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DE69734860D1 - Herstellungsverfahren von integrierten Dünnfilm-Solarzellen - Google Patents

Herstellungsverfahren von integrierten Dünnfilm-Solarzellen

Info

Publication number
DE69734860D1
DE69734860D1 DE69734860T DE69734860T DE69734860D1 DE 69734860 D1 DE69734860 D1 DE 69734860D1 DE 69734860 T DE69734860 T DE 69734860T DE 69734860 T DE69734860 T DE 69734860T DE 69734860 D1 DE69734860 D1 DE 69734860D1
Authority
DE
Germany
Prior art keywords
manufacturing process
solar cells
film solar
integrated thin
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69734860T
Other languages
English (en)
Other versions
DE69734860T2 (de
Inventor
Susumu Kidoguchi
Akimasa Umemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69734860D1 publication Critical patent/DE69734860D1/de
Application granted granted Critical
Publication of DE69734860T2 publication Critical patent/DE69734860T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H10F77/48—Back surface reflectors [BSR]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
DE69734860T 1996-08-26 1997-08-26 Herstellungsverfahren von integrierten Dünnfilm-Solarzellen Expired - Fee Related DE69734860T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22347296 1996-08-26
JP22347296A JP3510740B2 (ja) 1996-08-26 1996-08-26 集積型薄膜太陽電池の製造方法

Publications (2)

Publication Number Publication Date
DE69734860D1 true DE69734860D1 (de) 2006-01-19
DE69734860T2 DE69734860T2 (de) 2006-08-17

Family

ID=16798681

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734860T Expired - Fee Related DE69734860T2 (de) 1996-08-26 1997-08-26 Herstellungsverfahren von integrierten Dünnfilm-Solarzellen

Country Status (4)

Country Link
US (1) US5956572A (de)
EP (1) EP0827212B1 (de)
JP (1) JP3510740B2 (de)
DE (1) DE69734860T2 (de)

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JP3436858B2 (ja) * 1997-02-27 2003-08-18 シャープ株式会社 薄膜太陽電池の製造方法
WO1999025029A1 (en) * 1997-11-10 1999-05-20 Kaneka Corporation Method of producing silicon thin-film photoelectric transducer and plasma cvd apparatus used for the method
EP2835834A3 (de) * 1999-08-25 2015-06-10 Kaneka Corporation Photoelektrisches Dünnschichtumwandlungsmodul und Verfahren zur Herstellung davon
US20050103624A1 (en) 1999-10-04 2005-05-19 Bhullar Raghbir S. Biosensor and method of making
US6645359B1 (en) * 2000-10-06 2003-11-11 Roche Diagnostics Corporation Biosensor
US6662439B1 (en) 1999-10-04 2003-12-16 Roche Diagnostics Corporation Laser defined features for patterned laminates and electrodes
US7073246B2 (en) * 1999-10-04 2006-07-11 Roche Diagnostics Operations, Inc. Method of making a biosensor
EP1104030A3 (de) * 1999-11-29 2001-09-05 SANYO ELECTRIC Co., Ltd. Herstellungsverfahren für ein photovoltaisches Bauelement
US6540890B1 (en) * 2000-11-01 2003-04-01 Roche Diagnostics Corporation Biosensor
US6559411B2 (en) 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
US6814844B2 (en) * 2001-08-29 2004-11-09 Roche Diagnostics Corporation Biosensor with code pattern
WO2003036657A1 (en) 2001-10-19 2003-05-01 Asahi Glass Company, Limited Substrate with transparent conductive oxide film and production method therefor, and photoelectric conversion element
US6866758B2 (en) * 2002-03-21 2005-03-15 Roche Diagnostics Corporation Biosensor
WO2004113917A2 (en) 2003-06-20 2004-12-29 Roche Diagnostics Gmbh Method and reagent for producing narrow, homogenous reagent strips
CN100361308C (zh) * 2004-07-26 2008-01-09 电子科技大学 一种单片光电集成回路的制作方法
US7049844B1 (en) * 2004-12-08 2006-05-23 Kla-Tencor Technologies Corporation Test patterns for optical measurements on multiple binary gratings
KR100964153B1 (ko) * 2006-11-22 2010-06-17 엘지전자 주식회사 태양전지의 제조방법 및 그에 의해 제조되는 태양전지
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GB2446838A (en) * 2007-02-20 2008-08-27 David John Ruchat Photovoltaic device and manufacturing method
WO2009027476A2 (en) * 2007-08-30 2009-03-05 Oc Oerlikon Balzers Ag A thin-film solar cell system and method and apparatus for manufacturing a thin-film solar cell
US20090077804A1 (en) 2007-08-31 2009-03-26 Applied Materials, Inc. Production line module for forming multiple sized photovoltaic devices
DE102007043943B4 (de) 2007-09-14 2010-04-29 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Beschichtung von Substraten mit dotierten Schichten
US20090104342A1 (en) * 2007-10-22 2009-04-23 Applied Materials, Inc. Photovoltaic fabrication process monitoring and control using diagnostic devices
US20090102502A1 (en) * 2007-10-22 2009-04-23 Michel Ranjit Frei Process testers and testing methodology for thin-film photovoltaic devices
WO2009129030A2 (en) * 2008-04-14 2009-10-22 Applied Materials, Inc. Solar parametric testing module and processes
US7981778B2 (en) * 2009-07-22 2011-07-19 Applied Materials, Inc. Directional solid phase crystallization of thin amorphous silicon for solar cell applications
JP2012501249A (ja) * 2008-08-26 2012-01-19 アプライド マテリアルズ インコーポレイテッド レーザー材料除去方法および装置
US7956337B2 (en) * 2008-09-09 2011-06-07 Applied Materials, Inc. Scribe process monitoring methodology
DE102008051730A1 (de) 2008-10-15 2010-04-22 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Transparenter Gegenstand mit einem örtlich begrenzten, strukturierten, elektrisch beheizbaren, transparenten Bereich, Verfahren zu seiner Herstellung und seine Verwendung
ES2687772T3 (es) 2009-01-16 2018-10-29 Saint-Gobain Glass France Antena plana transparente, procedimiento para su fabricación y su utilización
US20100190275A1 (en) * 2009-01-29 2010-07-29 Applied Materials, Inc. Scribing device and method of producing a thin-film solar cell module
US20100294349A1 (en) * 2009-05-20 2010-11-25 Uma Srinivasan Back contact solar cells with effective and efficient designs and corresponding patterning processes
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JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
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US20110065227A1 (en) * 2009-09-15 2011-03-17 Applied Materials, Inc. Common laser module for a photovoltaic production line
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Also Published As

Publication number Publication date
US5956572A (en) 1999-09-21
DE69734860T2 (de) 2006-08-17
EP0827212A2 (de) 1998-03-04
JPH1070295A (ja) 1998-03-10
JP3510740B2 (ja) 2004-03-29
EP0827212B1 (de) 2005-12-14
EP0827212A3 (de) 1999-08-18

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee