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DE69108838D1 - Vorrichtung zum Ätzen von Plättchen. - Google Patents

Vorrichtung zum Ätzen von Plättchen.

Info

Publication number
DE69108838D1
DE69108838D1 DE69108838T DE69108838T DE69108838D1 DE 69108838 D1 DE69108838 D1 DE 69108838D1 DE 69108838 T DE69108838 T DE 69108838T DE 69108838 T DE69108838 T DE 69108838T DE 69108838 D1 DE69108838 D1 DE 69108838D1
Authority
DE
Germany
Prior art keywords
platelets
etching
etching platelets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69108838T
Other languages
English (en)
Other versions
DE69108838T2 (de
Inventor
Tatsuo Enomoto
Michito Sato
Shigeyoshi Nezu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69108838D1 publication Critical patent/DE69108838D1/de
Publication of DE69108838T2 publication Critical patent/DE69108838T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
DE69108838T 1990-10-16 1991-10-15 Vorrichtung zum Ätzen von Plättchen. Expired - Fee Related DE69108838T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27518690A JPH0785471B2 (ja) 1990-10-16 1990-10-16 エッチング装置

Publications (2)

Publication Number Publication Date
DE69108838D1 true DE69108838D1 (de) 1995-05-18
DE69108838T2 DE69108838T2 (de) 1995-12-14

Family

ID=17551882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69108838T Expired - Fee Related DE69108838T2 (de) 1990-10-16 1991-10-15 Vorrichtung zum Ätzen von Plättchen.

Country Status (4)

Country Link
US (1) US5211794A (de)
EP (1) EP0481723B1 (de)
JP (1) JPH0785471B2 (de)
DE (1) DE69108838T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298111A (en) * 1991-05-31 1994-03-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer transfer apparatus and a method for transferring wafers and an etching drum
US5246528A (en) * 1991-05-31 1993-09-21 Shin-Etsu Handotai Co., Ltd. Automatic wafer etching method and apparatus
DE4305748A1 (de) * 1993-02-25 1994-09-01 Leybold Ag Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer
US5340437A (en) * 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers
DE69428986D1 (de) * 1994-07-29 2001-12-13 St Microelectronics Srl Verfahren zur Behandlung von Halbleiterscheiben mit Flüssigkeiten
US5593505A (en) * 1995-04-19 1997-01-14 Memc Electronic Materials, Inc. Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
US5880479A (en) * 1996-10-25 1999-03-09 Vanguard International Semiconductor Corporation Wafer aligner apparatus using different diameter rollers
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
JPH10223585A (ja) 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6457929B2 (en) 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
JP2005327856A (ja) * 2004-05-13 2005-11-24 Komatsu Electronic Metals Co Ltd 半導体ウェーハのエッチング装置
KR100644054B1 (ko) * 2004-12-29 2006-11-10 동부일렉트로닉스 주식회사 세정 장치 및 게이트 산화막의 전세정 방법
KR20110008068A (ko) * 2008-03-31 2011-01-25 엠이엠씨 일렉트로닉 머티리얼즈, 인크. 실리콘 웨이퍼의 엣지 에칭 방법
US8735261B2 (en) * 2008-11-19 2014-05-27 Memc Electronic Materials, Inc. Method and system for stripping the edge of a semiconductor wafer
US8853054B2 (en) 2012-03-06 2014-10-07 Sunedison Semiconductor Limited Method of manufacturing silicon-on-insulator wafers
EP2973677B1 (de) * 2013-03-15 2022-10-05 Applied Materials, Inc. Substratpositionsausrichter
CN117735846B (zh) * 2023-12-29 2024-09-17 赛德半导体有限公司 一种玻璃蚀刻设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
JPS5433676A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Wafer processing unit
JPS5437581A (en) * 1977-08-30 1979-03-20 Nec Corp Wafer etching device
DE2837611A1 (de) * 1978-08-29 1980-03-20 Bosch Gmbh Robert Vorrichtung zum aetzen von halbleiterscheiben
JPS5928036Y2 (ja) * 1980-07-15 1984-08-14 信越化学工業株式会社 化学エツチング処理装置
JPS58166726A (ja) * 1982-03-29 1983-10-01 Shin Etsu Handotai Co Ltd ウエ−ハエツチング装置
JPS59110782A (ja) * 1982-12-16 1984-06-26 Toshiba Corp エツチング装置
JPS62221128A (ja) * 1986-03-24 1987-09-29 Hitachi Electronics Eng Co Ltd 処理装置

Also Published As

Publication number Publication date
DE69108838T2 (de) 1995-12-14
EP0481723A1 (de) 1992-04-22
JPH0785471B2 (ja) 1995-09-13
JPH04151837A (ja) 1992-05-25
EP0481723B1 (de) 1995-04-12
US5211794A (en) 1993-05-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee