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DE69627971D1 - Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung - Google Patents

Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung

Info

Publication number
DE69627971D1
DE69627971D1 DE69627971T DE69627971T DE69627971D1 DE 69627971 D1 DE69627971 D1 DE 69627971D1 DE 69627971 T DE69627971 T DE 69627971T DE 69627971 T DE69627971 T DE 69627971T DE 69627971 D1 DE69627971 D1 DE 69627971D1
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
printed circuit
copper foil
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69627971T
Other languages
English (en)
Other versions
DE69627971T2 (de
Inventor
Muneharu Ohara
Yutaka Hirasawa
Tomohiro Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69627971D1 publication Critical patent/DE69627971D1/de
Publication of DE69627971T2 publication Critical patent/DE69627971T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69627971T 1995-12-06 1996-11-06 Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung Expired - Lifetime DE69627971T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34434495A JP3281783B2 (ja) 1995-12-06 1995-12-06 プリント配線板用銅箔、その製造法及び電解装置
JP34434495 1995-12-06

Publications (2)

Publication Number Publication Date
DE69627971D1 true DE69627971D1 (de) 2003-06-12
DE69627971T2 DE69627971T2 (de) 2004-05-19

Family

ID=18368516

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69627971T Expired - Lifetime DE69627971T2 (de) 1995-12-06 1996-11-06 Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung

Country Status (8)

Country Link
US (2) US5833819A (de)
EP (1) EP0778361B1 (de)
JP (1) JP3281783B2 (de)
KR (1) KR100195603B1 (de)
CN (1) CN1113111C (de)
DE (1) DE69627971T2 (de)
MY (1) MY119378A (de)
TW (1) TW370578B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
JP3742144B2 (ja) * 1996-05-08 2006-02-01 ソニー株式会社 非水電解液二次電池及び非水電解液二次電池用の平面状集電体
US6183607B1 (en) * 1999-06-22 2001-02-06 Ga-Tek Inc. Anode structure for manufacture of metallic foil
JP3458781B2 (ja) * 1999-07-06 2003-10-20 ダイソー株式会社 金属箔の製造方法
US6270648B1 (en) * 1999-10-22 2001-08-07 Yates Foil Usa, Inc. Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
JP4632272B2 (ja) * 2000-01-06 2011-02-16 日立マクセル株式会社 リチウム二次電池および電解銅箔
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
CN1301046C (zh) * 2002-05-13 2007-02-14 三井金属鉱业株式会社 膜上芯片用软性印刷线路板
US20060147742A1 (en) * 2003-02-04 2006-07-06 Akira Matsuda Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
JP5386852B2 (ja) 2008-05-07 2014-01-15 株式会社リコー 積層構造体、半導体装置、積層構造体の製造方法及び半導体装置の製造方法
JP5116047B2 (ja) * 2010-03-09 2013-01-09 日立マクセルエナジー株式会社 リチウム二次電池および電解銅箔
JP2012107266A (ja) * 2010-11-15 2012-06-07 Jx Nippon Mining & Metals Corp 電解銅箔の製造方法及び製造装置
CN102534696B (zh) * 2011-11-21 2015-05-27 灵宝华鑫铜箔有限责任公司 一种改进型生箔机
JP5329697B1 (ja) * 2012-05-14 2013-10-30 Ｊｘ日鉱日石金属株式会社 ２次電池集電体用電解銅箔
JP5329696B1 (ja) * 2012-05-14 2013-10-30 Ｊｘ日鉱日石金属株式会社 ２次電池集電体用電解銅箔
TWI515342B (zh) * 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
KR101502373B1 (ko) * 2013-10-14 2015-03-16 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
KR101478464B1 (ko) * 2013-10-14 2015-01-02 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
KR101449342B1 (ko) * 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
US9899683B2 (en) * 2015-03-06 2018-02-20 Iljin Materials Co., Ltd. Electrolytic copper foil, electric component and battery including the same
KR102136784B1 (ko) 2015-07-24 2020-07-22 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6190980B2 (ja) 2015-09-25 2017-08-30 古河電気工業株式会社 電解銅箔、その電解銅箔を用いた各種製品
CN108649183B (zh) * 2018-05-14 2021-01-22 山东金宝电子股份有限公司 一种锂离子电池负极集流体用微孔铜箔的制备方法
CN112301382B (zh) * 2020-09-07 2021-11-26 浙江花园新能源股份有限公司 一种高延展性低轮廓电解铜箔的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483113A (en) * 1966-02-11 1969-12-09 United States Steel Corp Apparatus for continuously electroplating a metallic strip
US3567595A (en) * 1967-09-25 1971-03-02 Circuit Foil Corp Electrolytic plating method
US3901785A (en) * 1972-05-09 1975-08-26 Antonina Vladimiro Buzhinskaya Apparatus for producing a metal band
DE3688840T2 (de) * 1985-12-24 1993-11-25 Gould Inc Verfahren und vorrichtung zur elektroplattierung eines kupferblattes.
JPS63282288A (ja) * 1987-05-15 1988-11-18 Furukawa Saakitsuto Fuoiru Kk 電解金属箔の製造方法とそれに用いる装置
JPH01198495A (ja) 1988-02-02 1989-08-10 Furukawa Saakitsuto Fuoiru Kk 電解金属箔の製造方法とそれに用いる装置
JPH031391A (ja) 1989-05-29 1991-01-08 Nec Ibaraki Ltd 磁気ディスク装置
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5326455A (en) * 1990-12-19 1994-07-05 Nikko Gould Foil Co., Ltd. Method of producing electrolytic copper foil and apparatus for producing same
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置

Also Published As

Publication number Publication date
MY119378A (en) 2005-05-31
EP0778361B1 (de) 2003-05-07
TW370578B (en) 1999-09-21
KR100195603B1 (ko) 1999-06-15
US5833819A (en) 1998-11-10
DE69627971T2 (de) 2004-05-19
US5997710A (en) 1999-12-07
EP0778361A3 (de) 1997-06-18
JPH09157883A (ja) 1997-06-17
CN1156190A (zh) 1997-08-06
KR970043311A (ko) 1997-07-26
CN1113111C (zh) 2003-07-02
JP3281783B2 (ja) 2002-05-13
EP0778361A2 (de) 1997-06-11

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