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DE69610970D1 - Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren - Google Patents

Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren

Info

Publication number
DE69610970D1
DE69610970D1 DE69610970T DE69610970T DE69610970D1 DE 69610970 D1 DE69610970 D1 DE 69610970D1 DE 69610970 T DE69610970 T DE 69610970T DE 69610970 T DE69610970 T DE 69610970T DE 69610970 D1 DE69610970 D1 DE 69610970D1
Authority
DE
Germany
Prior art keywords
production process
semiconductor component
bipolar structure
bipolar
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69610970T
Other languages
English (en)
Other versions
DE69610970T2 (de
Inventor
Hideki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69610970D1 publication Critical patent/DE69610970D1/de
Publication of DE69610970T2 publication Critical patent/DE69610970T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185Joining of semiconductor bodies for junction formation
    • H01L21/187Joining of semiconductor bodies for junction formation by direct bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
DE69610970T 1995-12-11 1996-07-10 Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren Expired - Fee Related DE69610970T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32189895A JP3325752B2 (ja) 1995-12-11 1995-12-11 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE69610970D1 true DE69610970D1 (de) 2000-12-21
DE69610970T2 DE69610970T2 (de) 2001-06-28

Family

ID=18137642

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610970T Expired - Fee Related DE69610970T2 (de) 1995-12-11 1996-07-10 Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren

Country Status (4)

Country Link
EP (1) EP0779662B1 (de)
JP (1) JP3325752B2 (de)
KR (1) KR100221800B1 (de)
DE (1) DE69610970T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239466B1 (en) 1998-12-04 2001-05-29 General Electric Company Insulated gate bipolar transistor for zero-voltage switching
DE10001128C1 (de) * 2000-01-13 2001-09-27 Infineon Technologies Ag Halbleiterbauelement
JP4904625B2 (ja) * 2001-02-14 2012-03-28 富士電機株式会社 半導体装置
DE10207522B4 (de) 2001-02-23 2018-08-02 Fuji Electric Co., Ltd. Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102004005084B4 (de) 2004-02-02 2013-03-14 Infineon Technologies Ag Halbleiterbauelement
JP2005354031A (ja) * 2004-05-13 2005-12-22 Mitsubishi Electric Corp 半導体装置
JP4575713B2 (ja) * 2004-05-31 2010-11-04 三菱電機株式会社 絶縁ゲート型半導体装置
JP2006173297A (ja) * 2004-12-15 2006-06-29 Denso Corp Igbt
JP2007184486A (ja) * 2006-01-10 2007-07-19 Denso Corp 半導体装置
JP5036327B2 (ja) * 2007-01-23 2012-09-26 三菱電機株式会社 半導体装置及びその製造方法
JP5286706B2 (ja) 2007-07-10 2013-09-11 三菱電機株式会社 電力用半導体装置とその製造方法
JP5609087B2 (ja) * 2009-12-04 2014-10-22 富士電機株式会社 内燃機関点火装置用半導体装置
JP6092760B2 (ja) * 2013-12-05 2017-03-08 株式会社豊田中央研究所 縦型半導体装置
JP6667798B2 (ja) * 2016-01-29 2020-03-18 サンケン電気株式会社 半導体装置
JP2017188569A (ja) 2016-04-06 2017-10-12 三菱電機株式会社 半導体装置およびその製造方法
CN110571264B (zh) * 2019-09-17 2023-03-24 重庆邮电大学 一种具有多通道电流栓的sa-ligbt器件
JPWO2023224059A1 (de) * 2022-05-18 2023-11-23

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219963A (ja) * 1983-05-30 1984-12-11 Meidensha Electric Mfg Co Ltd ゲ−トタ−ンオフサイリスタ
JPH01235272A (ja) * 1988-03-15 1989-09-20 Matsushita Electric Works Ltd 半導体装置
EP0398120B1 (de) * 1989-05-18 1993-10-13 Asea Brown Boveri Ag Halbleiterbauelement
JP3081739B2 (ja) * 1992-10-20 2000-08-28 三菱電機株式会社 絶縁ゲート型半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP0779662B1 (de) 2000-11-15
KR970053278A (ko) 1997-07-31
JP3325752B2 (ja) 2002-09-17
KR100221800B1 (ko) 1999-10-01
EP0779662A3 (de) 1997-11-05
JPH09162398A (ja) 1997-06-20
DE69610970T2 (de) 2001-06-28
EP0779662A2 (de) 1997-06-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee