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DE69817365D1 - Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer - Google Patents

Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer

Info

Publication number
DE69817365D1
DE69817365D1 DE69817365T DE69817365T DE69817365D1 DE 69817365 D1 DE69817365 D1 DE 69817365D1 DE 69817365 T DE69817365 T DE 69817365T DE 69817365 T DE69817365 T DE 69817365T DE 69817365 D1 DE69817365 D1 DE 69817365D1
Authority
DE
Germany
Prior art keywords
oxygen
diffusionless
silicon wafer
preparation process
oxygen preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69817365T
Other languages
English (en)
Other versions
DE69817365T2 (de
Inventor
Robert Falster
Marco Cornara
Daniela Gambaro
Massimiliano Olmo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25194044&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69817365(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SunEdison Inc filed Critical SunEdison Inc
Application granted granted Critical
Publication of DE69817365D1 publication Critical patent/DE69817365D1/de
Publication of DE69817365T2 publication Critical patent/DE69817365T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/913Active solid-state devices, e.g. transistors, solid-state diodes with means to absorb or localize unwanted impurities or defects from semiconductors, e.g. heavy metal gettering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/21Circular sheet or circular blank
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967Inorganic matrix in void-containing component
    • Y10T428/249969Of silicon-containing material [e.g., glass, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE1998617365 1997-02-26 1998-02-25 Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer Expired - Lifetime DE69817365T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/806,436 US5994761A (en) 1997-02-26 1997-02-26 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
US806436 1997-02-26
PCT/US1998/003686 WO1998038675A1 (en) 1997-02-26 1998-02-25 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor

Publications (2)

Publication Number Publication Date
DE69817365D1 true DE69817365D1 (de) 2003-09-25
DE69817365T2 DE69817365T2 (de) 2004-06-24

Family

ID=25194044

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1998617365 Expired - Lifetime DE69817365T2 (de) 1997-02-26 1998-02-25 Sauerstoffausdiffusionsloses sauerstoff-ausfällungsverfahren in siliziumwafer
DE69840004T Expired - Lifetime DE69840004D1 (de) 1997-02-26 1998-02-25 Silizium-Halbleiterwafer mit idealem Sauerstoff-Ablagerungsverhalten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69840004T Expired - Lifetime DE69840004D1 (de) 1997-02-26 1998-02-25 Silizium-Halbleiterwafer mit idealem Sauerstoff-Ablagerungsverhalten

Country Status (9)

Country Link
US (7) US5994761A (de)
EP (3) EP1300879B1 (de)
JP (1) JP3288721B2 (de)
KR (2) KR100395391B1 (de)
CN (1) CN1158696C (de)
DE (2) DE69817365T2 (de)
MY (1) MY132868A (de)
TW (1) TW528815B (de)
WO (1) WO1998038675A1 (de)

Families Citing this family (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
US6485807B1 (en) 1997-02-13 2002-11-26 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects, and methods of preparing the same
SG64470A1 (en) 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby
US5994761A (en) 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
US6379642B1 (en) * 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
CN1316072C (zh) 1997-04-09 2007-05-16 Memc电子材料有限公司 低缺陷密度、理想氧沉淀的硅
CN1280454C (zh) * 1997-04-09 2006-10-18 Memc电子材料有限公司 缺陷密度低,空位占优势的硅
JPH10303208A (ja) * 1997-04-30 1998-11-13 Toshiba Corp 半導体基板およびその製造方法
US6340392B1 (en) 1997-10-24 2002-01-22 Samsung Electronics Co., Ltd. Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface
JPH11150119A (ja) * 1997-11-14 1999-06-02 Sumitomo Sitix Corp シリコン半導体基板の熱処理方法とその装置
JP4688984B2 (ja) * 1997-12-26 2011-05-25 株式会社Sumco シリコンウエーハ及び結晶育成方法
US6828690B1 (en) * 1998-08-05 2004-12-07 Memc Electronic Materials, Inc. Non-uniform minority carrier lifetime distributions in high performance silicon power devices
KR20010031444A (ko) * 1998-08-31 2001-04-16 와다 다다시 실리콘 단결정 웨이퍼의 제조방법 및 실리콘 단결정 웨이퍼
JP4405082B2 (ja) * 1998-09-02 2010-01-27 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 内部ゲッタリング性の改良された熱アニーリングされたウエハ
EP1914796B1 (de) * 1998-09-02 2012-06-06 MEMC Electronic Materials, Inc. Verfahren zur Herstellung eines Czochralski-Siliziumwafers ohne Sauerstoffniederschlag
KR100581305B1 (ko) 1998-09-02 2006-05-22 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 저결함 밀도 단결정 실리콘으로부터의 soi 구조체
DE69933777T2 (de) 1998-09-02 2007-09-13 Memc Electronic Materials, Inc. Verfahren zur herstellung von einem silizium wafer mit idealem sauerstoffausfällungsverhalten
US6336968B1 (en) * 1998-09-02 2002-01-08 Memc Electronic Materials, Inc. Non-oxygen precipitating czochralski silicon wafers
EP1624482B1 (de) * 1998-09-02 2009-07-29 MEMC Electronic Materials, Inc. Wärmebehandelte Siliziumscheiben mit verbesserter Eigengetterung
CN1296526C (zh) * 1998-10-14 2007-01-24 Memc电子材料有限公司 热退火后的低缺陷密度单晶硅
US6284384B1 (en) * 1998-12-09 2001-09-04 Memc Electronic Materials, Inc. Epitaxial silicon wafer with intrinsic gettering
DE19924649B4 (de) * 1999-05-28 2004-08-05 Siltronic Ag Halbleiterscheiben mit Kristallgitter-Defekten und Verfahren zur Herstellung derselben
DE19925044B4 (de) * 1999-05-28 2005-07-21 Siltronic Ag Halbleiterscheibe mit Kristallgitter-Defekten und Verfahren zur Herstellung derselben
US20030051656A1 (en) 1999-06-14 2003-03-20 Charles Chiun-Chieh Yang Method for the preparation of an epitaxial silicon wafer with intrinsic gettering
JP2001144275A (ja) * 1999-08-27 2001-05-25 Shin Etsu Handotai Co Ltd 貼り合わせsoiウエーハの製造方法および貼り合わせsoiウエーハ
US6458202B1 (en) 1999-09-02 2002-10-01 Memc Electronic Materials, Inc. Process for preparing single crystal silicon having uniform thermal history
JP2003510235A (ja) * 1999-09-23 2003-03-18 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 冷却速度を制御することにより単結晶シリコンを成長させるチョクラルスキー法
US6635587B1 (en) 1999-09-23 2003-10-21 Memc Electronic Materials, Inc. Method for producing czochralski silicon free of agglomerated self-interstitial defects
DE19952705A1 (de) * 1999-11-02 2001-05-10 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit einer epitaktischen Schicht
KR100378184B1 (ko) * 1999-11-13 2003-03-29 삼성전자주식회사 제어된 결함 분포를 갖는 실리콘 웨이퍼, 그의 제조공정및 단결정 실리콘 잉곳의 제조를 위한 초크랄스키 풀러
US6376395B2 (en) 2000-01-11 2002-04-23 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
US6599815B1 (en) 2000-06-30 2003-07-29 Memc Electronic Materials, Inc. Method and apparatus for forming a silicon wafer with a denuded zone
US6339016B1 (en) 2000-06-30 2002-01-15 Memc Electronic Materials, Inc. Method and apparatus for forming an epitaxial silicon wafer with a denuded zone
US7160385B2 (en) * 2003-02-20 2007-01-09 Sumitomo Mitsubishi Silicon Corporation Silicon wafer and method for manufacturing the same
JP4055343B2 (ja) * 2000-09-26 2008-03-05 株式会社Sumco シリコン半導体基板の熱処理方法
JP2002110685A (ja) * 2000-09-27 2002-04-12 Shin Etsu Handotai Co Ltd シリコンウェーハの熱処理方法
JP4106862B2 (ja) * 2000-10-25 2008-06-25 信越半導体株式会社 シリコンウェーハの製造方法
US20110263126A1 (en) 2000-11-22 2011-10-27 Sumco Corporation Method for manufacturing a silicon wafer
JP5045710B2 (ja) * 2000-11-28 2012-10-10 株式会社Sumco シリコンウェーハの製造方法
JP4720058B2 (ja) 2000-11-28 2011-07-13 株式会社Sumco シリコンウェーハの製造方法
EP1346086A2 (de) * 2000-11-30 2003-09-24 MEMC Electronic Materials, Inc. Verfahren zur steuerung der thermischen geschichte von leerstellendominiertem einkristallinem silicium
US7081422B2 (en) * 2000-12-13 2006-07-25 Shin-Etsu Handotai Co., Ltd. Manufacturing process for annealed wafer and annealed wafer
JP2002184779A (ja) * 2000-12-13 2002-06-28 Shin Etsu Handotai Co Ltd アニールウェーハの製造方法及びアニールウェーハ
US20020127766A1 (en) * 2000-12-27 2002-09-12 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
DE60210264T2 (de) 2001-01-02 2006-08-24 Memc Electronic Materials, Inc. Verfahren zur herstellung von silizium einkristall mit verbesserter gate-oxid integrität
DE60213759T2 (de) * 2001-01-26 2006-11-30 Memc Electronic Materials, Inc. Silizium mit niedriger defektdichte und mit leerstellendominiertem kern, das im wesentlichen frei von oxidationsinduzierten stapelfehlern ist
WO2002084728A1 (en) * 2001-04-11 2002-10-24 Memc Electronic Materials, Inc. Control of thermal donor formation in high resistivity cz silicon
TW541581B (en) * 2001-04-20 2003-07-11 Memc Electronic Materials Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitates
JP2002334848A (ja) * 2001-05-09 2002-11-22 Sumitomo Mitsubishi Silicon Corp シリコンウェーハの熱処理装置
KR20040037031A (ko) * 2001-06-22 2004-05-04 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 이온 주입에 의한 고유 게터링을 갖는 실리콘 온인슐레이터 구조 제조 방법
EP1983562A2 (de) * 2001-07-10 2008-10-22 Shin-Etsu Handotai Company Limited Herstellungsverfahren eines Silizium-Wafers
JP2003059932A (ja) * 2001-08-08 2003-02-28 Toshiba Ceramics Co Ltd シリコン単結晶ウエハの製造方法およびシリコン単結晶ウエハ
JP4566478B2 (ja) * 2001-08-09 2010-10-20 シルトロニック・ジャパン株式会社 シリコン半導体基板およびその製造方法
JP2003077924A (ja) * 2001-08-30 2003-03-14 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの製造方法及び半導体ウェーハ
JP2003077925A (ja) * 2001-08-31 2003-03-14 Sumitomo Mitsubishi Silicon Corp シリコンウェーハの製造方法及びシリコンウェーハ
JP4345253B2 (ja) * 2001-09-25 2009-10-14 株式会社Sumco エピタキシャルウェーハの製造方法及びエピタキシャルウェーハ
JP4078822B2 (ja) * 2001-10-10 2008-04-23 株式会社Sumco シリコンウェーハの製造方法
KR20030030712A (ko) * 2001-10-12 2003-04-18 주식회사 실트론 게터링 수단을 가진 단결정 실리콘 웨이퍼 및 그제조방법
KR20030035152A (ko) 2001-10-30 2003-05-09 주식회사 하이닉스반도체 반도체웨이퍼 제조방법
KR100423752B1 (ko) 2001-11-12 2004-03-22 주식회사 실트론 실리콘 반도체 웨이퍼 및 그 제조 방법
JP2005515633A (ja) * 2001-12-21 2005-05-26 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 窒素/炭素安定化された酸素析出核形成中心を有する理想的酸素析出を行ったシリコンウエハおよびその製造方法
US6808781B2 (en) * 2001-12-21 2004-10-26 Memc Electronic Materials, Inc. Silicon wafers with stabilized oxygen precipitate nucleation centers and process for making the same
US7201800B2 (en) * 2001-12-21 2007-04-10 Memc Electronic Materials, Inc. Process for making silicon wafers with stabilized oxygen precipitate nucleation centers
DE10205084B4 (de) 2002-02-07 2008-10-16 Siltronic Ag Verfahren zur thermischen Behandlung einer Siliciumscheibe sowie dadurch hergestellte Siliciumscheibe
JP2003257984A (ja) * 2002-03-05 2003-09-12 Sumitomo Mitsubishi Silicon Corp シリコンウェーハ及びその製造方法
CN1324664C (zh) * 2002-04-10 2007-07-04 Memc电子材料有限公司 用于控制理想氧沉淀硅片中洁净区深度的方法
JP4764007B2 (ja) * 2002-11-12 2011-08-31 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド ルツボの回転を利用して温度勾配を制御し単結晶シリコンを製造する方法
JP2004172391A (ja) 2002-11-20 2004-06-17 Sumitomo Mitsubishi Silicon Corp シリコンウェーハおよびその製造方法
JP4660068B2 (ja) * 2003-01-20 2011-03-30 株式会社東芝 シリコン単結晶基板
US6916324B2 (en) * 2003-02-04 2005-07-12 Zimmer Technology, Inc. Provisional orthopedic prosthesis for partially resected bone
US7112509B2 (en) * 2003-05-09 2006-09-26 Ibis Technology Corporation Method of producing a high resistivity SIMOX silicon substrate
US6955718B2 (en) 2003-07-08 2005-10-18 Memc Electronic Materials, Inc. Process for preparing a stabilized ideal oxygen precipitating silicon wafer
DE10336271B4 (de) * 2003-08-07 2008-02-07 Siltronic Ag Siliciumscheibe und Verfahren zu deren Herstellung
KR100531552B1 (ko) * 2003-09-05 2005-11-28 주식회사 하이닉스반도체 실리콘 웨이퍼 및 그 제조방법
US7473656B2 (en) * 2003-10-23 2009-01-06 International Business Machines Corporation Method for fast and local anneal of anti-ferromagnetic (AF) exchange-biased magnetic stacks
US7749865B2 (en) * 2004-02-03 2010-07-06 Shin-Etsu Handotai Co., Ltd. Method for producing semiconductor wafers and a system for determining a cut position in a semiconductor ingot
KR100573473B1 (ko) * 2004-05-10 2006-04-24 주식회사 실트론 실리콘 웨이퍼 및 그 제조방법
JP4617751B2 (ja) * 2004-07-22 2011-01-26 株式会社Sumco シリコンウェーハおよびその製造方法
CN100338270C (zh) * 2004-11-05 2007-09-19 北京有色金属研究总院 一种单晶硅抛光片热处理工艺
JP4720164B2 (ja) * 2004-12-02 2011-07-13 株式会社Sumco Soiウェーハの製造方法
US20060138601A1 (en) * 2004-12-27 2006-06-29 Memc Electronic Materials, Inc. Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers
JP2008545605A (ja) * 2005-05-19 2008-12-18 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 高抵抗率シリコン構造体およびその製造方法
US7485928B2 (en) * 2005-11-09 2009-02-03 Memc Electronic Materials, Inc. Arsenic and phosphorus doped silicon wafer substrates having intrinsic gettering
DE102006002903A1 (de) * 2006-01-20 2007-08-02 Infineon Technologies Austria Ag Verfahren zur Behandlung eines Sauerstoff enthaltenden Halbleiterwafers und Halbleiterbauelement
WO2007085387A1 (de) 2006-01-20 2007-08-02 Infineon Technologies Austria Ag Verfahren zur behandlung eines sauerstoff enthaltenden halbleiterwafers und halbleiterbauelement
US7566951B2 (en) * 2006-04-21 2009-07-28 Memc Electronic Materials, Inc. Silicon structures with improved resistance to radiation events
JP5138678B2 (ja) 2006-05-19 2013-02-06 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド Cz成長中のシリコン単結晶側表面から誘起される凝集点欠陥および酸素クラスターの形成制御
JP5239155B2 (ja) * 2006-06-20 2013-07-17 信越半導体株式会社 シリコンウエーハの製造方法
JP2008053521A (ja) * 2006-08-25 2008-03-06 Sumco Techxiv株式会社 シリコンウェーハの熱処理方法
KR101313326B1 (ko) * 2006-12-29 2013-09-27 에스케이하이닉스 주식회사 후속 열처리에 의해 산소 침전물로 되는 유핵의 분포가제어된 실리콘 웨이퍼 및 그 제조방법
US20090004426A1 (en) * 2007-06-29 2009-01-01 Memc Electronic Materials, Inc. Suppression of Oxygen Precipitation in Heavily Doped Single Crystal Silicon Substrates
US20090004458A1 (en) * 2007-06-29 2009-01-01 Memc Electronic Materials, Inc. Diffusion Control in Heavily Doped Substrates
DE102008027521B4 (de) * 2008-06-10 2017-07-27 Infineon Technologies Austria Ag Verfahren zum Herstellen einer Halbleiterschicht
US8476149B2 (en) * 2008-07-31 2013-07-02 Global Wafers Japan Co., Ltd. Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process
KR20100036155A (ko) * 2008-09-29 2010-04-07 매그나칩 반도체 유한회사 실리콘 웨이퍼 및 그의 제조방법
US7977216B2 (en) * 2008-09-29 2011-07-12 Magnachip Semiconductor, Ltd. Silicon wafer and fabrication method thereof
JP2009177194A (ja) * 2009-03-19 2009-08-06 Sumco Corp シリコンウェーハの製造方法、シリコンウェーハ
JP5455449B2 (ja) * 2009-06-03 2014-03-26 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの熱処理方法
JP2009218620A (ja) * 2009-06-23 2009-09-24 Sumco Corp シリコンウェーハの製造方法
KR101275418B1 (ko) * 2010-03-16 2013-06-14 주식회사 엘지실트론 단결정 잉곳 제조방법 및 이에 의해 제조된 웨이퍼
JP5550180B2 (ja) * 2010-06-30 2014-07-16 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ及びその製造方法
JP5912368B2 (ja) 2011-03-22 2016-04-27 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの熱処理方法及びシリコンウェーハ
CN102168314B (zh) * 2011-03-23 2012-05-30 浙江大学 直拉硅片的内吸杂工艺
CN102605433A (zh) * 2012-01-09 2012-07-25 浙江大学 一种消除掺氮直拉单晶硅片中原生氧沉淀的方法
JP2013163598A (ja) * 2012-01-10 2013-08-22 Globalwafers Japan Co Ltd シリコンウェーハの製造方法
DE102012217727A1 (de) * 2012-09-28 2014-04-17 Siltronic Ag Verfahren zum Nachweis von Defekten in einkristallinem Silicium
JP2016504759A (ja) * 2012-11-19 2016-02-12 サンエディソン・セミコンダクター・リミテッドSunEdison Semiconductor Limited 熱処理により不活性な酸素析出核を活性化する高析出密度ウエハの製造
FR3009380B1 (fr) * 2013-08-02 2015-07-31 Commissariat Energie Atomique Procede de localisation d'une plaquette dans son lingot
JP5885305B2 (ja) 2013-08-07 2016-03-15 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ及びその製造方法
JP6131842B2 (ja) * 2013-11-26 2017-05-24 株式会社Sumco エピタキシャルシリコンウェーハの製造方法
JP6241381B2 (ja) * 2014-07-09 2017-12-06 株式会社Sumco エピタキシャルシリコンウェーハの製造方法
CN105316767B (zh) * 2015-06-04 2019-09-24 上海超硅半导体有限公司 超大规模集成电路用硅片及其制造方法、应用
DE102016225138A1 (de) * 2016-12-15 2018-06-21 Siltronic Ag Halbleiterscheibe aus einkristallinem Silizium und Verfahren zur Herstellung einer Halbleiterscheibe aus einkristallinem Silizium
KR102453743B1 (ko) 2016-12-28 2022-10-11 썬에디슨 세미컨덕터 리미티드 고유 게터링 및 게이트 산화물 무결성 수율을 갖도록 규소 웨이퍼들을 처리하는 방법
DE102017219255A1 (de) * 2017-10-26 2019-05-02 Siltronic Ag Halbleiterscheibe aus einkristallinem Silizium
CN109346433B (zh) 2018-09-26 2020-10-23 上海新傲科技股份有限公司 半导体衬底的键合方法以及键合后的半导体衬底

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583375B2 (ja) * 1979-01-19 1983-01-21 超エル・エス・アイ技術研究組合 シリコン単結晶ウエハ−の製造方法
JPS5680139A (en) * 1979-12-05 1981-07-01 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
US4437922A (en) 1982-03-26 1984-03-20 International Business Machines Corporation Method for tailoring oxygen precipitate particle density and distribution silicon wafers
US4548654A (en) 1983-06-03 1985-10-22 Motorola, Inc. Surface denuding of silicon wafer
US4505759A (en) * 1983-12-19 1985-03-19 Mara William C O Method for making a conductive silicon substrate by heat treatment of oxygenated and lightly doped silicon single crystals
US4666532A (en) * 1984-05-04 1987-05-19 Monsanto Company Denuding silicon substrates with oxygen and halogen
US4868133A (en) 1988-02-11 1989-09-19 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using RTA
US4851358A (en) 1988-02-11 1989-07-25 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using rapid thermal annealing
JPH01242500A (ja) 1988-03-25 1989-09-27 Mitsubishi Metal Corp シリコン基板の製造方法
JPH0232535A (ja) * 1988-07-21 1990-02-02 Kyushu Electron Metal Co Ltd 半導体デバイス用シリコン基板の製造方法
JPH039078A (ja) 1989-06-05 1991-01-16 Komatsu Ltd 斜板式ピストンモータ
JPH03185831A (ja) 1989-12-15 1991-08-13 Komatsu Denshi Kinzoku Kk 半導体装置の製造方法
IT1242014B (it) * 1990-11-15 1994-02-02 Memc Electronic Materials Procedimento per il trattamento di fette di silicio per ottenere in esse profili di precipitazione controllati per la produzione di componenti elettronici.
JP2613498B2 (ja) 1991-03-15 1997-05-28 信越半導体株式会社 Si単結晶ウエーハの熱処理方法
JPH04294540A (ja) 1991-03-25 1992-10-19 Nippon Steel Corp 半導体の製造方法
JP2758093B2 (ja) * 1991-10-07 1998-05-25 信越半導体株式会社 半導体ウェーハの製造方法
JP2726583B2 (ja) * 1991-11-18 1998-03-11 三菱マテリアルシリコン株式会社 半導体基板
JPH05155700A (ja) 1991-12-04 1993-06-22 Nippon Steel Corp 積層欠陥発生核を有するゲッタリングウエハの製造方法および同方法により製造されたシリコンウエハ
JP3009078B2 (ja) 1992-01-06 2000-02-14 オムロン株式会社 文字認識装置
US5296047A (en) 1992-01-28 1994-03-22 Hewlett-Packard Co. Epitaxial silicon starting material
JPH0684925A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体基板およびその処理方法
KR0139730B1 (ko) * 1993-02-23 1998-06-01 사또오 후미오 반도체 기판 및 그 제조방법
US5401669A (en) * 1993-05-13 1995-03-28 Memc Electronic Materials, Spa Process for the preparation of silicon wafers having controlled distribution of oxygen precipitate nucleation centers
JPH0786289A (ja) * 1993-07-22 1995-03-31 Toshiba Corp 半導体シリコンウェハおよびその製造方法
JP2725586B2 (ja) 1993-12-30 1998-03-11 日本電気株式会社 シリコン基板の製造方法
US5445975A (en) * 1994-03-07 1995-08-29 Advanced Micro Devices, Inc. Semiconductor wafer with enhanced pre-process denudation and process-induced gettering
JP2895743B2 (ja) * 1994-03-25 1999-05-24 信越半導体株式会社 Soi基板の製造方法
