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DE69902021D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number
DE69902021D1
DE69902021D1 DE69902021T DE69902021T DE69902021D1 DE 69902021 D1 DE69902021 D1 DE 69902021D1 DE 69902021 T DE69902021 T DE 69902021T DE 69902021 T DE69902021 T DE 69902021T DE 69902021 D1 DE69902021 D1 DE 69902021D1
Authority
DE
Germany
Prior art keywords
polishing device
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69902021T
Other languages
English (en)
Other versions
DE69902021T2 (de
Inventor
Norio Kimura
You Ishii
Yoshikuni Tateyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69902021D1 publication Critical patent/DE69902021D1/de
Publication of DE69902021T2 publication Critical patent/DE69902021T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE69902021T 1998-03-26 1999-03-26 Poliervorrichtung Expired - Lifetime DE69902021T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9697198A JP3615931B2 (ja) 1998-03-26 1998-03-26 ポリッシング装置および該ポリッシング装置におけるコンディショニング方法
PCT/JP1999/001543 WO1999050024A1 (en) 1998-03-26 1999-03-26 Polishing apparatus

Publications (2)

Publication Number Publication Date
DE69902021D1 true DE69902021D1 (de) 2002-08-08
DE69902021T2 DE69902021T2 (de) 2003-03-06

Family

ID=14179120

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69902021T Expired - Lifetime DE69902021T2 (de) 1998-03-26 1999-03-26 Poliervorrichtung

Country Status (6)

Country Link
US (2) US6645053B1 (de)
EP (1) EP1066133B1 (de)
JP (1) JP3615931B2 (de)
KR (1) KR100525652B1 (de)
DE (1) DE69902021T2 (de)
WO (1) WO1999050024A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3615931B2 (ja) * 1998-03-26 2005-02-02 株式会社荏原製作所 ポリッシング装置および該ポリッシング装置におけるコンディショニング方法
JP3772946B2 (ja) 1999-03-11 2006-05-10 株式会社荏原製作所 ドレッシング装置及び該ドレッシング装置を備えたポリッシング装置
US6509269B2 (en) * 1999-10-19 2003-01-21 Applied Materials, Inc. Elimination of pad glazing for Al CMP
TW495416B (en) 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus
DE10195157B4 (de) * 2000-11-29 2010-08-26 Qimonda Ag Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern
JP2003211355A (ja) * 2002-01-15 2003-07-29 Ebara Corp ポリッシング装置及びドレッシング方法
DE10261465B4 (de) 2002-12-31 2013-03-21 Advanced Micro Devices, Inc. Anordnung zum chemisch-mechanischen Polieren mit einem verbesserten Konditionierwerkzeug
JP2005230921A (ja) * 2004-02-17 2005-09-02 Disco Abrasive Syst Ltd ウォータージェット加工装置
US20060154572A1 (en) * 2005-01-13 2006-07-13 Wen-Chung Huang High-pressure polishing apparatus and method
US20070066187A1 (en) * 2005-09-22 2007-03-22 Chih-Chiang Yang Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization
JP2007253294A (ja) * 2006-03-24 2007-10-04 Konica Minolta Opto Inc 研磨パッドのドレッシング方法
KR100879761B1 (ko) 2007-07-12 2009-01-21 주식회사 실트론 화학적 기계적 연마 장치 및 이를 이용한 연마 패드 드레싱방법
JP5415735B2 (ja) * 2008-09-26 2014-02-12 株式会社荏原製作所 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
JP2010228058A (ja) * 2009-03-27 2010-10-14 Fujikoshi Mach Corp 研磨布の洗浄装置および洗浄方法
US20140323017A1 (en) * 2013-04-24 2014-10-30 Applied Materials, Inc. Methods and apparatus using energized fluids to clean chemical mechanical planarization polishing pads
US10293462B2 (en) * 2013-07-23 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad conditioner and method of reconditioning planarization pad
CN106540895B (zh) * 2015-09-16 2019-06-04 泰科电子(上海)有限公司 清洗系统
DE102015224933A1 (de) * 2015-12-11 2017-06-14 Siltronic Ag Monokristalline Halbleiterscheibe und Verfahren zur Herstellung einer Halbleiterscheibe
JP6616365B2 (ja) * 2017-09-11 2019-12-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置、プログラムおよび記録媒体
CN112476243A (zh) * 2020-11-26 2021-03-12 华虹半导体(无锡)有限公司 化学机械研磨装置及化学机械研磨工艺研磨垫清洗装置
KR102586774B1 (ko) * 2021-05-06 2023-10-10 주식회사 엔티에스 그라인더
KR102434185B1 (ko) * 2021-06-11 2022-08-19 주식회사 엔티에스 드레싱 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680893A (en) 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JP2628915B2 (ja) 1989-06-05 1997-07-09 三菱マテリアル株式会社 研磨布のドレッシング装置
US5154021A (en) 1991-06-26 1992-10-13 International Business Machines Corporation Pneumatic pad conditioner
JP2622069B2 (ja) 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
JP2647050B2 (ja) 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
JP3778594B2 (ja) 1995-07-18 2006-05-24 株式会社荏原製作所 ドレッシング方法
JP3678468B2 (ja) 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
JPH09309063A (ja) 1996-05-24 1997-12-02 Nippon Steel Corp 研磨定盤の洗浄方法およびその装置
KR100524510B1 (ko) 1996-06-25 2006-01-12 가부시키가이샤 에바라 세이사꾸쇼 연마포를드레싱하는방법과장치
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JP3615931B2 (ja) * 1998-03-26 2005-02-02 株式会社荏原製作所 ポリッシング装置および該ポリッシング装置におけるコンディショニング方法

Also Published As

Publication number Publication date
US6645053B1 (en) 2003-11-11
WO1999050024A1 (en) 1999-10-07
EP1066133A1 (de) 2001-01-10
US20040072512A1 (en) 2004-04-15
KR100525652B1 (ko) 2005-11-02
DE69902021T2 (de) 2003-03-06
KR20010042166A (ko) 2001-05-25
EP1066133B1 (de) 2002-07-03
JPH11277403A (ja) 1999-10-12
JP3615931B2 (ja) 2005-02-02

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