1) KR100281381B1 (de)
DE (1) DE69839006T2 (de)
WO (1) WO1998047326A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434821B (en) * 2000-02-03 2001-05-16 United Microelectronics Corp Allocation structure of via plug to connect different metal layers
US6774315B1 (en) * 2000-05-24 2004-08-10 International Business Machines Corporation Floating interposer
US6815621B2 (en) * 2000-10-02 2004-11-09 Samsung Electronics Co., Ltd. Chip scale package, printed circuit board, and method of designing a printed circuit board
KR20030065698A (ko) * 2002-01-30 2003-08-09 삼성전자주식회사 볼의 피치가 작은 반도체 패키지의 테스트를 용이하게 할수 있는 반도체 패키지 테스트 보드
JP4237966B2 (ja) * 2002-03-08 2009-03-11 浜松ホトニクス株式会社 検出器
US7230247B2 (en) 2002-03-08 2007-06-12 Hamamatsu Photonics K.K. Detector
KR20050065038A (ko) * 2003-12-24 2005-06-29 삼성전기주식회사 비수직 비아가 구비된 인쇄회로기판 및 패키지
US20050251777A1 (en) * 2004-05-05 2005-11-10 International Business Machines Corporation Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
KR100858075B1 (ko) 2004-07-06 2008-09-11 도쿄엘렉트론가부시키가이샤 인터포저
US7915537B1 (en) * 2005-10-19 2011-03-29 Edward Herbert Interposer and method for making interposers
US7629541B2 (en) * 2006-06-19 2009-12-08 Endicott Interconnect Technologies, Inc. High speed interposer
JP5772970B2 (ja) 2011-10-21 2015-09-02 株式会社村田製作所 多層配線基板、プローブカード及び多層配線基板の製造方法
US8946757B2 (en) * 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
JP2014038884A (ja) * 2012-08-10 2014-02-27 Murata Mfg Co Ltd 電子部品および電子部品の製造方法
US9496212B2 (en) * 2014-12-19 2016-11-15 Freescale Semiconductor, Inc. Substrate core via structure
WO2018182719A1 (en) * 2017-03-31 2018-10-04 Intel Corporation Ultra low-cost, low leadtime, and high density space transformer for fine pitch applications

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146264A (en) * 1980-04-14 1981-11-13 Mitsubishi Electric Corp Carrier for equipment of chip
JPS63193587A (ja) 1987-02-06 1988-08-10 株式会社日立製作所 導体シ−ルド付微細スルホ−ル基板
US5197892A (en) * 1988-05-31 1993-03-30 Canon Kabushiki Kaisha Electric circuit device having an electric connecting member and electric circuit components
US5055966A (en) * 1990-12-17 1991-10-08 Hughes Aircraft Company Via capacitors within multi-layer, 3 dimensional structures/substrates
JP3004071B2 (ja) * 1991-04-16 2000-01-31 日本特殊陶業株式会社 集積回路用パッケージ
JP3167141B2 (ja) * 1991-04-16 2001-05-21 日本特殊陶業株式会社 集積回路用パッケージ
US5315072A (en) * 1992-01-27 1994-05-24 Hitachi Seiko, Ltd. Printed wiring board having blind holes
US5340947A (en) * 1992-06-22 1994-08-23 Cirqon Technologies Corporation Ceramic substrates with highly conductive metal vias
JP2570617B2 (ja) * 1994-05-13 1997-01-08 日本電気株式会社 多層配線セラミック基板のビア構造及びその製造方法
JP3252635B2 (ja) * 1995-01-13 2002-02-04 株式会社村田製作所 積層電子部品
JPH08330469A (ja) * 1995-05-30 1996-12-13 Hitachi Ltd 半導体装置用配線基板およびその製造方法
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
US5920123A (en) * 1997-01-24 1999-07-06 Micron Technology, Inc. Multichip module assembly having via contacts and method of making the same
US5949030A (en) * 1997-11-14 1999-09-07 International Business Machines Corporation Vias and method for making the same in organic board and chip carriers

Also Published As

Publication number Publication date
EP0926931A1 (de) 1999-06-30
WO1998047326A1 (en) 1998-10-22
JP3629348B2 (ja) 2005-03-16
US6271483B1 (en) 2001-08-07
EP0926931B1 (de) 2008-01-16
JPH10290059A (ja) 1998-10-27
KR100281381B1 (ko) 2001-02-01
DE69839006T2 (de) 2009-01-08
EP0926931A4 (de) 2006-12-06
KR20000016676A (ko) 2000-03-25

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: HORIUCHI, MICHIO, NAGANO 380-0921, JP

Inventor name: SUYAMA, TOSHIAKI, NAGANO 380-0921, JP

Inventor name: TOKITA, MASAKUNI, NAGANO 380-0921, JP

8364 No opposition during term of opposition