US5548654A (en) * 1994-04-07 1996-08-20 Fast; Lawrence R. Infrared audio transmitter system
JPH07321120A (ja) * 1994-05-25 1995-12-08 Komatsu Electron Metals Co Ltd シリコンウェーハの熱処理方法
JP3458342B2 (ja) * 1994-06-03 2003-10-20 コマツ電子金属株式会社 シリコンウェーハの製造方法およびシリコンウェーハ
JP2874834B2 (ja) * 1994-07-29 1999-03-24 三菱マテリアル株式会社 シリコンウェーハのイントリンシックゲッタリング処理法
JPH0845944A (ja) * 1994-07-29 1996-02-16 Sumitomo Sitix Corp シリコンウェーハの製造方法
JPH0845947A (ja) 1994-08-03 1996-02-16 Nippon Steel Corp シリコン基板の熱処理方法
JP3285111B2 (ja) * 1994-12-05 2002-05-27 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶の製造方法
US5611855A (en) * 1995-01-31 1997-03-18 Seh America, Inc. Method for manufacturing a calibration wafer having a microdefect-free layer of a precisely predetermined depth
US5788763A (en) * 1995-03-09 1998-08-04 Toshiba Ceramics Co., Ltd. Manufacturing method of a silicon wafer having a controlled BMD concentration
US5593494A (en) * 1995-03-14 1997-01-14 Memc Electronic Materials, Inc. Precision controlled precipitation of oxygen in silicon
JP3085146B2 (ja) 1995-05-31 2000-09-04 住友金属工業株式会社 シリコン単結晶ウェーハおよびその製造方法
JP3381816B2 (ja) 1996-01-17 2003-03-04 三菱住友シリコン株式会社 半導体基板の製造方法
KR100240023B1 (ko) 1996-11-29 2000-01-15 윤종용 반도체 웨이퍼 열처리방법 및 이에 따라 형성된 반도체 웨이퍼
WO1998025299A1 (fr) 1996-12-03 1998-06-11 Sumitomo Metal Industries., Ltd. Procede de fabrication d'une tranche epitaxiee semi-conductrice de silicium et d'un dispositif semi-conducteur
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
US5994761A (en) 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
US5954761A (en) * 1997-03-25 1999-09-21 Intermedics Inc. Implantable endocardial lead assembly having a stent
CN1280454C (zh) * 1997-04-09 2006-10-18 Memc电子材料有限公司 缺陷密度低,空位占优势的硅
CN1316072C (zh) 1997-04-09 2007-05-16 Memc电子材料有限公司 低缺陷密度、理想氧沉淀的硅
JP3144631B2 (ja) 1997-08-08 2001-03-12 住友金属工業株式会社 シリコン半導体基板の熱処理方法
TW429478B (en) 1997-08-29 2001-04-11 Toshiba Corp Semiconductor device and method for manufacturing the same
JP3346249B2 (ja) 1997-10-30 2002-11-18 信越半導体株式会社 シリコンウエーハの熱処理方法及びシリコンウエーハ
JPH11150119A (ja) 1997-11-14 1999-06-02 Sumitomo Sitix Corp シリコン半導体基板の熱処理方法とその装置
JPH11354525A (ja) 1998-06-11 1999-12-24 Shin Etsu Handotai Co Ltd シリコンエピタキシャルウェーハの製造方法
JP4405082B2 (ja) * 1998-09-02 2010-01-27 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 内部ゲッタリング性の改良された熱アニーリングされたウエハ
DE69933777T2 (de) * 1998-09-02 2007-09-13 Memc Electronic Materials, Inc. Verfahren zur herstellung von einem silizium wafer mit idealem sauerstoffausfällungsverhalten
US6336968B1 (en) * 1998-09-02 2002-01-08 Memc Electronic Materials, Inc. Non-oxygen precipitating czochralski silicon wafers
CN1324664C (zh) * 2002-04-10 2007-07-04 Memc电子材料有限公司 用于控制理想氧沉淀硅片中洁净区深度的方法

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