DE69610970D1 - Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren - Google Patents
Halbleiterbauelement mit Bipolarstruktur und dessen HerstellungsverfahrenInfo
- Publication number
- DE69610970D1 DE69610970D1 DE69610970T DE69610970T DE69610970D1 DE 69610970 D1 DE69610970 D1 DE 69610970D1 DE 69610970 T DE69610970 T DE 69610970T DE 69610970 T DE69610970 T DE 69610970T DE 69610970 D1 DE69610970 D1 DE 69610970D1
- Authority
- DE
- Germany
- Prior art keywords
- production process
- semiconductor component
- bipolar structure
- bipolar
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
- H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32189895A JP3325752B2 (ja) | 1995-12-11 | 1995-12-11 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69610970D1 true DE69610970D1 (de) | 2000-12-21 |
DE69610970T2 DE69610970T2 (de) | 2001-06-28 |
Family
ID=18137642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69610970T Expired - Fee Related DE69610970T2 (de) | 1995-12-11 | 1996-07-10 | Halbleiterbauelement mit Bipolarstruktur und dessen Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0779662B1 (de) |
JP (1) | JP3325752B2 (de) |
KR (1) | KR100221800B1 (de) |
DE (1) | DE69610970T2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6239466B1 (en) | 1998-12-04 | 2001-05-29 | General Electric Company | Insulated gate bipolar transistor for zero-voltage switching |
DE10001128C1 (de) * | 2000-01-13 | 2001-09-27 | Infineon Technologies Ag | Halbleiterbauelement |
JP4904625B2 (ja) * | 2001-02-14 | 2012-03-28 | 富士電機株式会社 | 半導体装置 |
DE10207522B4 (de) | 2001-02-23 | 2018-08-02 | Fuji Electric Co., Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
DE102004005084B4 (de) | 2004-02-02 | 2013-03-14 | Infineon Technologies Ag | Halbleiterbauelement |
JP2005354031A (ja) * | 2004-05-13 | 2005-12-22 | Mitsubishi Electric Corp | 半導体装置 |
JP4575713B2 (ja) * | 2004-05-31 | 2010-11-04 | 三菱電機株式会社 | 絶縁ゲート型半導体装置 |
JP2006173297A (ja) * | 2004-12-15 | 2006-06-29 | Denso Corp | Igbt |
JP2007184486A (ja) * | 2006-01-10 | 2007-07-19 | Denso Corp | 半導体装置 |
JP5036327B2 (ja) * | 2007-01-23 | 2012-09-26 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP5286706B2 (ja) | 2007-07-10 | 2013-09-11 | 三菱電機株式会社 | 電力用半導体装置とその製造方法 |
JP5609087B2 (ja) * | 2009-12-04 | 2014-10-22 | 富士電機株式会社 | 内燃機関点火装置用半導体装置 |
JP6092760B2 (ja) * | 2013-12-05 | 2017-03-08 | 株式会社豊田中央研究所 | 縦型半導体装置 |
JP6667798B2 (ja) * | 2016-01-29 | 2020-03-18 | サンケン電気株式会社 | 半導体装置 |
JP2017188569A (ja) | 2016-04-06 | 2017-10-12 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
CN110571264B (zh) * | 2019-09-17 | 2023-03-24 | 重庆邮电大学 | 一种具有多通道电流栓的sa-ligbt器件 |
JPWO2023224059A1 (de) * | 2022-05-18 | 2023-11-23 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219963A (ja) * | 1983-05-30 | 1984-12-11 | Meidensha Electric Mfg Co Ltd | ゲ−トタ−ンオフサイリスタ |
JPH01235272A (ja) * | 1988-03-15 | 1989-09-20 | Matsushita Electric Works Ltd | 半導体装置 |
EP0398120B1 (de) * | 1989-05-18 | 1993-10-13 | Asea Brown Boveri Ag | Halbleiterbauelement |
JP3081739B2 (ja) * | 1992-10-20 | 2000-08-28 | 三菱電機株式会社 | 絶縁ゲート型半導体装置及びその製造方法 |
-
1995
- 1995-12-11 JP JP32189895A patent/JP3325752B2/ja not_active Expired - Lifetime
-
1996
- 1996-07-10 EP EP96111115A patent/EP0779662B1/de not_active Expired - Lifetime
- 1996-07-10 DE DE69610970T patent/DE69610970T2/de not_active Expired - Fee Related
- 1996-08-02 KR KR1019960032362A patent/KR100221800B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0779662B1 (de) | 2000-11-15 |
KR970053278A (ko) | 1997-07-31 |
JP3325752B2 (ja) | 2002-09-17 |
KR100221800B1 (ko) | 1999-10-01 |
EP0779662A3 (de) | 1997-11-05 |
JPH09162398A (ja) | 1997-06-20 |
DE69610970T2 (de) | 2001-06-28 |
EP0779662A2 (de) | 1997-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |