DE69817365D1 - Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer - Google Patents
Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwaferInfo
- Publication number
- DE69817365D1 DE69817365D1 DE69817365T DE69817365T DE69817365D1 DE 69817365 D1 DE69817365 D1 DE 69817365D1 DE 69817365 T DE69817365 T DE 69817365T DE 69817365 T DE69817365 T DE 69817365T DE 69817365 D1 DE69817365 D1 DE 69817365D1
- Authority
- DE
- Germany
- Prior art keywords
- oxygen
- diffusionless
- silicon wafer
- preparation process
- oxygen preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title 2
- 229910052760 oxygen Inorganic materials 0.000 title 2
- 239000001301 oxygen Substances 0.000 title 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000002360 preparation method Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/913—Active solid-state devices, e.g. transistors, solid-state diodes with means to absorb or localize unwanted impurities or defects from semiconductors, e.g. heavy metal gettering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/806,436 US5994761A (en) | 1997-02-26 | 1997-02-26 | Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor |
US806436 | 1997-02-26 | ||
PCT/US1998/003686 WO1998038675A1 (en) | 1997-02-26 | 1998-02-25 | Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69817365D1 true DE69817365D1 (de) | 2003-09-25 |
DE69817365T2 DE69817365T2 (de) | 2004-06-24 |
Family
ID=25194044
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1998617365 Expired - Lifetime DE69817365T2 (de) | 1997-02-26 | 1998-02-25 | Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer |
DE69840004T Expired - Lifetime DE69840004D1 (de) | 1997-02-26 | 1998-02-25 | Silizium-Halbleiterwafer mit idealem Sauerstoff-Ablagerungsverhalten |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69840004T Expired - Lifetime DE69840004D1 (de) | 1997-02-26 | 1998-02-25 | Silizium-Halbleiterwafer mit idealem Sauerstoff-Ablagerungsverhalten |
Country Status (9)
Country | Link |
---|---|
US (7) | US5994761A (de) |
EP (3) | EP1300879B1 (de) |
JP (1) | JP3288721B2 (de) |
KR (2) | KR100395391B1 (de) |
CN (1) | CN1158696C (de) |
DE (2) | DE69817365T2 (de) |
MY (1) | MY132868A (de) |
TW (1) | TW528815B (de) |
WO (1) | WO1998038675A1 (de) |
Families Citing this family (116)
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US6485807B1 (en) | 1997-02-13 | 2002-11-26 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects, and methods of preparing the same |
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US6379642B1 (en) * | 1997-04-09 | 2002-04-30 | Memc Electronic Materials, Inc. | Vacancy dominated, defect-free silicon |
CN1316072C (zh) | 1997-04-09 | 2007-05-16 | Memc电子材料有限公司 | 低缺陷密度、理想氧沉淀的硅 |
CN1280454C (zh) * | 1997-04-09 | 2006-10-18 | Memc电子材料有限公司 | 缺陷密度低,空位占优势的硅 |
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US6340392B1 (en) | 1997-10-24 | 2002-01-22 | Samsung Electronics Co., Ltd. | Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface |
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-
1998
- 1998-02-25 DE DE1998617365 patent/DE69817365T2/de not_active Expired - Lifetime
- 1998-02-25 TW TW87102740A patent/TW528815B/zh not_active IP Right Cessation
- 1998-02-25 KR KR10-1999-7007814A patent/KR100395391B1/ko not_active IP Right Cessation
- 1998-02-25 KR KR1020027009772A patent/KR20030097601A/ko not_active Application Discontinuation
- 1998-02-25 JP JP53781498A patent/JP3288721B2/ja not_active Expired - Lifetime
- 1998-02-25 EP EP20020027280 patent/EP1300879B1/de not_active Expired - Lifetime
- 1998-02-25 EP EP98906703A patent/EP1002335B1/de not_active Expired - Lifetime
- 1998-02-25 US US09/030,110 patent/US6180220B1/en not_active Expired - Lifetime
- 1998-02-25 WO PCT/US1998/003686 patent/WO1998038675A1/en active IP Right Grant
- 1998-02-25 CN CNB988036959A patent/CN1158696C/zh not_active Expired - Fee Related
- 1998-02-25 DE DE69840004T patent/DE69840004D1/de not_active Expired - Lifetime
- 1998-02-25 EP EP20080015848 patent/EP2028682A1/de not_active Withdrawn
- 1998-02-25 MY MYPI98000816A patent/MY132868A/en unknown
-
1999
- 1999-06-30 US US09/340,489 patent/US6204152B1/en not_active Expired - Lifetime
-
2000
- 2000-07-27 US US09/626,635 patent/US6306733B1/en not_active Expired - Lifetime
- 2000-11-02 US US09/704,893 patent/US6586068B1/en not_active Expired - Lifetime
-
2001
- 2001-08-13 US US09/928,739 patent/US6537368B2/en not_active Expired - Lifetime
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2003
- 2003-05-06 US US10/430,798 patent/US6849119B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1002335A1 (de) | 2000-05-24 |
US6586068B1 (en) | 2003-07-01 |
US6204152B1 (en) | 2001-03-20 |
DE69817365T2 (de) | 2004-06-24 |
US6849119B2 (en) | 2005-02-01 |
US6537368B2 (en) | 2003-03-25 |
JP2001509319A (ja) | 2001-07-10 |
KR20000075744A (ko) | 2000-12-26 |
EP1300879A2 (de) | 2003-04-09 |
TW528815B (en) | 2003-04-21 |
CN1158696C (zh) | 2004-07-21 |
MY132868A (en) | 2007-10-31 |
WO1998038675A1 (en) | 1998-09-03 |
US5994761A (en) | 1999-11-30 |
CN1251206A (zh) | 2000-04-19 |
KR20030097601A (ko) | 2003-12-31 |
US6306733B1 (en) | 2001-10-23 |
EP2028682A1 (de) | 2009-02-25 |
KR100395391B1 (ko) | 2003-08-25 |
EP1002335A4 (de) | 2000-05-24 |
US6180220B1 (en) | 2001-01-30 |
EP1300879B1 (de) | 2008-09-10 |
US20020026893A1 (en) | 2002-03-07 |
EP1300879A3 (de) | 2005-03-16 |
EP1002335B1 (de) | 2003-08-20 |
DE69840004D1 (de) | 2008-10-23 |
JP3288721B2 (ja) | 2002-06-04 |
US20030196586A1 (en) | 2003-10-23 |
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