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DE69737926D1 - Reinigungsvorrichtung - Google Patents

Reinigungsvorrichtung

Info

Publication number
DE69737926D1
DE69737926D1 DE69737926T DE69737926T DE69737926D1 DE 69737926 D1 DE69737926 D1 DE 69737926D1 DE 69737926 T DE69737926 T DE 69737926T DE 69737926 T DE69737926 T DE 69737926T DE 69737926 D1 DE69737926 D1 DE 69737926D1
Authority
DE
Germany
Prior art keywords
cleaning device
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69737926T
Other languages
English (en)
Other versions
DE69737926T2 (de
Inventor
Satomi Hamada
Toshiro Maekawa
Toshiya Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE69737926D1 publication Critical patent/DE69737926D1/de
Application granted granted Critical
Publication of DE69737926T2 publication Critical patent/DE69737926T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69737926T 1996-10-21 1997-10-20 Reinigungsvorrichtung Expired - Lifetime DE69737926T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29775196 1996-10-21
JP29775196 1996-10-21

Publications (2)

Publication Number Publication Date
DE69737926D1 true DE69737926D1 (de) 2007-08-30
DE69737926T2 DE69737926T2 (de) 2008-04-10

Family

ID=17850712

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69737926T Expired - Lifetime DE69737926T2 (de) 1996-10-21 1997-10-20 Reinigungsvorrichtung

Country Status (4)

Country Link
US (1) US5966765A (de)
EP (1) EP0837493B8 (de)
KR (1) KR100488437B1 (de)
DE (1) DE69737926T2 (de)

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DE19914347C2 (de) * 1998-03-30 2003-11-06 Tokyo Electron Ltd Waschvorrichtung und Waschverfahren
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KR20010037210A (ko) * 1999-10-14 2001-05-07 구본준, 론 위라하디락사 기판 세정 장치 및 기판 세정 방법
JP4007766B2 (ja) * 2000-02-29 2007-11-14 東京エレクトロン株式会社 液処理装置および液処理方法
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
US6599815B1 (en) 2000-06-30 2003-07-29 Memc Electronic Materials, Inc. Method and apparatus for forming a silicon wafer with a denuded zone
JP2002052370A (ja) 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
US6409051B1 (en) * 2000-09-28 2002-06-25 Lam Research Corporation Method and apparatus for dispensing a fluid media
KR100672631B1 (ko) * 2001-09-19 2007-01-23 엘지.필립스 엘시디 주식회사 액정패널 제작용 세정장치
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
JP4421611B2 (ja) * 2003-08-07 2010-02-24 株式会社荏原製作所 基板処理装置
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP4802106B2 (ja) 2004-01-29 2011-10-26 アプライド マテリアルズ インコーポレイテッド マンドレルにスクラバブラシを装着するための方法及び装置
US20080173335A1 (en) * 2005-04-11 2008-07-24 Doosan Mecatec Co., Ltd Semiconductor Wafer Cleaning System
WO2007103399A2 (en) 2006-03-07 2007-09-13 Applied Materials, Inc. Scrubber brush with sleeve and brush mandrel
US7938130B2 (en) * 2006-03-31 2011-05-10 Ebara Corporation Substrate holding rotating mechanism, and substrate processing apparatus
TW200809936A (en) * 2006-06-05 2008-02-16 Applied Materials Inc Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
KR100829923B1 (ko) * 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
US7823241B2 (en) * 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
USD622920S1 (en) 2007-05-02 2010-08-31 Entegris Corporation Cleaning sponge roller
TWD147969S (zh) * 2011-04-20 2012-07-01 荏原製作所股份有限公司 半導體晶圓洗淨用滾子
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
US9939529B2 (en) 2012-08-27 2018-04-10 Aktiebolaget Electrolux Robot positioning system
EP2986192B1 (de) 2013-04-15 2021-03-31 Aktiebolaget Electrolux Robotischer staubsauger
CN110710920B (zh) 2013-04-15 2021-12-14 伊莱克斯公司 具有伸出的侧刷的机器人真空吸尘器
WO2015090398A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Robotic vacuum cleaner with side brush moving in spiral pattern
JP6750921B2 (ja) 2013-12-19 2020-09-02 アクチエボラゲット エレクトロルックス ロボット掃除機
CN105813526B (zh) 2013-12-19 2021-08-24 伊莱克斯公司 机器人清扫装置以及用于地标识别的方法
US10433697B2 (en) 2013-12-19 2019-10-08 Aktiebolaget Electrolux Adaptive speed control of rotating side brush
JP6494118B2 (ja) 2013-12-19 2019-04-03 アクチエボラゲット エレクトロルックス 障害物の乗り上げの検出に伴うロボット掃除機の制御方法、並びに、当該方法を有するロボット掃除機、プログラム、及びコンピュータ製品
EP3084539B1 (de) 2013-12-19 2019-02-20 Aktiebolaget Electrolux Priorisierung von reinigungsbereichen
JP6455737B2 (ja) 2013-12-19 2019-01-23 アクチエボラゲット エレクトロルックス 方法、ロボット掃除機、コンピュータプログラムおよびコンピュータプログラム製品
WO2015090439A1 (en) 2013-12-20 2015-06-25 Aktiebolaget Electrolux Dust container
JP6312534B2 (ja) * 2014-06-10 2018-04-18 株式会社荏原製作所 基板洗浄装置
WO2016005012A1 (en) 2014-07-10 2016-01-14 Aktiebolaget Electrolux Method for detecting a measurement error in a robotic cleaning device
US10499778B2 (en) 2014-09-08 2019-12-10 Aktiebolaget Electrolux Robotic vacuum cleaner
CN106659344B (zh) 2014-09-08 2019-10-25 伊莱克斯公司 机器人真空吸尘器
JP6316730B2 (ja) * 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
WO2016091291A1 (en) 2014-12-10 2016-06-16 Aktiebolaget Electrolux Using laser sensor for floor type detection
US10874271B2 (en) 2014-12-12 2020-12-29 Aktiebolaget Electrolux Side brush and robotic cleaner
WO2016095966A1 (en) 2014-12-16 2016-06-23 Aktiebolaget Electrolux Cleaning method for a robotic cleaning device
US10534367B2 (en) 2014-12-16 2020-01-14 Aktiebolaget Electrolux Experience-based roadmap for a robotic cleaning device
KR102343513B1 (ko) 2015-04-17 2021-12-28 에이비 엘렉트로룩스 로봇 청소 장치 및 로봇 청소 장치의 제어 방법
US10874274B2 (en) 2015-09-03 2020-12-29 Aktiebolaget Electrolux System of robotic cleaning devices
JP1556809S (de) * 2015-09-24 2016-08-22
USD800401S1 (en) * 2015-09-24 2017-10-17 Ebara Corporation Roller for substrate cleaning
WO2017157421A1 (en) 2016-03-15 2017-09-21 Aktiebolaget Electrolux Robotic cleaning device and a method at the robotic cleaning device of performing cliff detection
EP3454707B1 (de) 2016-05-11 2020-07-08 Aktiebolaget Electrolux Reinigungsroboter
CN110621208A (zh) 2017-06-02 2019-12-27 伊莱克斯公司 检测机器人清洁设备前方的表面的高度差的方法
EP3687357B1 (de) 2017-09-26 2024-07-10 Aktiebolaget Electrolux Steuerung der bewegung eines roboterstaubsaugers
KR102236398B1 (ko) 2020-09-22 2021-04-02 에스케이씨 주식회사 웨이퍼의 세정방법 및 불순물이 저감된 웨이퍼
CN112974324B (zh) * 2021-03-01 2022-04-12 长江存储科技有限责任公司 晶圆清洗刷及晶圆清洗装置
CN115228797B (zh) * 2022-06-21 2023-07-14 佛山科学技术学院 一种具有清扫功能的智能机械臂

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JPS60143634A (ja) * 1983-12-29 1985-07-29 Fujitsu Ltd ウエ−ハ処理方法及び装置
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
JPH02197126A (ja) * 1989-01-26 1990-08-03 Nec Kyushu Ltd 枚葉式半導体基板両面洗浄装置
JPH0453684A (ja) * 1990-06-15 1992-02-21 Atlas:Kk ウエハ支持装置
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
US5317778A (en) * 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
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JP3118142B2 (ja) * 1994-06-03 2000-12-18 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
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JPH08238463A (ja) * 1995-03-03 1996-09-17 Ebara Corp 洗浄方法及び洗浄装置
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US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device

Also Published As

Publication number Publication date
KR100488437B1 (ko) 2005-08-25
EP0837493A2 (de) 1998-04-22
DE69737926T2 (de) 2008-04-10
EP0837493B8 (de) 2007-11-07
EP0837493B1 (de) 2007-07-18
US5966765A (en) 1999-10-19
KR19980033003A (ko) 1998-07-25
EP0837493A3 (de) 1998-08-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition