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JPS5437581A - Wafer etching device - Google Patents

Wafer etching device

Info

Publication number
JPS5437581A
JPS5437581A JP10460577A JP10460577A JPS5437581A JP S5437581 A JPS5437581 A JP S5437581A JP 10460577 A JP10460577 A JP 10460577A JP 10460577 A JP10460577 A JP 10460577A JP S5437581 A JPS5437581 A JP S5437581A
Authority
JP
Japan
Prior art keywords
etching device
wafer etching
distortional
attaining
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10460577A
Other languages
Japanese (ja)
Inventor
Tsuneo Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10460577A priority Critical patent/JPS5437581A/en
Publication of JPS5437581A publication Critical patent/JPS5437581A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To obtain a uniform plate thickness with good flatness by removing stains and a distortional layer on the surface, by attaining an etching process while supporting the substrate between rotating impellers.
COPYRIGHT: (C)1979,JPO&Japio
JP10460577A 1977-08-30 1977-08-30 Wafer etching device Pending JPS5437581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10460577A JPS5437581A (en) 1977-08-30 1977-08-30 Wafer etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10460577A JPS5437581A (en) 1977-08-30 1977-08-30 Wafer etching device

Publications (1)

Publication Number Publication Date
JPS5437581A true JPS5437581A (en) 1979-03-20

Family

ID=14385043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10460577A Pending JPS5437581A (en) 1977-08-30 1977-08-30 Wafer etching device

Country Status (1)

Country Link
JP (1) JPS5437581A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728624A (en) * 1980-07-25 1982-02-16 Mitsubishi Heavy Ind Ltd Method for detecting phase of turning angle of back-up roll in rolling mill
US5211794A (en) * 1990-10-16 1993-05-18 Shin-Etsu Handotai Co., Ltd. Wafer etching apparatus
US5236548A (en) * 1991-02-01 1993-08-17 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Magazine for holding disk-type workpieces in particular semiconductor wafers during wet-chemical surface treatment in liquid baths
US5429705A (en) * 1993-02-25 1995-07-04 Leybold Aktiengesellschaft Apparatus for coating and/or etching substrates in a vacuum chamber

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728624A (en) * 1980-07-25 1982-02-16 Mitsubishi Heavy Ind Ltd Method for detecting phase of turning angle of back-up roll in rolling mill
US5211794A (en) * 1990-10-16 1993-05-18 Shin-Etsu Handotai Co., Ltd. Wafer etching apparatus
US5236548A (en) * 1991-02-01 1993-08-17 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Magazine for holding disk-type workpieces in particular semiconductor wafers during wet-chemical surface treatment in liquid baths
US5429705A (en) * 1993-02-25 1995-07-04 Leybold Aktiengesellschaft Apparatus for coating and/or etching substrates in a vacuum chamber

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