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DE69827062D1 - Vorrichtung zum Polieren - Google Patents

Vorrichtung zum Polieren

Info

Publication number
DE69827062D1
DE69827062D1 DE69827062T DE69827062T DE69827062D1 DE 69827062 D1 DE69827062 D1 DE 69827062D1 DE 69827062 T DE69827062 T DE 69827062T DE 69827062 T DE69827062 T DE 69827062T DE 69827062 D1 DE69827062 D1 DE 69827062D1
Authority
DE
Germany
Prior art keywords
polishing device
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69827062T
Other languages
English (en)
Other versions
DE69827062T2 (de
Inventor
Minoru Numoto
Takao Inaba
Kenji Sakai
Hisashi Terashita
Manabu Satoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE69827062D1 publication Critical patent/DE69827062D1/de
Application granted granted Critical
Publication of DE69827062T2 publication Critical patent/DE69827062T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Wing Frames And Configurations (AREA)
DE69827062T 1997-04-04 1998-04-02 Poliervorrichtung Expired - Fee Related DE69827062T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP8681497 1997-04-04
JP8681497 1997-04-04
JP13892597 1997-05-28
JP13892597 1997-05-28

Publications (2)

Publication Number Publication Date
DE69827062D1 true DE69827062D1 (de) 2004-11-25
DE69827062T2 DE69827062T2 (de) 2005-03-03

Family

ID=26427899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69827062T Expired - Fee Related DE69827062T2 (de) 1997-04-04 1998-04-02 Poliervorrichtung

Country Status (7)

Country Link
US (1) US6203414B1 (de)
EP (1) EP0868975B1 (de)
KR (1) KR100475845B1 (de)
DE (1) DE69827062T2 (de)
MY (1) MY119522A (de)
SG (1) SG70632A1 (de)
TW (1) TW431942B (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203414B1 (en) * 1997-04-04 2001-03-20 Tokyo Seimitsu Co., Ltd. Polishing apparatus
US6059636A (en) * 1997-07-11 2000-05-09 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus
MY120754A (en) * 1997-08-11 2005-11-30 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
GB2347102B (en) 1998-10-16 2002-12-11 Tokyo Seimitsu Co Ltd Wafer polishing apparatus and polishing quantity detection method
US6283828B1 (en) * 1998-11-09 2001-09-04 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus
JP4033632B2 (ja) * 1999-02-02 2008-01-16 株式会社荏原製作所 基板把持装置及び研磨装置
US6645050B1 (en) 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6276998B1 (en) 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
JP3068086B1 (ja) * 1999-05-07 2000-07-24 株式会社東京精密 ウェ―ハ研磨装置
TW477733B (en) * 1999-12-17 2002-03-01 Fujikoshi Machinery Corp Abrasive machine
CN1179821C (zh) * 2000-05-12 2004-12-15 多平面技术公司 具有独立限位环和多区域压力控制结构的气动隔膜式抛光头及其使用方法
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
TW579319B (en) 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6506105B1 (en) * 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6652357B1 (en) * 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US7121919B2 (en) 2001-08-30 2006-10-17 Micron Technology, Inc. Chemical mechanical polishing system and process
US7316602B2 (en) * 2002-05-23 2008-01-08 Novellus Systems, Inc. Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing
KR100871548B1 (ko) * 2003-12-30 2008-12-01 동부일렉트로닉스 주식회사 화학기계적 연마장비의 헤드아암 밸런스 측정용 지그장치 및 측정 방법
JP4756884B2 (ja) * 2005-03-14 2011-08-24 信越半導体株式会社 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法
KR100814069B1 (ko) * 2007-03-30 2008-03-17 티아이씨덕흥 주식회사 에어백 방식의 웨이퍼 폴리싱 헤드
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
KR101365499B1 (ko) 2013-06-03 2014-03-04 씨엠티 주식회사 평면 연마기의 상·하정반간 가압력 균일화 유지방법과 그 장치
CN104097142B (zh) * 2014-06-24 2016-08-17 北京理工大学 一种电控磁场柔性囊式充液抛光装置
DE102016110185A1 (de) * 2015-06-04 2016-12-08 Jtekt Corporation Elektromagnetisches Futter und Multifunktionsschleifmaschine mit elektromagnetischem Futter
JP6575192B2 (ja) * 2015-07-14 2019-09-18 株式会社ジェイテクト 電磁チャック、及び電磁チャックを備えた複合研削盤
JP2017037918A (ja) * 2015-08-07 2017-02-16 エスアイアイ・セミコンダクタ株式会社 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路の製造方法
US9865477B2 (en) * 2016-02-24 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Backside polisher with dry frontside design and method using the same
CN105881176B (zh) * 2016-06-18 2018-04-17 河北工业大学 一种双棒结构的磁致伸缩抛光装置
JP6713377B2 (ja) * 2016-08-10 2020-06-24 エイブリック株式会社 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路装置の製造方法
CN107884274B (zh) * 2017-12-13 2023-08-01 重庆科技学院 土体三类侧向压力值的测试装置及测试方法
KR102130883B1 (ko) * 2018-04-02 2020-07-06 주식회사 케이씨텍 압력 검출 장치 및 이를 포함하는 기판 연마 시스템
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
CN110732932B (zh) * 2019-10-23 2021-06-18 中国科学院光电技术研究所 大口径整体式光学元件多机器人精密加工系统及方法
CN110883673A (zh) * 2019-12-05 2020-03-17 黄海群 一种自动五金抛光机
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7365282B2 (ja) * 2020-03-26 2023-10-19 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN112405305A (zh) * 2020-11-20 2021-02-26 西安奕斯伟硅片技术有限公司 单面抛光装置及方法
CN113927462A (zh) * 2021-11-08 2022-01-14 广东海拓创新精密设备科技有限公司 一种半导体减震夹持卡盘装置及其系统
CN115401587B (zh) * 2022-09-28 2023-06-27 浙江芯晖装备技术有限公司 一种抛光头及半导体晶圆平坦化设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689474A (en) 1979-12-18 1981-07-20 Sharp Corp Grinder
JPS6373625A (ja) 1986-09-17 1988-04-04 Shin Etsu Handotai Co Ltd 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法
JPS6488265A (en) 1987-09-30 1989-04-03 Chugoku Electric Power Spotting apparatus of fault point
JPH079896B2 (ja) 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
JP2527232B2 (ja) 1989-03-16 1996-08-21 株式会社日立製作所 研磨装置
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3329034B2 (ja) 1993-11-06 2002-09-30 ソニー株式会社 半導体基板の研磨装置
JP2933488B2 (ja) 1994-08-10 1999-08-16 日本電気株式会社 研磨方法および研磨装置
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
TW348279B (en) 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP2861883B2 (ja) * 1995-09-18 1999-02-24 日本電気株式会社 ウェハー研磨方法およびその装置
JPH09246218A (ja) * 1996-03-07 1997-09-19 Hitachi Ltd 研磨方法および装置
US6203414B1 (en) * 1997-04-04 2001-03-20 Tokyo Seimitsu Co., Ltd. Polishing apparatus

Also Published As

Publication number Publication date
EP0868975B1 (de) 2004-10-20
US6203414B1 (en) 2001-03-20
MY119522A (en) 2005-06-30
SG70632A1 (en) 2000-02-22
KR19980080996A (ko) 1998-11-25
EP0868975A1 (de) 1998-10-07
TW431942B (en) 2001-05-01
KR100475845B1 (ko) 2005-06-17
DE69827062T2 (de) 2005-03-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee